Roadmap
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Future technology iterations will be proposed, aligned to the demonstrator specifications. Actions for achieving the roadmap will be identified.
Communication kit version 3
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The project will provide a communication kit about the project (narrative text, photographs, slides and any other suitable communication material, complemented with copyright licences for the European Commission and for Photonics21). The narrative text will target a general audience and focus on the technical achievements as well as on the economical and societal benefits for the EU. This communication kit will be provided to the Commission at the beginning of the project with updates at mid-term and at the end.
Communication kit version 1
(odnośnik otworzy się w nowym oknie)
The project will provide a communication kit about the project (narrative text, photographs, slides and any other suitable communication material, complemented with copyright licences for the European Commission and for Photonics21). The narrative text will target a general audience and focus on the technical achievements as well as on the economical and societal benefits for the EU. This communication kit will be provided to the Commission at the beginning of the project with updates at mid-term and at the end.
Technology benchmarking
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Performance projections for wafer bonding will be made. Comparison will be made against e.g. wire-bond, Silicon photonics with die attached InP gain-elements, flip-chip, through wafer vias, and wafer bonding with a focus on scalability on a 2020-2025 time horizon.
Communication kit version 2
(odnośnik otworzy się w nowym oknie)
The project will provide a communication kit about the project (narrative text, photographs, slides and any other suitable communication material, complemented with copyright licences for the European Commission and for Photonics21). The narrative text will target a general audience and focus on the technical achievements as well as on the economical and societal benefits for the EU. This communication kit will be provided to the Commission at the beginning of the project with updates at mid-term and at the end.
Photonic chip performance
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The performance of the PICs will be assessed against demonstrator requirements, identifying any design revisions and data for library building block creation.
