Platform for Heterogeneous Integration of NEMS on ICs

Project Information

MaMs2

Grant agreement ID: 680884

DOI

10.3030/680884

Project closed

EC signature date 26 June 2015

Start date 1 July 2015

End date 31 December 2016

Funded under

• EXCELLENT SCIENCE - European Research Council (ERC)

Total cost

€ 150 000,00

EU contribution

€ 150 000,00

Coordinated by

KUNGLIGA TEKNISKA HOEGSKOLAN
Sweden

CORDIS provides links to public deliverables and publications of HORIZON projects.

Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .

Publications

Peer reviewed articles (1)

Wafer-Level Vacuum Packaging Enabled by Plastic Deformation and Low-Temperature Welding of Copper Sealing Rings With a Small Footprint

Author(s): X Wang, SJ Bleiker, M Antelius, G Stemme, F Niklaus
Published in: Journal of Microelectromechanical Systems, Issue PP, 99, 2017, Page(s) 1-9, ISSN 1057-7157
Publisher: Institute of Electrical and Electronics Engineers
DOI: 10.1109/JMEMS.2017.2654510

Conference proceedings (1)

Heterogeneous 3D integration of MOEMS and ICs

Author(s): Frank Niklaus, Andreas C. Fischer
Published in: 2016 International Conference on Optical MEMS and Nanophotonics (OMN), 2016, Page(s) 1-2, ISBN 978-1-5090-1035-6
Publisher: IEEE
DOI: 10.1109/OMN.2016.7565909