Periodic Reporting for period 2 - SALADIN (Superb Atomic LAyer Deposition tool for the semiconductor INdustry)
Periodo di rendicontazione: 2019-05-01 al 2021-10-31
Atomic layer deposition (ALD) has long been a Key Enabling Technology in mainstream 300 mm semiconductor production. In recent years, ALD has seen increasing adoption in More-than-Moore technologies outside 300 mm main semiconductor market. In SALADIN project, Picosun P-300F ALD tool is validated for industrial use in MEMS foundry environment in collaboration with Silex Microsystems and Pegasus Chemicals. The target is to show that a single ALD system can fulfill the coating needs of a MEMS foundry’s multiple devices by meeting film property and quality requirements, wide portfolio of different materials and processes as well as productivity requirements and cost targets for final devices. Additionally, two new ALD applications for MEMS will be demonstrated. In the project, an all-European value chain for MEMS production from equipment and chemicals supply to component manufacturing is created to strengthen the European semiconductor industry.
The main work streams of SALADIN project are WP2, WP3, WP4, WP5, WP6 and WP7 representing
WP2: Tool manufacturing
WP3: ALD process development
WP4: Tool integration
WP5: Process flow integration
WP6: Application properties optimization
WP7: Foundry evaluation
WP1 and WP8 are Ethics requirements and Dissemination, exploitation and general management, respectively.
The main work streams of SALADIN project are WP2, WP3, WP4, WP5, WP6 and WP7 representing
WP2: Tool manufacturing
WP3: ALD process development
WP4: Tool integration
WP5: Process flow integration
WP6: Application properties optimization
WP7: Foundry evaluation
WP1 and WP8 are Ethics requirements and Dissemination, exploitation and general management, respectively.
WP2: Tool specifications to meet foundry requirements have been defined and tool manufacturing is ongoing. D2.1 was reported on time and D2.2 is delayed by six months due to delay in tool manufacturing.
WP3: Suitable precursors for the 2nd ALD application have been selected (D3.1) and their synthesis has been reported in D3.2. Small-scale ALD demonstrations for both ALD applications were reported in D3.3.
WP4: Tool integration software was reported in D4.1 on time and D4.2 Field acceptance is delayed by 5 months to M20 due to delay in tool manufacturing.
WP5: Metrology recipes, SPC routines and protocols for wafer rework have been established for the 1st ALD application and different ALD materials have been evaluated for 2nd ALD application. No Deliverables were due in this WP during the 1st reporting period.
WP6: The choice of ALD materials and precursors in reported in D6.2 and preparatory work for application evaluation has been done.
WP7: The start of WP7 has been delayed from M16 to M20 due to delay in tool manufacturing.
The project has proceeded well during the 1st reporting period apart from the delay in tool manufacturing.
WP3: Suitable precursors for the 2nd ALD application have been selected (D3.1) and their synthesis has been reported in D3.2. Small-scale ALD demonstrations for both ALD applications were reported in D3.3.
WP4: Tool integration software was reported in D4.1 on time and D4.2 Field acceptance is delayed by 5 months to M20 due to delay in tool manufacturing.
WP5: Metrology recipes, SPC routines and protocols for wafer rework have been established for the 1st ALD application and different ALD materials have been evaluated for 2nd ALD application. No Deliverables were due in this WP during the 1st reporting period.
WP6: The choice of ALD materials and precursors in reported in D6.2 and preparatory work for application evaluation has been done.
WP7: The start of WP7 has been delayed from M16 to M20 due to delay in tool manufacturing.
The project has proceeded well during the 1st reporting period apart from the delay in tool manufacturing.
SALADIN represents an important step for integration of ALD technology in More-than-Moore applications. The system and ALD processes optimized during the project will bring ALD technology easily accessible and affordable for companies working with wafer sizes other than 300 mm mainstream semiconductor manufacturing and enable cost effective and high quality coatings in various application fields, such as MEMS, LEDs, sensor and compound semiconductor devices. An all-European value chain from OEMs and chemical suppliers to MEMS manufacturers is created in the project to benefit multiple European industries.