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Superb Atomic LAyer Deposition tool for the semiconductor INdustry

Project description

Optimised thin-film deposition technique could enhance semiconductor coatings

Atomic layer deposition (ALD) is critical in semiconductor manufacturing, allowing precise control of thin-film deposition. The EU-funded SALADIN project aims to prove the effectiveness of Picosun’s P300F system for the European semiconductor industry. In collaboration with Silex Microsystems and Pegasus Chemicals, SALADIN will test, validate and supply chemical precursors for ALD thin films. The primary target market is microelectromechanical system (MEMS) processing and production. The goal is to demonstrate that a single ALD system can meet the diverse coating needs of MEMS foundry devices while fulfilling quality, flexibility, productivity and cost requirements. Optimised systems and processes will make ALD technology more accessible and affordable, enabling cost-effective, high-quality coatings in various applications, including light-emitting diodes, sensors and compound semiconductor devices.

Objective

The main objective of SALaDIn project is to prove industrial applicability of Picosun’s Atomic Layer Deposition (ALD) system, called P300F, for the needs of European semiconductor industry. This will be performed in collaboration with Silex Microsystems and Pegasus Chemicals who are responsible for testing and validation of the tool in industrial environment, and supply of chemical precursors for ALD thin films, respectively. The first target market is MEMS (Micro Electro Mechanical Systems) processing and production. The goal is to show that a single ALD system can fulfil the coating needs of MEMS foundry’s multiple devices by meeting film property and quality requirements, flexibility requirements for materials and processes as well as productivity requirements and cost targets for final devices. The system and processes optimized during the project will bring the ALD technology easily accessible and affordable for companies working with wafer sizes other than the mainstream 12” silicon technology and enable cost effective and high quality coatings in various application fields, such as MEMS, LEDs, sensors and devices made on compound semiconductors.

Fields of science (EuroSciVoc)

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Keywords

Project’s keywords as indicated by the project coordinator. Not to be confused with the EuroSciVoc taxonomy (Fields of science)

Programme(s)

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Topic(s)

Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.

Funding Scheme

Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.

IA - Innovation action

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Call for proposal

Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.

(opens in new window) H2020-ICT-2016-2017

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Coordinator

PICOSUN OY
Net EU contribution

Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.

€ 929 250,00
Address
TIETOTIE 3
02150 Espoo
Finland

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SME

The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.

Yes
Region
Manner-Suomi Helsinki-Uusimaa Helsinki-Uusimaa
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Links
Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

€ 1 327 500,00

Participants (2)

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