Periodic Reporting for period 3 - EuroPAT-MASIP (European Packaging, Assembly and Test Pilot for Manufacturing of Advanced System-in-Package)
Periodo di rendicontazione: 2019-09-01 al 2021-06-30
EuroPAT-MASiP will develop:
- Modelling, design and simulation of packaging-related key features and challenges
- The key packaging technologies, equipment and materials
- Heterogeneous (3D) integration of the smart system building blocks
- More than Moore (MtM)
- System in Package (SiP) and
- Test strategy, including metrology, methods and equipment, reliability and failure analysis.
Reinforcing the European semiconductor manufacturing position is reached through the following strategic objectives of EuroPAT-MASIP:
1. Consolidating and extending the leadership in semiconductor processing know-how, by developing and fostering packaging related technological and manufacturing building blocks, serving all the relevant industrial sectors
2. Accelerating the manufacturing uptake of the new technologies and shortening time-to-market by demonstrating the new capabilities in industrial need-based Application Pilots
3. Increasing the competitiveness and global market share of the European semiconductor industry by fostering the competences and capabilities of European semiconductor packaging
AP1: Automotive Combined Inertial Sensor
AP2: Tyre Sensor
AP3: WL Camera for Automotive
AP4: Silicon Photomultiplier
AP5: Radar Chipset
AP6: WLAN Front-End IC
as well as three technology learning vehicles (TLVs):
TLV1: Sensor/MEMS Minituriazation Concept Validation
TLV2: 300mm CMOS Wafer, and Recon Wafer Plasma Dicing
TLV3: Next Generation Fine-Pitch FO-Packaging (RDL-First Approach).
During the second period
- All package specifications for APs were finalized
- New innovative processes, newly developed technologies and developed test strategies were applied
- Packaging activities prior to the building of the first or second functional prototypes is ongoing and
- The first or second prototypes for three APs were prepared
During the final period
-Prototype tests going on or finalized in most of the APs
-Development of processes was executed and success criteria achieved
-A method to create a validated scheme of virtual prototyping of SiP products based on FOWLP technologies was developed (and presented conferences and industry events)
-New test methods and metrology development were achieved
Exploitation and dissemination of the results
-Not all the APs got finalized by the end of the project: however, their development continues by their owners
-Many of the (originally minor) R&D related topics (such those that relate to method or metrology development) actually became more successful than anticipated, resulting in totally new business opportunities to their owners
-Project results have been presented in 25 events, 10 conference articles and 1 journal article
-The project has lead to 3 more ECSEL projects and 8 patent applications
- Universal design for reliability platform for all FO-WLP products (Fan-out wafer level packaging) technologies
- Development and demonstration of technologies and utilization of innovative processes, such as defect free plasma dicing, self-alignment and pick & place processes
- Development of methods, equipment and failure analysis systems, such as High-Resolution X-Ray Computed Tomography.
Most of these have been presented in international conferences (& their related conference articles), full list of them being available on the project website.