Deliverables Documents, reports (8) Report on performance of ADPSK-16 TxRx-demonstrator Document reporting on the final performance of the realized 16-ADPSK transceiver demonstrator Report on performance of PAM-4 TxRx-demonstrator Document reporting on the final performance of the realized PAM-4 transceiver demonstrator Initial press release by partners Press release outlining consortium and goals of the H2020 funded project CALADAN 1st report on the top-level optical transceiver designs Document outlining the 1st iteration of the top-level optical transceiver high-level specifications Final report on the top-level optical transceiver designs Document outlining the final iteration of the toplevel optical transceiver highlevel specifications starting from D14 and taking into account input from design process Final press release Press release outlining the final outcome of the H2020 funded project CALADAN Report on the PAM-4 demonstrator prototype evaluation Document reporting the laboratory evaluation of the PAM-4 demonstrator Report on the 16-ADPSK demonstrator prototype evaluation Document reporting the laboratory evaluation of the 16-ADPSK demonstrator Open Research Data Pilot (1) Data Management Plan Data Management Plan as required for Open Research Data Pilot Publications Other (16) Micro-transfer printing for silicon photonics Author(s): G. Roelkens Published in: imec Technology Forum - Photonics 2023, Issue 2023, 2023 Publisher: not applicalbe Design and integration of photonic and electronic integrated circuits for high-speed wireline transceivers Author(s): P. Ossieur Published in: PIC International 2022, Issue June-22, 2022 Publisher: Not applicable VCSELs vs SiPh for disaggregated scalable data center architectures Author(s): P. Ossieur, G. Torfs, X. Yin and J. Bauwelinck Published in: 2021 European Conference on Optical Communications - Workshop on dissaggregated data centers, Issue Sept-21, 2021 Publisher: Not applicable Micro-transfer printing for heterogeneous electronic-photonic integrated circuits Author(s): G. Roelkens Published in: 2024 International Solid-State Circuits Conference - Forum F6 Toward next generation of highly integrated electrical and optical transceivers, Issue Feb-24, 2024 Publisher: Not applicable High Speed transceivers in Silicon Photonics Author(s): P. Ossieur Published in: EPIXFab'Summerschool 2022, Issue 2022, 2022 Publisher: not applicable O-band GaAs QD-on-Si integrated optical amplifier realized using micro-transfer printing Author(s): J. Zhang, L. Bogaert, S. Qin, S. Cuyvers, I. Krestnikov, K. Morozov, A. Farrell, R. Loi, D. Gomez, J. Rimbock, P. Ossieur, G. Lepage, P. Verheyen, J. Van Campenhout, G. Morthier, G. Roelkens Published in: Optoelectronics and Communications Conference, Issue 02-06 July 2023, 2023 Publisher: IEEE Co-design and integration of broadband electronic and photonic IC's for next-generation optical transceiver applications Author(s): P. Ossieur Published in: 2021 ESSDERC and ESSCIRC (European Solid-State Circuits Conference), Issue Sept-21, 2021 Publisher: Not applicable High-speed and sensitive opto-electronics and systems for next-generation optical communication and sensing applications Author(s): P. Ossieur Published in: imec Technology Forum - Photonics 2022, Issue 2020, 2020 Publisher: not applicable Enabling integrated photonics at scale through micro transfer printing Author(s): Ruggero Loi Published in: EPIC Technology Meeting on Microelectronics & Photonics – Two Sides of One Coin –, Issue 14/11/2023, 2023 Publisher: EPIC Integration of photonics and electronics for optical access Author(s): P. Ossieur Published in: 2021 Optical Fiber Conference - Is Photonic Integration ready for next-generation optical access, Issue 1/06/2021, 2021 Publisher: not applicable Photonic integrated circuits realized using micro-transfer printing Author(s): J. Zhang, L. Bogaert, M. Billet, D. Wang, B. Pan, S. Qin, E. Soltanian, S. Cuyvers, D. Maes, T. Vanackere, T. Vandekerckhove, S. Poelman, M. Kiewiet, I. Luntadila Lufungula, X. Guo, H. Li, J. De Witte, G. Lepage, P. Verheyen, J. Van Campenhout, B. Kuyken, G. Morthier, D. Van Thourhout, R. Baets, G. Roelkens Published in: PhotonIcs and Electromagnetics Research Symposium(invited), Issue 3-6 July, 2023, 2023 Publisher: IEEE Dense integration of Photonics and Electronics through micro-transfer printing Author(s): Ruggero Loi, Prasanna Ramaswamy, Alex Farrell, Antonio Jose Trindade, Alin Fecioru, Johanna Rimböck, Marianna Pantouvaki, Guy Lepage, Joris Van Campenhout, Tinus Pannier, Ye Gu, David Gomez, Patrick Steglich and Peter Ossieur Published in: 2022 European Conference on Optical Communications - Workshop 13 - Photonic and Electronic co-integration solutions, Issue Sept-22, 2022 Publisher: Not applicable Micro Transfer Printing for Integrated Photonics Author(s): Ruggero Loi Published in: EPIC Online Technology Meeting on Hybrid Photonics Integration, Issue 18 set 2023, 2023 Publisher: EPIC High Speed transceivers in Silicon Photonics Author(s): P. Ossieur Published in: EPIXFab'Summerschool 2023, Issue 2023, 2023 Publisher: not applicable Scaling datacenter networks with photonic integration Author(s): Elad Mentovich Published in: 7th International Symposium for Optical Interconnect in Data Centres, 2019 Publisher: IEEE Electronics and photonics for beyond 200Gbps capable transceivers Author(s): P. Ossieur Published in: 2023 International Solid-State Circuits Conference - Forum F1 Transceivers for Exascale, Issue Feb-23, 2023 Publisher: Not applicable Conference proceedings (22) Patterned InterVia for Heterogeneous Integration of III-V devices onto silicon photonics by using micro-Transfer Printing Author(s): Ali Uzun, Johanna Rimböck, Jacek Gasiorowski, , Alex Farrell, Alin Fecioru, Ruggero Loi and Brian Corbett Published in: 3DIC conference 2023, Cork, Issue 11/05/2023, 2023 Publisher: IEEE micro-transfer-printing for photonic integrated circuits Author(s): J. Zhang, G. Muliuk, C. Op de Beeck, J. Goyvaerts, B. Haq, S. Kumari, B. Kuyken, J. Van Campenhout, R. Baets, G. Roelkens, J. Van Campenhout, G. Lepage, P. Verheyen, A. Gocalinska, E. Pelucchi, B. Corbett, A. Jose Trindade, C. Bower Published in: International Conference on Wafer Bonding, Issue 2nd-4th Dec. 2019 (Wafer Bond '2019), 2019 Publisher: Fraunhofer Micro-transfer-printed O-band GaAs QD-on-Si DFB Laser on an advanced silicon photonics platform Author(s): J. Zhang, S. Qin, L. Bogaert, I. Krestnikov, K. Morozov, J. Rimbock, A. Farrel, R. Loi, D. Gomez, P. Ossieur, G. Lepage, P. Verheyen, J. Van Campenhout, G. Morthier, G. Roelkens Published in: European Conference on Integrated Optics(TOP SCORING SESSION), Issue 19-21 April 2023, 2023 Publisher: Springer Compact and Transfer Printable 64 Gb/s Differential Transimpedance Amplifier in 130-nm BiCMOS Author(s): Mesut Inac; Adel Fatemi; Friedel Gerfers; Andrea Malignaggi Published in: 2020 15th European Microwave Integrated Circuits Conference (EuMIC), 2021 Publisher: IEEE Narrow-Linewidth Micro-Transfer-Printed III-V-on-Si Laser with 110 nm Tuning Range Author(s): E. Soltanian, G. Muliuk, S. Uvin, D. Wang, G. Lepage, P. Verheyen, J. Van Campenhout, S. Ertl, J. Rimbock, N. Vaissiere, D. Neel, J. Ramirez, J. Decobert, B. Kuyken, J. Zhang, G. Roelkens Published in: IEEE Photonics Society Summer Topicals Meeting Series (SUM) (invited), Issue 11-13 July 2022, 2022 Publisher: IEEE DOI: 10.1109/sum53465.2022.9858218 III-V-on-Si/SiN lasers realized using micro-transfer-printing Author(s): Jing Zhang, Camiel Op de Beeck, Bahawal Haq, Bart Kuyken, Dries Van Thourhout, Joris Van Campenhout, Guy Lepage, Peter Verheyen, Agnieszka Gocalinska, Stijn Cuyvers, Emanuele Pelucchi, Brian Corbett, Artur Hermans, Antonio Jose Trindade, Chris Bower, Roel Baets, Gunther Roelkens, Geert Morthier Published in: Photonis West 2021, Issue 5 March 2021, 2021, Page(s) Proc. SPIE 11705 Publisher: SPIE DOI: 10.1117/12.2577157 High speed transceivers beyond 1.6Tb/s for data center networks Author(s): P. Ossieur, B. Moeneclaey, J. Lambrecht, J. Craninckx, E. Martens, J. Van Driessche, J. Declerq, S. Niu, T. Pannier, Y. Gu, J. Zhang, T. Vanackere, D. Maes, R. Oldenbeuving, X. Zhang, J. Van Campenhout, P. Absil, B. Kuyken, X. Yin, G. Torfs, G. Roelkens, J. Bauwelinck Published in: European Conference on Optical Communication (invited), Issue 01-05 October 2023, 2023 Publisher: IEEE Transfer printing for heterogeneous silicon PICs Author(s): G. Roelkens, J. Zhang, S. Kumari, J. Juvert, A. Liles, G. Muliuk, J. Goyvaerts, B. Haq, N. Mahmoud, D. Van Thourhout Published in: Smart Systems Integrations, Issue 10-11 April 2019, 2019, ISBN 978-3-8007-4919-5 Publisher: VDE Lossless high-speed silicon photonic MZI switch with a micro-transfer printed III-V amplifier (accepted) Author(s): J. Zhang, C. Kruckel, B. Haq, L. Bogaert, J. Rimbock, B. Matuskova, S. Ertl, A. Gocalinska, E. Pelucchi, B. Corbett, J. Van Campenhout, G. Lepage, P. Verheyen, D. Van Thourhout, R. Baets, G. Roelkens Published in: 2022 IEEE 72nd Electronic Components and Technology Conference, Issue May 31- June 3, 2022, 2022 Publisher: IEEE III-V-on-silicon nitride narrow-linewidth tunable laser based on micro-transfer printing Author(s): B. Pan, Jerome Bourderionnet, Vincent Billault, Arnaud Brignon, S. Dwivedi, Marcus Dahlem, Cian Cummins, Sandeep S. Saseendran, Nga Pham, Philippe Helin, Nicolas Vaissiere, Delphine Neel, Joan Ramirez, Jean Decobert, Johanna Rimbock, Ruggero Loi, Alin Fecioru, E. Soltanian, J. Zhang, B. Kuyken, G. Roelkens Published in: Optical Fiber Communication Conference, Issue 05–09 March 2023, 2023 Publisher: Optica DOI: 10.1364/ofc.2023.th3b.5 Integration of Quantum Dot Lasers with SOI Waveguides using Micro-Transfer Printing Author(s): A. Uzun, Ruggero Loi, Peter Ossieur, Johanna Rimb¨ock, Stefan Erlt, Marianna Pantouvaki, Brian Corbett Published in: IEEE International 3D Systems Integration Conference (3DIC), Issue May 10-May 12 2023, 2023 Publisher: IEEE Integration of quantum dot lasers with SOI waveguides using Micro-Transfer printing Author(s): A. Uzun, F. Atar, J. Justice, R. Loi, A. Farrell, P. Ossieur, J. Zhang, G. Roelkens, I. Krestnikov, J. Rimbock, B. Corbett Published in: European Conference on Integrated Optics, Issue 04–06 May, 2022, 2022 Publisher: Springer Micro transfer printing of electronic integrated circuits on Silicon photonics substrates Author(s): Ruggero Loi, Prasanna Ramaswamy, Alex Farrell, Antonio Jose Trindade, Alin Fecioru, Johanna Rimböck, Stefan Eartl, Marianna Pantouvaki, Guy Lepage, Joris Van Campenhout, Tinus Pannier, Ye Gu, David Gomez, Patrick Steglich and Peter Ossieur Published in: EUROPEAN CONFERENCE ON INTEGRATED OPTICS 2022, MILAN, Issue 6/05/2022, 2022 Publisher: Springer Micro-Transfer-Printing Technology For Implementing Scalable III-V-on-Si Heterogeneous Integration Author(s): G. Muliuk, J. Zhang, G. Roelkens Published in: International Conference on Nanoimprint and Nanoprint Technologies, Issue December 16.-17..2021, 2021 Publisher: VTT Technical Research Centre of Finland Integrated optical transmitter with micro-transfer-printed widely tunable III-V-on-Si laser (accepted) Author(s): J. Zhang, E. Soltanian, B. Haq, S. Ertl, J. Rimbock, B. Matuskova, E. Pelucchi, A. Gocalinska, J. Van Campenhout, G. Lepage, P.. Verheyen, W. Bogaerts, G Roelkens Published in: Optical Fiber Communications Conference and Exhibition (OFC 2022), Issue 06 – 10 March 2022, 2022 Publisher: Optica Publishing Group Silicon Photonic Based High-speed Transceivers for Fiber-optic Short-reach Applications Author(s): Peter Ossieur Published in: 2019 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA), Issue 1/04/2019, 2019, Page(s) 1-1, ISBN 978-1-7281-0942-8 Publisher: IEEE DOI: 10.1109/vlsi-tsa.2019.8804659 Wafer-level packaging of photonics and electronics for terabit-scale optical interconnects Author(s): Dimitris Kalavrouziotis, Paraskevas Bakopoulos Published in: PIERS PhotonIcs & Electromagnetics Research Symposium, 2019 Publisher: piers Transfer Printable 64 Gbps Lumped Driver for Optical Communication Author(s): Mesut Inac; Adel Fatemi; Friedel Gerfers; Andrea Malignaggi Published in: MikroSystemTechnik Congress 2021, 2021 Publisher: IEEE Heterogeneous integration in silicon photonics through micro-transfer-printing Author(s): Jing Zhang, Grigorij Muliuk, Jeroen Goyvaerts, Bahawal Haq, Sulakshna Kumari, Joan Juvert, Camiel Op de Beeck, Bart Kuyken, Joris Van Campenhout, Guy Lepage, Peter Verheyen, Agnieszka Gocalinska, Emanuele Pelucchi, Brian Corbett, Antonio Jose Trindade, Chris Bower, Gunther Roelkens Published in: 2019 24th Microoptics Conference (MOC), Issue The 24th, 17 - 20 Nov 2019, 2019, Page(s) 64-65, ISBN 978-4-86348-712-3 Publisher: IEEE DOI: 10.23919/moc46630.2019.8982786 Micro-Transfer-Printing for III-V/Si PICs Author(s): J. Zhang, C. Op de Beeck, B. Haq, J. Goyvaerts, S. Cuyvers, S. Kumari, G. Muliuk, A. Hermans, A. Gocalinska, E. Pelucchi, B. Corbett, A.J. Trindade, C. Bower, J. Van Campenhout, G. Lepage, P. Verheyen, B. Kuyken, D. Van Thourhout, G. Morthier, R. Baets, G. Roelkens Published in: 2020 Asia Communications and Photonics Conference (ACP) and International Conference on Information Photonics and Optical Communications (IPOC), Issue October 24-27, 2020., 2020, Page(s) p.paper T4G.3, ISBN 978-1-943580-82-8 Publisher: IEEE DOI: 10.1364/acpc.2020.t4g.3 Micro-Transfer-Printed O-band GaAs QD III-V-on-Si DFB Laser Author(s): J. Zhang, I. Krestnikov, R. Loi, P. Ossieur, G. Lepage, P. Verheyen, J. Van Campendhout, D. Van Thourhout, G. Roelkens Published in: European Conference on Integrated Optics, Issue 04–06 May, 2022, 2023 Publisher: Springer III-V/Si PICs based on micro-transfer printing Author(s): G. Roelkens, J. Zhang, G. Muliuk, J. Goyvaerts, B. Haq, C. Op de Beeck, A. Liles, Z. Wang, S. Dhoore, S. Kumari, J. Juvert, J. Van Campenhout, B. Kuyken, D. Van Thourhout, B. Corbett Published in: Optical Fiber Communications Conference and Exhibition (OFC 2019), Issue 3-7 March 2019, 2019, Page(s) p.paper W4E.6 Publisher: IEEE DOI: 10.1364/ofc.2019.w4e.6 Peer reviewed articles (8) Integration of Edge-Emitting Quantum Dot Lasers with Different Waveguide Platforms using Micro-Transfer Printing Author(s): Ali Uzun; Fatih Bilge Atar; Simone Iadanza; Ruggero Loi; Jing Zhang; Gunther Roelkens; Igor Krestnikov; Johanna Rimbock; Liam OFaolain; Brian Corbett Published in: IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, Issue 5, 2023, Page(s) 1500210, ISSN 1558-4542 Publisher: IEEE DOI: 10.1109/jstqe.2023.3243943 Single-Chip Silicon Photonic Processor for Analog Optical and Microwave Signals Author(s): H. Deng, J. Zhang, E. Soltanian, X. Chen, C. Pang, N. Vaissiere, D. Neel, J. Ramirez, J. Decobert, N. Singh, G. Torfs, G. Roelkens, W. Bogaerts Published in: Nature, 2024, ISSN 1476-4687 Publisher: Springer Nature Micro-Transfer Printing for Heterogeneous Si Photonic Integrated Circuits Author(s): G. Roelkens, J. Zhang, L. Bogaert, M. Billet, D. Wang, B. Pan, C.J. Kruckel, E. Soltanian, D. Maes, T. Vanackere, T. Vandekerckhove, S. Cuyvers, J. De Witte, I. Luntadila, X. Guo, H. Li, S. Qin, G. Muliuk, S. Uvin, B. Haq, C. Op de Beeck, J. Goyvaerts, G. Lepage, P. Verheyen, J. Van Campenhout, G. Morthier, B. Kuyken, D. Van Thourhout, R. Baets Published in: IEEE Journal on Selected Topics in Quantum Electronics, 2023, Page(s) 8200414, ISSN 1558-4542 Publisher: IEEE DOI: 10.1109/jstqe.2022.3222686 Present and future of micro-transfer printing for heterogeneous photonic integrated circuits Author(s): G. Roelkens, J. Zhang, L. Bogaert, E. Soltanian, M. Billet, A. Uzun, B. Pan, Y. Liu, E. Delli, D. Wang, V. Bonito Oliva, L.Thi Ngoc Tran, X. Guo, H. Li, S. Qin, K. Akritidis, Y. Chen, Y. Xue, M. Niels, D. Maes, M. Kiewiet, T. Reep, T. Vanackere, T. Vandekerckhove, I. Luntadila Lufungula, J. De Witte, L. Reis, S. Poelman, Y. Tan, H. Deng, W. Bogaerts, G. Morthier, D. Van Thourhout, B. Kuyken Published in: APL Photonics, 2024, ISSN 2378-0967 Publisher: AIP DOI: 10.1063/5.0181099 Micro-transfer-printed narrow-linewidth III-V-on-Si double laser structure with a combined 110 nm tuning range Author(s): Emadreza Soltanian, Grigorij Muliuk, Sarah Uvin, Dongbo Wang, Guy Lepage, Peter Verheyen, Joris Van Campenhout, Stefan Ertl, Johanna Rimböck, Nicolas Vaissiere, Delphine Néel, Joan Ramirez, Jean Decobert, Bart Kuyken, Jing Zhang, and Gunther Roelkens Published in: Optics Express, 2022, Page(s) 39329, ISSN 1094-4087 Publisher: Optical Society of America DOI: 10.1364/oe.470497 III-V-on-Si DFB laser with co-integrated power amplifier realised using micro-transfer printing Author(s): J. Zhang, L. Bogaert, B. Haq, R. Wang, B. Matuskova, J. Rimbock, S. Ertl, A. Gocalinska, E. Pelucchi, B. Corbett, J. Van Campenhout, G. Lepage, P. Verheyen, G. Morthier, G. Roelkens Published in: IEEE Photonics Technology Letters, 2023, Page(s) 593, ISSN 1941-0174 Publisher: IEEE DOI: 10.1109/lpt.2023.3263279 Micro-transfer printing InP C-band SOAs on advanced silicon photonics platform for lossless MZI switch fabrics and high-speed integrated transmitters Author(s): J. Zhang, L. Bogaert, C.J. Krückel, E. Soltanian, H. Deng, B. Haq, J.Rimbock, J. Van Kerrebrouck, G. Lepage, P. Verheyen, J. Van Campenhout, P. Ossieur, D. Van Thourhout, G. Morthier, W. Bogaerts, G. Roelkens Published in: Optics Express, 2023, Page(s) 42807, ISSN 1094-4087 Publisher: Optical Society of America DOI: 10.1364/oe.505112 III-V-on-Si photonic integrated circuits realized using micro-transfer-printing Author(s): Jing Zhang, Grigorij Muliuk, Joan Juvert, Sulakshna Kumari, Jeroen Goyvaerts, Bahawal Haq, Camiel Op de Beeck, Bart Kuyken, Geert Morthier, Dries Van Thourhout, Roel Baets, Guy Lepage, Peter Verheyen, Joris Van Campenhout, Agnieszka Gocalinska, James O’Callaghan, Emanuele Pelucchi, Kevin Thomas, Brian Corbett, António José Trindade, Gunther Roelkens Published in: APL Photonics, Issue 4/11, 2019, Page(s) 110803, ISSN 2378-0967 Publisher: AIP DOI: 10.1063/1.5120004 Thesis and dissertations (2) III-V-on-Si Transceivers Based on Micro-Transfer-Printing Author(s): Jing Zhang Published in: 2021 Publisher: Ghent University Heterogeneous Integration of InAs/GaAs Quantum Dot Lasers on Silicon Photonics Author(s): Sarah Uvin Published in: 2020 Publisher: Ghent University Searching for OpenAIRE data... 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