GaN densily integrated with Si-CMOS for reliable, cost effective high frequency power delivery systems

Informazioni relative al progetto

GaNonCMOS

ID dell’accordo di sovvenzione: 721107

DOI

10.3030/721107

Progetto chiuso

Data della firma CE 9 Novembre 2016

Data di avvio 1 Gennaio 2017

Data di completamento 30 Giugno 2021

Finanziato da

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Advanced materials

Costo totale

€ 7 428 885,75

Contributo UE

€ 6 246 064,50

Coordinato da

KATHOLIEKE UNIVERSITEIT LEUVEN
Belgium

CORDIS fornisce collegamenti ai risultati finali pubblici e alle pubblicazioni dei progetti ORIZZONTE.

I link ai risultati e alle pubblicazioni dei progetti del 7° PQ, così come i link ad alcuni tipi di risultati specifici come dataset e software, sono recuperati dinamicamente da .OpenAIRE .

Risultati finali

Documents, reports (1)

Dissemination, Communication and Exploitation campaigns report

The report will describe the dissemination, communication and exploitation campaigns throughout the project duration.

Pubblicazioni

Peer reviewed articles (3)

High Q -Factor PCB Embedded Flip-Chip Inductors With Multilayer CZTB Magnetic Sheet for Power Supply in Package (PwrSiP)

Autori: Declan Jordan, Guannan Wei, Liang Ye, Daniel Lordan, Pranay Podder, Ansar Masood, Kenneth Rodgers, Cian O Mathuna, Paul McCloskey
Pubblicato in: IEEE Journal of Emerging and Selected Topics in Power Electronics, Numero 9/1, 2021, Pagina/e 102-110, ISSN 2168-6785
Editore: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/jestpe.2020.2983125

Characterization and enhancement of magnetic performance of electrodeposited Ni45Fe55 on PCB for high frequency application

Autori: Z. Ghaferi, P. McCloskey
Pubblicato in: Journal of Magnetism and Magnetic Materials, Numero 505, 2020, Pagina/e 166708, ISSN 0304-8853
Editore: Elsevier BV
DOI: 10.1016/j.jmmm.2020.166708

Printing GaN HEMTs onto silicon CMOS

Autori: Stefan Eisenbrandt and Ralf Lerner
Pubblicato in: Compound Semiconductor Magazine, 2018, ISSN 1096-598X
Editore: Institute of Physics Publishing

Conference proceedings (11)

New Embedded Inductors For Power Converter Applications

Autori: G. Weidinger, H. Stahr, A. Zluc, I. Salkovic, M. Schober, H. Takahashi, G. Weis, Ch. Vockenberger, S. Suchovsky
Pubblicato in: MiNaPAD, the “Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum”, Numero 16-17 May, 2018, 2018
Editore: MiNaPad

Considerations on the Design Methodology for an Integrated Gate Driver

Autori: N. Fiebig, G. Fischer, P. Ostrovskyy, D. Kissinger
Pubblicato in: ANALOG 2018; 16th GMM ITG-Symposium, Numero 13-14 September, 2018, 2018, Pagina/e 131-135, ISBN 978-3-8007-4754-2
Editore: VDE

Calculation, Simulation and Production of PCB-integrated Inductors with Focus on Fringing Effect

Autori: Gerald Weis and Ivan Salkovic
Pubblicato in: PCIM Europe 2019, International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 2019, Pagina/e 1-5, ISBN 978-3-8007-4938-6
Editore: VDE

High Power Density DC-DC Converters Using Highly Integrated Half-Bridge GaN ICs

Autori: Michael Basler, Stefan Moench, Richard Reiner, Fouad Benkhelifa, Gerald Weidinger, Gerald Weis, Rüdiger Quay, Ingmar Kallfass and Oliver Ambacher
Pubblicato in: PCIM Europe digital days 2021; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Numero 3-7 May, 2021, 2021, Pagina/e 1014-1021, ISBN 978-3-8007-5515-8
Editore: VDE

PCB Embedded Transformer for Isolated DC-DC Power Supplies

Autori: Gerald Weis and Ivan Salkovic
Pubblicato in: CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 2020, Pagina/e 1-5, ISBN 978-3-8007-5225-6
Editore: VDE

PCB embedding of Magnetic Material for Inductor-based Applications

Autori: Gerald Weis, Ivan Salkovic and Gerald Weidinger
Pubblicato in: International Microelectronics Assembly & Packaging Society (iMAPS), 16th Annual Device Packaging Conference (DPC 2020), Numero 2-5 March, 2020, 2020
Editore: iMAPS

Design of Low-Resistance and Area-Efficient GaN-HEMTs for Low-Voltage Power Applications

Autori: Richard Reiner, Fouad Benkhelifa, Stefan Moench, Michael Basler, Patrick Waltereit, Michael Mikulla, Rüdiger Quay and Oliver Ambacher
Pubblicato in: PCIM Europe digital days 2021; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Numero 3-7 May, 2021, 2021, Pagina/e 401-408, ISBN 978-3-8007-5515-8
Editore: VDE

Qi compliant wireless charger with PCB integrated magnetic material

Autori: Gerald Weis, Ivan Salkovic, Gerald Weidinger, Karl Kirchheimer, Ronald Sekavcnik, Johannes Stahr
Pubblicato in: 2019 IEEE Wireless Power Transfer Conference (WPTC), Numero 18-21 June 2019, 2019, Pagina/e 203-207, ISBN 978-1-7281-0705-9
Editore: IEEE
DOI: 10.1109/wptc45513.2019.9055647

PCB Embedded Toroidal Inductor for 2MHz Point-of-Load Converter

Autori: Ruaidhrí Murphy, Zoran Pavlovic, Paul McCloskey, Cian Ó Mathúna, Séamus O’Driscoll and Gerald Weidinger
Pubblicato in: CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, Numero 24-26 March 2020, 2020, Pagina/e 280-285, ISBN 978-3-8007-5225-6
Editore: VDE

GaNonCMOS H2020 Research: Sub-25V Switch Technologies for use in PwrSiP and PwrSoC

Autori: Odhran Reidy and Séamus O’Driscoll
Pubblicato in: MCCI Annual Meeting 2017, Numero 2017, 2017
Editore: MCCI

Thin-film magnetics-on-silicon integrated transformer for isolated power conversion applications

Autori: Zoran Pavlovic, Pranay Podder, Dermot Dobbyn, Ansar Masood, Guannan Wei, Daniel Lordan, Paul McCloskey, Cian O’Mathuna and Séamus O’Driscoll
Pubblicato in: CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, Numero 24-26 March, 2020, 2020, Pagina/e 264-268, ISBN 978-3-8007-5225-6
Editore: VDE