GaN densily integrated with Si-CMOS for reliable, cost effective high frequency power delivery systems

Información del proyecto

GaNonCMOS

Identificador del acuerdo de subvención: 721107

DOI

10.3030/721107

Proyecto cerrado

Fecha de la firma de la CE 9 Noviembre 2016

Fecha de inicio 1 Enero 2017

Fecha de finalización 30 Junio 2021

Financiado con arreglo a

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Advanced materials

Coste total

€ 7 428 885,75

Aportación de la UE

€ 6 246 064,50

Coordinado por

KATHOLIEKE UNIVERSITEIT LEUVEN
Belgium

CORDIS proporciona enlaces a los documentos públicos y las publicaciones de los proyectos de los programas marco HORIZONTE.

Los enlaces a los documentos y las publicaciones de los proyectos del Séptimo Programa Marco, así como los enlaces a algunos tipos de resultados específicos, como conjuntos de datos y «software», se obtienen dinámicamente de OpenAIRE .

Resultado final

Documents, reports (1)

Dissemination, Communication and Exploitation campaigns report

The report will describe the dissemination, communication and exploitation campaigns throughout the project duration.

Publicaciones

Peer reviewed articles (3)

High Q -Factor PCB Embedded Flip-Chip Inductors With Multilayer CZTB Magnetic Sheet for Power Supply in Package (PwrSiP)

Autores: Declan Jordan, Guannan Wei, Liang Ye, Daniel Lordan, Pranay Podder, Ansar Masood, Kenneth Rodgers, Cian O Mathuna, Paul McCloskey
Publicado en: IEEE Journal of Emerging and Selected Topics in Power Electronics, Edición 9/1, 2021, Página(s) 102-110, ISSN 2168-6785
Editor: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/jestpe.2020.2983125

Characterization and enhancement of magnetic performance of electrodeposited Ni45Fe55 on PCB for high frequency application

Autores: Z. Ghaferi, P. McCloskey
Publicado en: Journal of Magnetism and Magnetic Materials, Edición 505, 2020, Página(s) 166708, ISSN 0304-8853
Editor: Elsevier BV
DOI: 10.1016/j.jmmm.2020.166708

Printing GaN HEMTs onto silicon CMOS

Autores: Stefan Eisenbrandt and Ralf Lerner
Publicado en: Compound Semiconductor Magazine, 2018, ISSN 1096-598X
Editor: Institute of Physics Publishing

Conference proceedings (11)

New Embedded Inductors For Power Converter Applications

Autores: G. Weidinger, H. Stahr, A. Zluc, I. Salkovic, M. Schober, H. Takahashi, G. Weis, Ch. Vockenberger, S. Suchovsky
Publicado en: MiNaPAD, the “Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum”, Edición 16-17 May, 2018, 2018
Editor: MiNaPad

Considerations on the Design Methodology for an Integrated Gate Driver

Autores: N. Fiebig, G. Fischer, P. Ostrovskyy, D. Kissinger
Publicado en: ANALOG 2018; 16th GMM ITG-Symposium, Edición 13-14 September, 2018, 2018, Página(s) 131-135, ISBN 978-3-8007-4754-2
Editor: VDE

Calculation, Simulation and Production of PCB-integrated Inductors with Focus on Fringing Effect

Autores: Gerald Weis and Ivan Salkovic
Publicado en: PCIM Europe 2019, International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 2019, Página(s) 1-5, ISBN 978-3-8007-4938-6
Editor: VDE

High Power Density DC-DC Converters Using Highly Integrated Half-Bridge GaN ICs

Autores: Michael Basler, Stefan Moench, Richard Reiner, Fouad Benkhelifa, Gerald Weidinger, Gerald Weis, Rüdiger Quay, Ingmar Kallfass and Oliver Ambacher
Publicado en: PCIM Europe digital days 2021; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Edición 3-7 May, 2021, 2021, Página(s) 1014-1021, ISBN 978-3-8007-5515-8
Editor: VDE

PCB Embedded Transformer for Isolated DC-DC Power Supplies

Autores: Gerald Weis and Ivan Salkovic
Publicado en: CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 2020, Página(s) 1-5, ISBN 978-3-8007-5225-6
Editor: VDE

PCB embedding of Magnetic Material for Inductor-based Applications

Autores: Gerald Weis, Ivan Salkovic and Gerald Weidinger
Publicado en: International Microelectronics Assembly & Packaging Society (iMAPS), 16th Annual Device Packaging Conference (DPC 2020), Edición 2-5 March, 2020, 2020
Editor: iMAPS

Design of Low-Resistance and Area-Efficient GaN-HEMTs for Low-Voltage Power Applications

Autores: Richard Reiner, Fouad Benkhelifa, Stefan Moench, Michael Basler, Patrick Waltereit, Michael Mikulla, Rüdiger Quay and Oliver Ambacher
Publicado en: PCIM Europe digital days 2021; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Edición 3-7 May, 2021, 2021, Página(s) 401-408, ISBN 978-3-8007-5515-8
Editor: VDE

Qi compliant wireless charger with PCB integrated magnetic material

Autores: Gerald Weis, Ivan Salkovic, Gerald Weidinger, Karl Kirchheimer, Ronald Sekavcnik, Johannes Stahr
Publicado en: 2019 IEEE Wireless Power Transfer Conference (WPTC), Edición 18-21 June 2019, 2019, Página(s) 203-207, ISBN 978-1-7281-0705-9
Editor: IEEE
DOI: 10.1109/wptc45513.2019.9055647

PCB Embedded Toroidal Inductor for 2MHz Point-of-Load Converter

Autores: Ruaidhrí Murphy, Zoran Pavlovic, Paul McCloskey, Cian Ó Mathúna, Séamus O’Driscoll and Gerald Weidinger
Publicado en: CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, Edición 24-26 March 2020, 2020, Página(s) 280-285, ISBN 978-3-8007-5225-6
Editor: VDE

GaNonCMOS H2020 Research: Sub-25V Switch Technologies for use in PwrSiP and PwrSoC

Autores: Odhran Reidy and Séamus O’Driscoll
Publicado en: MCCI Annual Meeting 2017, Edición 2017, 2017
Editor: MCCI

Thin-film magnetics-on-silicon integrated transformer for isolated power conversion applications

Autores: Zoran Pavlovic, Pranay Podder, Dermot Dobbyn, Ansar Masood, Guannan Wei, Daniel Lordan, Paul McCloskey, Cian O’Mathuna and Séamus O’Driscoll
Publicado en: CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, Edición 24-26 March, 2020, 2020, Página(s) 264-268, ISBN 978-3-8007-5225-6
Editor: VDE