EuroPAT-MASIP strives to increase the competitiveness and the global market share of the European semiconductor industry by fostering the competence and capabilities of semiconductor packaging. Steps will be taken to facilitate the collaboration of European semiconductor and MEMS packaging ecosystem to assuring a co-creation network after the project. The project consortium will actively promote the capabilities and the related ecosystem, feeding also to attracting talent and academic education issues. Ultimately, the project results will increase the attractiveness for private investments and talent by developing and promoting the key capabilities to match the future needs of European industries and emerging technology drivers.
EuroPAT-MASiP will develop:
- Modelling, design and simulation of packaging-related key features and challenges
- The key packaging technologies, equipment and materials
- Heterogeneous (3D) integration of the smart system building blocks
- More than Moore (MtM)
- System in Package (SiP) and
- Test strategy, including metrology, methods and equipment, reliability and failure analysis.
Reinforcing the European semiconductor manufacturing position is reached through the following strategic objectives of EuroPAT-MASIP:
1. Consolidating and extending the leadership in semiconductor processing know-how, by developing and fostering packaging related technological and manufacturing building blocks, serving all the relevant industrial sectors
2. Accelerating the manufacturing uptake of the new technologies and shortening time-to-market by demonstrating the new capabilities in industrial need-based Application Pilots
3. Increasing the competitiveness and global market share of the European semiconductor industry by fostering the competences and capabilities of European semiconductor packaging
