300mm Pilot Line for Smart Power and Power Discretes

Informations projet

R3-PowerUP

N° de convention de subvention: 737417

DOI 10.3030/737417

Projet clôturé

Date de signature de la CE 15 Mai 2017

Date de début 1 Novembre 2017

Date de fin 30 Avril 2023

Financé au titre de

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)

Coût total € 180 318 047,50

Contribution de l’UE € 28 046 206,50

Coordonné par

STMICROELECTRONICS SRL
Italy

Livrables

Documents, reports (5)

D6.1.3

Update of project dissemination and communication plan

D6.1.5

Intl Workshop on smart power technology and applications

D6.3.2

Impact paper on relevant standards

D6.1.4

Final dissemination and communication report

D6.1.2

Project dissemination and communication plan

Websites, patent fillings, videos etc. (1)

D6.1.1

Project website online

Publications

Peer reviewed articles (4)

A Fully Programmable eFPGA-Augmented SoC for Smart Power Applications

Auteurs: Francesco Renzini, Claudio Mucci, Davide Rossi, Eleonora Franchi Scarselli, Roberto Canegallo
Publié dans: IEEE Transactions on Circuits and Systems I: Regular Papers, Numéro 67/2, 2020, Page(s) 489-501, ISSN 1549-8328
Éditeur: Institute of Electrical and Electronics Engineers
DOI: 10.1109/tcsi.2019.2930412

Hot-Carrier Degradation in Power LDMOS: Drain Bias Dependence and Lifetime Evaluation

Auteurs: Andrea Natale Tallarico, Susanna Reggiani, Riccardo Depetro, Stefano Manzini, Andrea Mario Torti, Giuseppe Croce, Enrico Sangiorgi, Claudio Fiegna
Publié dans: IEEE Transactions on Electron Devices, Numéro 65/11, 2018, Page(s) 5195-5198, ISSN 0018-9383
Éditeur: Institute of Electrical and Electronics Engineers
DOI: 10.1109/ted.2018.2867650

TCAD investigation on hot-electron injection in new-generation technologies

Auteurs: S. Reggiani, M. Rossetti, A. Gnudi, A.N. Tallarico, A. Molfese, S. Manzini, R. Depetro, G. Croce, E. Sangiorgi, C. Fiegna
Publié dans: Microelectronics Reliability, Numéro 88-90, 2018, Page(s) 1090-1093, ISSN 0026-2714
Éditeur: Elsevier BV
DOI: 10.1016/j.microrel.2018.07.097

Understanding the impact of split-gate LDMOS transistors: Analysis of performance and hot-carrier-induced degradation

Auteurs: Paolo Magnone; Andrea Natale Tallarico; Simone Pistollato; Riccardo Depetro; Giuseppe Croce
Publié dans: Solid-State Electronics, Numéro 108068, 2021, ISSN 0038-1101
Éditeur: Pergamon Press Ltd.
DOI: 10.1016/j.sse.2021.108068

Conference proceedings (9)

Direct SPICE-like 3-D Electrothermal Simulation of Power HEMTs

Auteurs: L. Cernaj, A. Chvala, J. Marek, D. Donova, T. Zavodnik, J. Kozarik, M. Jagelka, M. Donoval
Publié dans: 2018 12th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2018, Page(s) 1-4, ISBN 978-1-5386-7490-1
Éditeur: IEEE
DOI: 10.1109/ASDAM.2018.8544582

Advanced TCAD Simulation of Silver Sintering for Power Modules Integration

Auteurs: P. Pribitny, A. Chvala, J. Marek, D. Donoval
Publié dans: 2018 12th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2018, Page(s) 1-4, ISBN 978-1-5386-7490-1
Éditeur: IEEE
DOI: 10.1109/ASDAM.2018.8544562

Methodology and More Accurate Electrothermal Model for Fast Simulation of Power HEMTs

Auteurs: Aleš Chvála, Juraj Marek, Luboš Černaj, Patrik Príbytný, Alexander Šatka, Steve Stoffels, Niels Posthuma, Stefaan Decoutere, Daniel Donoval
Publié dans: International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 2018, ISBN 978-3-8007-4646-0
Éditeur: VDE

European Activity for Smart Power Electronics and Power Discretes – The R3-PowerUP EU Project

Auteurs: T. Bieniek, G. Janczyk
Publié dans: TechConnect Briefs, Numéro 4, 2018, Page(s) 63 - 66, ISBN 978-0-9988782-1-8
Éditeur: TechConnect Briefs

The Multifunctional 3D Interposer Platform for HPC – Development, Measurements, Design Guidelines

Auteurs: T. Bieniek, G. Janczyk
Publié dans: TechConnect Briefs, Numéro 4, 2018, Page(s) 59 - 62, ISBN 978-0-9988782-1-8
Éditeur: TechConnect Briefs

3D Electrothermal Device/Circuit Simulation of Multifinger Power HEMTs

Auteurs: Ľ. Černaj, A. Chvála, J. Marek, D. Donoval, T. Závodník, J. Kozárik, M. Jagelka, M. Donoval
Publié dans: Advances in Electronic and Photonic Technologies - ADEPT 2018, 2018, Page(s) 73-76, ISBN 978-80-554-1450-8
Éditeur: Institute of Electronics and Photonics, FEI STU in Bratislava

TCAD Simulation Mmethodology for 3-D Electro-Physical and Advanced Thermal Analysis of Power Modules

Auteurs: P. Pribytny, A. Chvala, J. Marek, D. Donoval
Publié dans: Advances in Electronic and Photonic Technologies - ADEPT 2018, 2018, Page(s) 164-167, ISBN 978-80-554-1450-8
Éditeur: Institute of Electronics and Photonics, FEI STU in Bratislava

Analysis and optimization of power module supported by new TCAD simulation methodology for 3-D electro-physical and advanced thermal analysis

Auteurs: P. Pribytny, A. Chvala, J. Marek and D. Donoval
Publié dans: Advances in Electronic and Photonic Technologies - ADEPT 2020, 2020
Éditeur: Faculty of Electrical Engineering and Information Technology, Slovak University of Technology, Bratislava

Full Understanding of Hot Electrons and Hot/Cold Holes in the Degradation of p-channel Power LDMOS Transistors

Auteurs: Andrea Natale Tallarico; Susanna Reggiani; Riccardo Depetro; Giuseppe Croce; Enrico Sangiorgi; Claudio Fiegna
Publié dans: IRPS, Numéro 5, 2020
Éditeur: IEEE
DOI: 10.1109/irps45951.2020.9129112