Micro assembled Terabit/s capable optical transceivers for Datacom applications

Resultado final

Report on performance of ADPSK-16 TxRx-demonstrator

Document reporting on the final performance of the realized 16-ADPSK transceiver demonstrator

Report on performance of PAM-4 TxRx-demonstrator

Document reporting on the final performance of the realized PAM-4 transceiver demonstrator

Initial press release by partners

Press release outlining consortium and goals of the H2020 funded project CALADAN

1st report on the top-level optical transceiver designs

Document outlining the 1st iteration of the top-level optical transceiver high-level specifications

Final report on the top-level optical transceiver designs

Document outlining the final iteration of the toplevel optical transceiver highlevel specifications starting from D14 and taking into account input from design process

Final press release

Press release outlining the final outcome of the H2020 funded project CALADAN

Report on the PAM-4 demonstrator prototype evaluation

Document reporting the laboratory evaluation of the PAM-4 demonstrator

Report on the 16-ADPSK demonstrator prototype evaluation

Document reporting the laboratory evaluation of the 16-ADPSK demonstrator

Data Management Plan

Data Management Plan as required for Open Research Data Pilot

Publicaciones

Micro-transfer printing for silicon photonics

Autores: G. Roelkens
Publicado en: imec Technology Forum - Photonics 2023, Edición 2023, 2023
Editor: not applicalbe

Design and integration of photonic and electronic integrated circuits for high-speed wireline transceivers

Autores: P. Ossieur
Publicado en: PIC International 2022, Edición June-22, 2022
Editor: Not applicable

VCSELs vs SiPh for disaggregated scalable data center architectures

Autores: P. Ossieur, G. Torfs, X. Yin and J. Bauwelinck
Publicado en: 2021 European Conference on Optical Communications - Workshop on dissaggregated data centers, Edición Sept-21, 2021
Editor: Not applicable

Micro-transfer printing for heterogeneous electronic-photonic integrated circuits

Autores: G. Roelkens
Publicado en: 2024 International Solid-State Circuits Conference - Forum F6 Toward next generation of highly integrated electrical and optical transceivers, Edición Feb-24, 2024
Editor: Not applicable

High Speed transceivers in Silicon Photonics

Autores: P. Ossieur
Publicado en: EPIXFab'Summerschool 2022, Edición 2022, 2022
Editor: not applicable

O-band GaAs QD-on-Si integrated optical amplifier realized using micro-transfer printing

Autores: J. Zhang, L. Bogaert, S. Qin, S. Cuyvers, I. Krestnikov, K. Morozov, A. Farrell, R. Loi, D. Gomez, J. Rimbock, P. Ossieur, G. Lepage, P. Verheyen, J. Van Campenhout, G. Morthier, G. Roelkens
Publicado en: Optoelectronics and Communications Conference, Edición 02-06 July 2023, 2023
Editor: IEEE

Co-design and integration of broadband electronic and photonic IC's for next-generation optical transceiver applications

Autores: P. Ossieur
Publicado en: 2021 ESSDERC and ESSCIRC (European Solid-State Circuits Conference), Edición Sept-21, 2021
Editor: Not applicable

High-speed and sensitive opto-electronics and systems for next-generation optical communication and sensing applications

Autores: P. Ossieur
Publicado en: imec Technology Forum - Photonics 2022, Edición 2020, 2020
Editor: not applicable

Enabling integrated photonics at scale through micro transfer printing

Autores: Ruggero Loi
Publicado en: EPIC Technology Meeting on Microelectronics & Photonics – Two Sides of One Coin –, Edición 14/11/2023, 2023
Editor: EPIC

Integration of photonics and electronics for optical access

Autores: P. Ossieur
Publicado en: 2021 Optical Fiber Conference - Is Photonic Integration ready for next-generation optical access, Edición 1/06/2021, 2021
Editor: not applicable

Photonic integrated circuits realized using micro-transfer printing

Autores: J. Zhang, L. Bogaert, M. Billet, D. Wang, B. Pan, S. Qin, E. Soltanian, S. Cuyvers, D. Maes, T. Vanackere, T. Vandekerckhove, S. Poelman, M. Kiewiet, I. Luntadila Lufungula, X. Guo, H. Li, J. De Witte, G. Lepage, P. Verheyen, J. Van Campenhout, B. Kuyken, G. Morthier, D. Van Thourhout, R. Baets, G. Roelkens
Publicado en: PhotonIcs and Electromagnetics Research Symposium(invited), Edición 3-6 July, 2023, 2023
Editor: IEEE

Dense integration of Photonics and Electronics through micro-transfer printing

Autores: Ruggero Loi, Prasanna Ramaswamy, Alex Farrell, Antonio Jose Trindade, Alin Fecioru, Johanna Rimböck, Marianna Pantouvaki, Guy Lepage, Joris Van Campenhout, Tinus Pannier, Ye Gu, David Gomez, Patrick Steglich and Peter Ossieur
Publicado en: 2022 European Conference on Optical Communications - Workshop 13 - Photonic and Electronic co-integration solutions, Edición Sept-22, 2022
Editor: Not applicable

Micro Transfer Printing for Integrated Photonics

Autores: Ruggero Loi
Publicado en: EPIC Online Technology Meeting on Hybrid Photonics Integration, Edición 18 set 2023, 2023
Editor: EPIC

High Speed transceivers in Silicon Photonics

Autores: P. Ossieur
Publicado en: EPIXFab'Summerschool 2023, Edición 2023, 2023
Editor: not applicable

Scaling datacenter networks with photonic integration

Autores: Elad Mentovich
Publicado en: 7th International Symposium for Optical Interconnect in Data Centres, 2019
Editor: IEEE

Electronics and photonics for beyond 200Gbps capable transceivers

Autores: P. Ossieur
Publicado en: 2023 International Solid-State Circuits Conference - Forum F1 Transceivers for Exascale, Edición Feb-23, 2023
Editor: Not applicable

Patterned InterVia for Heterogeneous Integration of III-V devices onto silicon photonics by using micro-Transfer Printing

Autores: Ali Uzun, Johanna Rimböck, Jacek Gasiorowski, , Alex Farrell, Alin Fecioru, Ruggero Loi and Brian Corbett
Publicado en: 3DIC conference 2023, Cork, Edición 11/05/2023, 2023
Editor: IEEE

micro-transfer-printing for photonic integrated circuits

Autores: J. Zhang, G. Muliuk, C. Op de Beeck, J. Goyvaerts, B. Haq, S. Kumari, B. Kuyken, J. Van Campenhout, R. Baets, G. Roelkens, J. Van Campenhout, G. Lepage, P. Verheyen, A. Gocalinska, E. Pelucchi, B. Corbett, A. Jose Trindade, C. Bower
Publicado en: International Conference on Wafer Bonding, Edición 2nd-4th Dec. 2019 (Wafer Bond '2019), 2019
Editor: Fraunhofer

Micro-transfer-printed O-band GaAs QD-on-Si DFB Laser on an advanced silicon photonics platform

Autores: J. Zhang, S. Qin, L. Bogaert, I. Krestnikov, K. Morozov, J. Rimbock, A. Farrel, R. Loi, D. Gomez, P. Ossieur, G. Lepage, P. Verheyen, J. Van Campenhout, G. Morthier, G. Roelkens
Publicado en: European Conference on Integrated Optics(TOP SCORING SESSION), Edición 19-21 April 2023, 2023
Editor: Springer

Compact and Transfer Printable 64 Gb/s Differential Transimpedance Amplifier in 130-nm BiCMOS

Autores: Mesut Inac; Adel Fatemi; Friedel Gerfers; Andrea Malignaggi
Publicado en: 2020 15th European Microwave Integrated Circuits Conference (EuMIC), 2021
Editor: IEEE

Narrow-Linewidth Micro-Transfer-Printed III-V-on-Si Laser with 110 nm Tuning Range

Autores: E. Soltanian, G. Muliuk, S. Uvin, D. Wang, G. Lepage, P. Verheyen, J. Van Campenhout, S. Ertl, J. Rimbock, N. Vaissiere, D. Neel, J. Ramirez, J. Decobert, B. Kuyken, J. Zhang, G. Roelkens
Publicado en: IEEE Photonics Society Summer Topicals Meeting Series (SUM) (invited), Edición 11-13 July 2022, 2022
Editor: IEEE
DOI: 10.1109/sum53465.2022.9858218

III-V-on-Si/SiN lasers realized using micro-transfer-printing

Autores: Jing Zhang, Camiel Op de Beeck, Bahawal Haq, Bart Kuyken, Dries Van Thourhout, Joris Van Campenhout, Guy Lepage, Peter Verheyen, Agnieszka Gocalinska, Stijn Cuyvers, Emanuele Pelucchi, Brian Corbett, Artur Hermans, Antonio Jose Trindade, Chris Bower, Roel Baets, Gunther Roelkens, Geert Morthier
Publicado en: Photonis West 2021, Edición 5 March 2021, 2021, Página(s) Proc. SPIE 11705
Editor: SPIE
DOI: 10.1117/12.2577157

High speed transceivers beyond 1.6Tb/s for data center networks

Autores: P. Ossieur, B. Moeneclaey, J. Lambrecht, J. Craninckx, E. Martens, J. Van Driessche, J. Declerq, S. Niu, T. Pannier, Y. Gu, J. Zhang, T. Vanackere, D. Maes, R. Oldenbeuving, X. Zhang, J. Van Campenhout, P. Absil, B. Kuyken, X. Yin, G. Torfs, G. Roelkens, J. Bauwelinck
Publicado en: European Conference on Optical Communication (invited), Edición 01-05 October 2023, 2023
Editor: IEEE

Transfer printing for heterogeneous silicon PICs

Autores: G. Roelkens, J. Zhang, S. Kumari, J. Juvert, A. Liles, G. Muliuk, J. Goyvaerts, B. Haq, N. Mahmoud, D. Van Thourhout
Publicado en: Smart Systems Integrations, Edición 10-11 April 2019, 2019, ISBN 978-3-8007-4919-5
Editor: VDE

Lossless high-speed silicon photonic MZI switch with a micro-transfer printed III-V amplifier (accepted)

Autores: J. Zhang, C. Kruckel, B. Haq, L. Bogaert, J. Rimbock, B. Matuskova, S. Ertl, A. Gocalinska, E. Pelucchi, B. Corbett, J. Van Campenhout, G. Lepage, P. Verheyen, D. Van Thourhout, R. Baets, G. Roelkens
Publicado en: 2022 IEEE 72nd Electronic Components and Technology Conference, Edición May 31- June 3, 2022, 2022
Editor: IEEE

III-V-on-silicon nitride narrow-linewidth tunable laser based on micro-transfer printing

Autores: B. Pan, Jerome Bourderionnet, Vincent Billault, Arnaud Brignon, S. Dwivedi, Marcus Dahlem, Cian Cummins, Sandeep S. Saseendran, Nga Pham, Philippe Helin, Nicolas Vaissiere, Delphine Neel, Joan Ramirez, Jean Decobert, Johanna Rimbock, Ruggero Loi, Alin Fecioru, E. Soltanian, J. Zhang, B. Kuyken, G. Roelkens
Publicado en: Optical Fiber Communication Conference, Edición 05–09 March 2023, 2023
Editor: Optica
DOI: 10.1364/ofc.2023.th3b.5

Integration of Quantum Dot Lasers with SOI Waveguides using Micro-Transfer Printing

Autores: A. Uzun, Ruggero Loi, Peter Ossieur, Johanna Rimb¨ock, Stefan Erlt, Marianna Pantouvaki, Brian Corbett
Publicado en: IEEE International 3D Systems Integration Conference (3DIC), Edición May 10-May 12 2023, 2023
Editor: IEEE

Integration of quantum dot lasers with SOI waveguides using Micro-Transfer printing

Autores: A. Uzun, F. Atar, J. Justice, R. Loi, A. Farrell, P. Ossieur, J. Zhang, G. Roelkens, I. Krestnikov, J. Rimbock, B. Corbett
Publicado en: European Conference on Integrated Optics, Edición 04–06 May, 2022, 2022
Editor: Springer

Micro transfer printing of electronic integrated circuits on Silicon photonics substrates

Autores: Ruggero Loi, Prasanna Ramaswamy, Alex Farrell, Antonio Jose Trindade, Alin Fecioru, Johanna Rimböck, Stefan Eartl, Marianna Pantouvaki, Guy Lepage, Joris Van Campenhout, Tinus Pannier, Ye Gu, David Gomez, Patrick Steglich and Peter Ossieur
Publicado en: EUROPEAN CONFERENCE ON INTEGRATED OPTICS 2022, MILAN, Edición 6/05/2022, 2022
Editor: Springer

Micro-Transfer-Printing Technology For Implementing Scalable III-V-on-Si Heterogeneous Integration

Autores: G. Muliuk, J. Zhang, G. Roelkens
Publicado en: International Conference on Nanoimprint and Nanoprint Technologies, Edición December 16.-17..2021, 2021
Editor: VTT Technical Research Centre of Finland

Integrated optical transmitter with micro-transfer-printed widely tunable III-V-on-Si laser (accepted)

Autores: J. Zhang, E. Soltanian, B. Haq, S. Ertl, J. Rimbock, B. Matuskova, E. Pelucchi, A. Gocalinska, J. Van Campenhout, G. Lepage, P.. Verheyen, W. Bogaerts, G Roelkens
Publicado en: Optical Fiber Communications Conference and Exhibition (OFC 2022), Edición 06 – 10 March 2022, 2022
Editor: Optica Publishing Group

Silicon Photonic Based High-speed Transceivers for Fiber-optic Short-reach Applications

Autores: Peter Ossieur
Publicado en: 2019 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA), Edición 1/04/2019, 2019, Página(s) 1-1, ISBN 978-1-7281-0942-8
Editor: IEEE
DOI: 10.1109/vlsi-tsa.2019.8804659

Wafer-level packaging of photonics and electronics for terabit-scale optical interconnects

Autores: Dimitris Kalavrouziotis, Paraskevas Bakopoulos
Publicado en: PIERS PhotonIcs & Electromagnetics Research Symposium, 2019
Editor: piers

Transfer Printable 64 Gbps Lumped Driver for Optical Communication

Autores: Mesut Inac; Adel Fatemi; Friedel Gerfers; Andrea Malignaggi
Publicado en: MikroSystemTechnik Congress 2021, 2021
Editor: IEEE

Heterogeneous integration in silicon photonics through micro-transfer-printing

Autores: Jing Zhang, Grigorij Muliuk, Jeroen Goyvaerts, Bahawal Haq, Sulakshna Kumari, Joan Juvert, Camiel Op de Beeck, Bart Kuyken, Joris Van Campenhout, Guy Lepage, Peter Verheyen, Agnieszka Gocalinska, Emanuele Pelucchi, Brian Corbett, Antonio Jose Trindade, Chris Bower, Gunther Roelkens
Publicado en: 2019 24th Microoptics Conference (MOC), Edición The 24th, 17 - 20 Nov 2019, 2019, Página(s) 64-65, ISBN 978-4-86348-712-3
Editor: IEEE
DOI: 10.23919/moc46630.2019.8982786

Micro-Transfer-Printing for III-V/Si PICs

Autores: J. Zhang, C. Op de Beeck, B. Haq, J. Goyvaerts, S. Cuyvers, S. Kumari, G. Muliuk, A. Hermans, A. Gocalinska, E. Pelucchi, B. Corbett, A.J. Trindade, C. Bower, J. Van Campenhout, G. Lepage, P. Verheyen, B. Kuyken, D. Van Thourhout, G. Morthier, R. Baets, G. Roelkens
Publicado en: 2020 Asia Communications and Photonics Conference (ACP) and International Conference on Information Photonics and Optical Communications (IPOC), Edición October 24-27, 2020., 2020, Página(s) p.paper T4G.3, ISBN 978-1-943580-82-8
Editor: IEEE
DOI: 10.1364/acpc.2020.t4g.3

Micro-Transfer-Printed O-band GaAs QD III-V-on-Si DFB Laser

Autores: J. Zhang, I. Krestnikov, R. Loi, P. Ossieur, G. Lepage, P. Verheyen, J. Van Campendhout, D. Van Thourhout, G. Roelkens
Publicado en: European Conference on Integrated Optics, Edición 04–06 May, 2022, 2023
Editor: Springer

III-V/Si PICs based on micro-transfer printing

Autores: G. Roelkens, J. Zhang, G. Muliuk, J. Goyvaerts, B. Haq, C. Op de Beeck, A. Liles, Z. Wang, S. Dhoore, S. Kumari, J. Juvert, J. Van Campenhout, B. Kuyken, D. Van Thourhout, B. Corbett
Publicado en: Optical Fiber Communications Conference and Exhibition (OFC 2019), Edición 3-7 March 2019, 2019, Página(s) p.paper W4E.6
Editor: IEEE
DOI: 10.1364/ofc.2019.w4e.6

Integration of Edge-Emitting Quantum Dot Lasers with Different Waveguide Platforms using Micro-Transfer Printing

Autores: Ali Uzun; Fatih Bilge Atar; Simone Iadanza; Ruggero Loi; Jing Zhang; Gunther Roelkens; Igor Krestnikov; Johanna Rimbock; Liam OFaolain; Brian Corbett
Publicado en: IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, Edición 5, 2023, Página(s) 1500210, ISSN 1558-4542
Editor: IEEE
DOI: 10.1109/jstqe.2023.3243943

Single-Chip Silicon Photonic Processor for Analog Optical and Microwave Signals

Autores: H. Deng, J. Zhang, E. Soltanian, X. Chen, C. Pang, N. Vaissiere, D. Neel, J. Ramirez, J. Decobert, N. Singh, G. Torfs, G. Roelkens, W. Bogaerts
Publicado en: Nature, 2024, ISSN 1476-4687
Editor: Springer Nature

Micro-Transfer Printing for Heterogeneous Si Photonic Integrated Circuits

Autores: G. Roelkens, J. Zhang, L. Bogaert, M. Billet, D. Wang, B. Pan, C.J. Kruckel, E. Soltanian, D. Maes, T. Vanackere, T. Vandekerckhove, S. Cuyvers, J. De Witte, I. Luntadila, X. Guo, H. Li, S. Qin, G. Muliuk, S. Uvin, B. Haq, C. Op de Beeck, J. Goyvaerts, G. Lepage, P. Verheyen, J. Van Campenhout, G. Morthier, B. Kuyken, D. Van Thourhout, R. Baets
Publicado en: IEEE Journal on Selected Topics in Quantum Electronics, 2023, Página(s) 8200414, ISSN 1558-4542
Editor: IEEE
DOI: 10.1109/jstqe.2022.3222686

Present and future of micro-transfer printing for heterogeneous photonic integrated circuits

Autores: G. Roelkens, J. Zhang, L. Bogaert, E. Soltanian, M. Billet, A. Uzun, B. Pan, Y. Liu, E. Delli, D. Wang, V. Bonito Oliva, L.Thi Ngoc Tran, X. Guo, H. Li, S. Qin, K. Akritidis, Y. Chen, Y. Xue, M. Niels, D. Maes, M. Kiewiet, T. Reep, T. Vanackere, T. Vandekerckhove, I. Luntadila Lufungula, J. De Witte, L. Reis, S. Poelman, Y. Tan, H. Deng, W. Bogaerts, G. Morthier, D. Van Thourhout, B. Kuyken
Publicado en: APL Photonics, 2024, ISSN 2378-0967
Editor: AIP
DOI: 10.1063/5.0181099

Micro-transfer-printed narrow-linewidth III-V-on-Si double laser structure with a combined 110 nm tuning range

Autores: Emadreza Soltanian, Grigorij Muliuk, Sarah Uvin, Dongbo Wang, Guy Lepage, Peter Verheyen, Joris Van Campenhout, Stefan Ertl, Johanna Rimböck, Nicolas Vaissiere, Delphine Néel, Joan Ramirez, Jean Decobert, Bart Kuyken, Jing Zhang, and Gunther Roelkens
Publicado en: Optics Express, 2022, Página(s) 39329, ISSN 1094-4087
Editor: Optical Society of America
DOI: 10.1364/oe.470497

III-V-on-Si DFB laser with co-integrated power amplifier realised using micro-transfer printing

Autores: J. Zhang, L. Bogaert, B. Haq, R. Wang, B. Matuskova, J. Rimbock, S. Ertl, A. Gocalinska, E. Pelucchi, B. Corbett, J. Van Campenhout, G. Lepage, P. Verheyen, G. Morthier, G. Roelkens
Publicado en: IEEE Photonics Technology Letters, 2023, Página(s) 593, ISSN 1941-0174
Editor: IEEE
DOI: 10.1109/lpt.2023.3263279

Micro-transfer printing InP C-band SOAs on advanced silicon photonics platform for lossless MZI switch fabrics and high-speed integrated transmitters

Autores: J. Zhang, L. Bogaert, C.J. Krückel, E. Soltanian, H. Deng, B. Haq, J.Rimbock, J. Van Kerrebrouck, G. Lepage, P. Verheyen, J. Van Campenhout, P. Ossieur, D. Van Thourhout, G. Morthier, W. Bogaerts, G. Roelkens
Publicado en: Optics Express, 2023, Página(s) 42807, ISSN 1094-4087
Editor: Optical Society of America
DOI: 10.1364/oe.505112

III-V-on-Si photonic integrated circuits realized using micro-transfer-printing

Autores: Jing Zhang, Grigorij Muliuk, Joan Juvert, Sulakshna Kumari, Jeroen Goyvaerts, Bahawal Haq, Camiel Op de Beeck, Bart Kuyken, Geert Morthier, Dries Van Thourhout, Roel Baets, Guy Lepage, Peter Verheyen, Joris Van Campenhout, Agnieszka Gocalinska, James O’Callaghan, Emanuele Pelucchi, Kevin Thomas, Brian Corbett, António José Trindade, Gunther Roelkens
Publicado en: APL Photonics, Edición 4/11, 2019, Página(s) 110803, ISSN 2378-0967
Editor: AIP
DOI: 10.1063/1.5120004

III-V-on-Si Transceivers Based on Micro-Transfer-Printing

Autores: Jing Zhang
Publicado en: 2021
Editor: Ghent University

Heterogeneous Integration of InAs/GaAs Quantum Dot Lasers on Silicon Photonics

Autores: Sarah Uvin
Publicado en: 2020
Editor: Ghent University

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