Wafer scale Integration of Photonics and Electronics

Leistungen

Future technology iterations will be proposed, aligned to the demonstrator specifications. Actions for achieving the roadmap will be identified.

Communication kit version 3

The project will provide a communication kit about the project (narrative text, photographs, slides and any other suitable communication material, complemented with copyright licences for the European Commission and for Photonics21). The narrative text will target a general audience and focus on the technical achievements as well as on the economical and societal benefits for the EU. This communication kit will be provided to the Commission at the beginning of the project with updates at mid-term and at the end.

Communication kit version 1

The project will provide a communication kit about the project (narrative text, photographs, slides and any other suitable communication material, complemented with copyright licences for the European Commission and for Photonics21). The narrative text will target a general audience and focus on the technical achievements as well as on the economical and societal benefits for the EU. This communication kit will be provided to the Commission at the beginning of the project with updates at mid-term and at the end.

Technology benchmarking

Performance projections for wafer bonding will be made. Comparison will be made against e.g. wire-bond, Silicon photonics with die attached InP gain-elements, flip-chip, through wafer vias, and wafer bonding with a focus on scalability on a 2020-2025 time horizon.

Communication kit version 2

The project will provide a communication kit about the project (narrative text, photographs, slides and any other suitable communication material, complemented with copyright licences for the European Commission and for Photonics21). The narrative text will target a general audience and focus on the technical achievements as well as on the economical and societal benefits for the EU. This communication kit will be provided to the Commission at the beginning of the project with updates at mid-term and at the end.

Photonic chip performance

The performance of the PICs will be assessed against demonstrator requirements, identifying any design revisions and data for library building block creation.

Public launch and website

Public presentation document launched on the project website public. A coherent interface will be available on the regularly-updated project website. This will be linked with relevant initiatives (e.g. jeppix.eu and the relevant user community.

Exploitation plan: First release

Mechanisms to exploit the successfully developed processes to industry will be documented. A route to the first multi-project wafer for new market segments shortly after the completion of the project will be proposed.

Industrialisation plan

Strategies for industrialisation will include handling of IP blocks for codesigned components, technology know-how, licensing models and agreements.

Exploitation plan: Second release

The exploitation plan will be revised in terms of promising sectors in the light of first period results

Veröffentlichungen

Optical coupler concept for wafer scale fabrication of adhesively bonded photonic end electronic circuits

Autoren: M. Spiegelberg, A.D La Porta, B.J. Offrein, V.M. Dolores Calzadilla, J.J.G.M. van der Tol, K.A. Williams
Veröffentlicht in: Proceedings of the 21st Annual Symposium of the IEEE Photonics Society Benelux Chapter, November 17-18, 2016, Gent, Belgium, 2016, Seite(n) 215-218, ISBN 978-9-0825-0050-9
Herausgeber: IEEE

Scalable and broadband silicon photonics chip to fiber optical interface using polymer waveguides

Autoren: Antonio La Porta, Roger Dangel, Daniel Jubin, Norbert Meier, Folkert Horst, Bert Jan Offrein
Veröffentlicht in: 2017 IEEE Optical Interconnects Conference (OI), 2017, Seite(n) 13-14, ISBN 978-1-5090-5016-1
Herausgeber: IEEE
DOI: 10.1109/OIC.2017.7965507

Leistungen

Veröffentlichungen

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