300mm Pilot Line for Smart Power and Power Discretes

Informazioni relative al progetto

R3-PowerUP

ID dell’accordo di sovvenzione: 737417

DOI 10.3030/737417

Progetto chiuso

Data della firma CE 15 Maggio 2017

Data di avvio 1 Novembre 2017

Data di completamento 30 Aprile 2023

Finanziato da

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)

Costo totale € 180 318 047,50

Contributo UE € 28 046 206,50

Coordinato da

STMICROELECTRONICS SRL
Italy

Risultati finali

Documents, reports (5)

D6.1.3

Update of project dissemination and communication plan

D6.1.5

Intl Workshop on smart power technology and applications

D6.3.2

Impact paper on relevant standards

D6.1.4

Final dissemination and communication report

D6.1.2

Project dissemination and communication plan

Websites, patent fillings, videos etc. (1)

D6.1.1

Project website online

Pubblicazioni

Peer reviewed articles (4)

A Fully Programmable eFPGA-Augmented SoC for Smart Power Applications

Autori: Francesco Renzini, Claudio Mucci, Davide Rossi, Eleonora Franchi Scarselli, Roberto Canegallo
Pubblicato in: IEEE Transactions on Circuits and Systems I: Regular Papers, Numero 67/2, 2020, Pagina/e 489-501, ISSN 1549-8328
Editore: Institute of Electrical and Electronics Engineers
DOI: 10.1109/tcsi.2019.2930412

Hot-Carrier Degradation in Power LDMOS: Drain Bias Dependence and Lifetime Evaluation

Autori: Andrea Natale Tallarico, Susanna Reggiani, Riccardo Depetro, Stefano Manzini, Andrea Mario Torti, Giuseppe Croce, Enrico Sangiorgi, Claudio Fiegna
Pubblicato in: IEEE Transactions on Electron Devices, Numero 65/11, 2018, Pagina/e 5195-5198, ISSN 0018-9383
Editore: Institute of Electrical and Electronics Engineers
DOI: 10.1109/ted.2018.2867650

TCAD investigation on hot-electron injection in new-generation technologies

Autori: S. Reggiani, M. Rossetti, A. Gnudi, A.N. Tallarico, A. Molfese, S. Manzini, R. Depetro, G. Croce, E. Sangiorgi, C. Fiegna
Pubblicato in: Microelectronics Reliability, Numero 88-90, 2018, Pagina/e 1090-1093, ISSN 0026-2714
Editore: Elsevier BV
DOI: 10.1016/j.microrel.2018.07.097

Understanding the impact of split-gate LDMOS transistors: Analysis of performance and hot-carrier-induced degradation

Autori: Paolo Magnone; Andrea Natale Tallarico; Simone Pistollato; Riccardo Depetro; Giuseppe Croce
Pubblicato in: Solid-State Electronics, Numero 108068, 2021, ISSN 0038-1101
Editore: Pergamon Press Ltd.
DOI: 10.1016/j.sse.2021.108068

Conference proceedings (9)

Direct SPICE-like 3-D Electrothermal Simulation of Power HEMTs

Autori: L. Cernaj, A. Chvala, J. Marek, D. Donova, T. Zavodnik, J. Kozarik, M. Jagelka, M. Donoval
Pubblicato in: 2018 12th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2018, Pagina/e 1-4, ISBN 978-1-5386-7490-1
Editore: IEEE
DOI: 10.1109/ASDAM.2018.8544582

Advanced TCAD Simulation of Silver Sintering for Power Modules Integration

Autori: P. Pribitny, A. Chvala, J. Marek, D. Donoval
Pubblicato in: 2018 12th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2018, Pagina/e 1-4, ISBN 978-1-5386-7490-1
Editore: IEEE
DOI: 10.1109/ASDAM.2018.8544562

Methodology and More Accurate Electrothermal Model for Fast Simulation of Power HEMTs

Autori: Aleš Chvála, Juraj Marek, Luboš Černaj, Patrik Príbytný, Alexander Šatka, Steve Stoffels, Niels Posthuma, Stefaan Decoutere, Daniel Donoval
Pubblicato in: International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 2018, ISBN 978-3-8007-4646-0
Editore: VDE

European Activity for Smart Power Electronics and Power Discretes – The R3-PowerUP EU Project

Autori: T. Bieniek, G. Janczyk
Pubblicato in: TechConnect Briefs, Numero 4, 2018, Pagina/e 63 - 66, ISBN 978-0-9988782-1-8
Editore: TechConnect Briefs

The Multifunctional 3D Interposer Platform for HPC – Development, Measurements, Design Guidelines

Autori: T. Bieniek, G. Janczyk
Pubblicato in: TechConnect Briefs, Numero 4, 2018, Pagina/e 59 - 62, ISBN 978-0-9988782-1-8
Editore: TechConnect Briefs

3D Electrothermal Device/Circuit Simulation of Multifinger Power HEMTs

Autori: Ľ. Černaj, A. Chvála, J. Marek, D. Donoval, T. Závodník, J. Kozárik, M. Jagelka, M. Donoval
Pubblicato in: Advances in Electronic and Photonic Technologies - ADEPT 2018, 2018, Pagina/e 73-76, ISBN 978-80-554-1450-8
Editore: Institute of Electronics and Photonics, FEI STU in Bratislava

TCAD Simulation Mmethodology for 3-D Electro-Physical and Advanced Thermal Analysis of Power Modules

Autori: P. Pribytny, A. Chvala, J. Marek, D. Donoval
Pubblicato in: Advances in Electronic and Photonic Technologies - ADEPT 2018, 2018, Pagina/e 164-167, ISBN 978-80-554-1450-8
Editore: Institute of Electronics and Photonics, FEI STU in Bratislava

Analysis and optimization of power module supported by new TCAD simulation methodology for 3-D electro-physical and advanced thermal analysis

Autori: P. Pribytny, A. Chvala, J. Marek and D. Donoval
Pubblicato in: Advances in Electronic and Photonic Technologies - ADEPT 2020, 2020
Editore: Faculty of Electrical Engineering and Information Technology, Slovak University of Technology, Bratislava

Full Understanding of Hot Electrons and Hot/Cold Holes in the Degradation of p-channel Power LDMOS Transistors

Autori: Andrea Natale Tallarico; Susanna Reggiani; Riccardo Depetro; Giuseppe Croce; Enrico Sangiorgi; Claudio Fiegna
Pubblicato in: IRPS, Numero 5, 2020
Editore: IEEE
DOI: 10.1109/irps45951.2020.9129112

Diritti di proprietà intellettuale

Patent (2)

COMBINED TRANSMITTED AND REFLECTED LIGHT IMAGING OF INTERNAL CRACKS IN SEMICONDUCTOR DEVICES

Numero candidatura/pubblicazione: 20 843595
Data: 2020-07-20
Candidato/i: ICOS VISION SYSTEMS NV

COMBINED TRANSMITTED AND REFLECTED LIGHT IMAGING OF INTERNAL CRACKS IN SEMICONDUCTOR DEVICES

Numero candidatura/pubblicazione: 20 843595
Data: 2020-07-20
Candidato/i: ICOS VISION SYSTEMS NV