Micro assembled Terabit/s capable optical transceivers for Datacom applications

Livrables

Report on performance of ADPSK-16 TxRx-demonstrator

Document reporting on the final performance of the realized 16-ADPSK transceiver demonstrator

Report on performance of PAM-4 TxRx-demonstrator

Document reporting on the final performance of the realized PAM-4 transceiver demonstrator

Initial press release by partners

Press release outlining consortium and goals of the H2020 funded project CALADAN

1st report on the top-level optical transceiver designs

Document outlining the 1st iteration of the top-level optical transceiver high-level specifications

Final report on the top-level optical transceiver designs

Document outlining the final iteration of the toplevel optical transceiver highlevel specifications starting from D14 and taking into account input from design process

Final press release

Press release outlining the final outcome of the H2020 funded project CALADAN

Report on the PAM-4 demonstrator prototype evaluation

Document reporting the laboratory evaluation of the PAM-4 demonstrator

Report on the 16-ADPSK demonstrator prototype evaluation

Document reporting the laboratory evaluation of the 16-ADPSK demonstrator

Data Management Plan

Data Management Plan as required for Open Research Data Pilot

Publications

Micro-transfer printing for silicon photonics

Auteurs: G. Roelkens
Publié dans: imec Technology Forum - Photonics 2023, Numéro 2023, 2023
Éditeur: not applicalbe

Design and integration of photonic and electronic integrated circuits for high-speed wireline transceivers

Auteurs: P. Ossieur
Publié dans: PIC International 2022, Numéro June-22, 2022
Éditeur: Not applicable

VCSELs vs SiPh for disaggregated scalable data center architectures

Auteurs: P. Ossieur, G. Torfs, X. Yin and J. Bauwelinck
Publié dans: 2021 European Conference on Optical Communications - Workshop on dissaggregated data centers, Numéro Sept-21, 2021
Éditeur: Not applicable

Micro-transfer printing for heterogeneous electronic-photonic integrated circuits

Auteurs: G. Roelkens
Publié dans: 2024 International Solid-State Circuits Conference - Forum F6 Toward next generation of highly integrated electrical and optical transceivers, Numéro Feb-24, 2024
Éditeur: Not applicable

High Speed transceivers in Silicon Photonics

Auteurs: P. Ossieur
Publié dans: EPIXFab'Summerschool 2022, Numéro 2022, 2022
Éditeur: not applicable

O-band GaAs QD-on-Si integrated optical amplifier realized using micro-transfer printing

Auteurs: J. Zhang, L. Bogaert, S. Qin, S. Cuyvers, I. Krestnikov, K. Morozov, A. Farrell, R. Loi, D. Gomez, J. Rimbock, P. Ossieur, G. Lepage, P. Verheyen, J. Van Campenhout, G. Morthier, G. Roelkens
Publié dans: Optoelectronics and Communications Conference, Numéro 02-06 July 2023, 2023
Éditeur: IEEE

Co-design and integration of broadband electronic and photonic IC's for next-generation optical transceiver applications

Auteurs: P. Ossieur
Publié dans: 2021 ESSDERC and ESSCIRC (European Solid-State Circuits Conference), Numéro Sept-21, 2021
Éditeur: Not applicable

High-speed and sensitive opto-electronics and systems for next-generation optical communication and sensing applications

Auteurs: P. Ossieur
Publié dans: imec Technology Forum - Photonics 2022, Numéro 2020, 2020
Éditeur: not applicable

Enabling integrated photonics at scale through micro transfer printing

Auteurs: Ruggero Loi
Publié dans: EPIC Technology Meeting on Microelectronics & Photonics – Two Sides of One Coin –, Numéro 14/11/2023, 2023
Éditeur: EPIC

Integration of photonics and electronics for optical access

Auteurs: P. Ossieur
Publié dans: 2021 Optical Fiber Conference - Is Photonic Integration ready for next-generation optical access, Numéro 1/06/2021, 2021
Éditeur: not applicable

Photonic integrated circuits realized using micro-transfer printing

Auteurs: J. Zhang, L. Bogaert, M. Billet, D. Wang, B. Pan, S. Qin, E. Soltanian, S. Cuyvers, D. Maes, T. Vanackere, T. Vandekerckhove, S. Poelman, M. Kiewiet, I. Luntadila Lufungula, X. Guo, H. Li, J. De Witte, G. Lepage, P. Verheyen, J. Van Campenhout, B. Kuyken, G. Morthier, D. Van Thourhout, R. Baets, G. Roelkens
Publié dans: PhotonIcs and Electromagnetics Research Symposium(invited), Numéro 3-6 July, 2023, 2023
Éditeur: IEEE

Dense integration of Photonics and Electronics through micro-transfer printing

Auteurs: Ruggero Loi, Prasanna Ramaswamy, Alex Farrell, Antonio Jose Trindade, Alin Fecioru, Johanna Rimböck, Marianna Pantouvaki, Guy Lepage, Joris Van Campenhout, Tinus Pannier, Ye Gu, David Gomez, Patrick Steglich and Peter Ossieur
Publié dans: 2022 European Conference on Optical Communications - Workshop 13 - Photonic and Electronic co-integration solutions, Numéro Sept-22, 2022
Éditeur: Not applicable

Micro Transfer Printing for Integrated Photonics

Auteurs: Ruggero Loi
Publié dans: EPIC Online Technology Meeting on Hybrid Photonics Integration, Numéro 18 set 2023, 2023
Éditeur: EPIC

High Speed transceivers in Silicon Photonics

Auteurs: P. Ossieur
Publié dans: EPIXFab'Summerschool 2023, Numéro 2023, 2023
Éditeur: not applicable

Scaling datacenter networks with photonic integration

Auteurs: Elad Mentovich
Publié dans: 7th International Symposium for Optical Interconnect in Data Centres, 2019
Éditeur: IEEE

Electronics and photonics for beyond 200Gbps capable transceivers

Auteurs: P. Ossieur
Publié dans: 2023 International Solid-State Circuits Conference - Forum F1 Transceivers for Exascale, Numéro Feb-23, 2023
Éditeur: Not applicable

Patterned InterVia for Heterogeneous Integration of III-V devices onto silicon photonics by using micro-Transfer Printing

Auteurs: Ali Uzun, Johanna Rimböck, Jacek Gasiorowski, , Alex Farrell, Alin Fecioru, Ruggero Loi and Brian Corbett
Publié dans: 3DIC conference 2023, Cork, Numéro 11/05/2023, 2023
Éditeur: IEEE

micro-transfer-printing for photonic integrated circuits

Auteurs: J. Zhang, G. Muliuk, C. Op de Beeck, J. Goyvaerts, B. Haq, S. Kumari, B. Kuyken, J. Van Campenhout, R. Baets, G. Roelkens, J. Van Campenhout, G. Lepage, P. Verheyen, A. Gocalinska, E. Pelucchi, B. Corbett, A. Jose Trindade, C. Bower
Publié dans: International Conference on Wafer Bonding, Numéro 2nd-4th Dec. 2019 (Wafer Bond '2019), 2019
Éditeur: Fraunhofer

Micro-transfer-printed O-band GaAs QD-on-Si DFB Laser on an advanced silicon photonics platform

Auteurs: J. Zhang, S. Qin, L. Bogaert, I. Krestnikov, K. Morozov, J. Rimbock, A. Farrel, R. Loi, D. Gomez, P. Ossieur, G. Lepage, P. Verheyen, J. Van Campenhout, G. Morthier, G. Roelkens
Publié dans: European Conference on Integrated Optics(TOP SCORING SESSION), Numéro 19-21 April 2023, 2023
Éditeur: Springer

Compact and Transfer Printable 64 Gb/s Differential Transimpedance Amplifier in 130-nm BiCMOS

Auteurs: Mesut Inac; Adel Fatemi; Friedel Gerfers; Andrea Malignaggi
Publié dans: 2020 15th European Microwave Integrated Circuits Conference (EuMIC), 2021
Éditeur: IEEE

Narrow-Linewidth Micro-Transfer-Printed III-V-on-Si Laser with 110 nm Tuning Range

Auteurs: E. Soltanian, G. Muliuk, S. Uvin, D. Wang, G. Lepage, P. Verheyen, J. Van Campenhout, S. Ertl, J. Rimbock, N. Vaissiere, D. Neel, J. Ramirez, J. Decobert, B. Kuyken, J. Zhang, G. Roelkens
Publié dans: IEEE Photonics Society Summer Topicals Meeting Series (SUM) (invited), Numéro 11-13 July 2022, 2022
Éditeur: IEEE
DOI: 10.1109/sum53465.2022.9858218

III-V-on-Si/SiN lasers realized using micro-transfer-printing

Auteurs: Jing Zhang, Camiel Op de Beeck, Bahawal Haq, Bart Kuyken, Dries Van Thourhout, Joris Van Campenhout, Guy Lepage, Peter Verheyen, Agnieszka Gocalinska, Stijn Cuyvers, Emanuele Pelucchi, Brian Corbett, Artur Hermans, Antonio Jose Trindade, Chris Bower, Roel Baets, Gunther Roelkens, Geert Morthier
Publié dans: Photonis West 2021, Numéro 5 March 2021, 2021, Page(s) Proc. SPIE 11705
Éditeur: SPIE
DOI: 10.1117/12.2577157

High speed transceivers beyond 1.6Tb/s for data center networks

Auteurs: P. Ossieur, B. Moeneclaey, J. Lambrecht, J. Craninckx, E. Martens, J. Van Driessche, J. Declerq, S. Niu, T. Pannier, Y. Gu, J. Zhang, T. Vanackere, D. Maes, R. Oldenbeuving, X. Zhang, J. Van Campenhout, P. Absil, B. Kuyken, X. Yin, G. Torfs, G. Roelkens, J. Bauwelinck
Publié dans: European Conference on Optical Communication (invited), Numéro 01-05 October 2023, 2023
Éditeur: IEEE

Transfer printing for heterogeneous silicon PICs

Auteurs: G. Roelkens, J. Zhang, S. Kumari, J. Juvert, A. Liles, G. Muliuk, J. Goyvaerts, B. Haq, N. Mahmoud, D. Van Thourhout
Publié dans: Smart Systems Integrations, Numéro 10-11 April 2019, 2019, ISBN 978-3-8007-4919-5
Éditeur: VDE

Lossless high-speed silicon photonic MZI switch with a micro-transfer printed III-V amplifier (accepted)

Auteurs: J. Zhang, C. Kruckel, B. Haq, L. Bogaert, J. Rimbock, B. Matuskova, S. Ertl, A. Gocalinska, E. Pelucchi, B. Corbett, J. Van Campenhout, G. Lepage, P. Verheyen, D. Van Thourhout, R. Baets, G. Roelkens
Publié dans: 2022 IEEE 72nd Electronic Components and Technology Conference, Numéro May 31- June 3, 2022, 2022
Éditeur: IEEE

III-V-on-silicon nitride narrow-linewidth tunable laser based on micro-transfer printing

Auteurs: B. Pan, Jerome Bourderionnet, Vincent Billault, Arnaud Brignon, S. Dwivedi, Marcus Dahlem, Cian Cummins, Sandeep S. Saseendran, Nga Pham, Philippe Helin, Nicolas Vaissiere, Delphine Neel, Joan Ramirez, Jean Decobert, Johanna Rimbock, Ruggero Loi, Alin Fecioru, E. Soltanian, J. Zhang, B. Kuyken, G. Roelkens
Publié dans: Optical Fiber Communication Conference, Numéro 05–09 March 2023, 2023
Éditeur: Optica
DOI: 10.1364/ofc.2023.th3b.5

Integration of Quantum Dot Lasers with SOI Waveguides using Micro-Transfer Printing

Auteurs: A. Uzun, Ruggero Loi, Peter Ossieur, Johanna Rimb¨ock, Stefan Erlt, Marianna Pantouvaki, Brian Corbett
Publié dans: IEEE International 3D Systems Integration Conference (3DIC), Numéro May 10-May 12 2023, 2023
Éditeur: IEEE

Integration of quantum dot lasers with SOI waveguides using Micro-Transfer printing

Auteurs: A. Uzun, F. Atar, J. Justice, R. Loi, A. Farrell, P. Ossieur, J. Zhang, G. Roelkens, I. Krestnikov, J. Rimbock, B. Corbett
Publié dans: European Conference on Integrated Optics, Numéro 04–06 May, 2022, 2022
Éditeur: Springer

Micro transfer printing of electronic integrated circuits on Silicon photonics substrates

Auteurs: Ruggero Loi, Prasanna Ramaswamy, Alex Farrell, Antonio Jose Trindade, Alin Fecioru, Johanna Rimböck, Stefan Eartl, Marianna Pantouvaki, Guy Lepage, Joris Van Campenhout, Tinus Pannier, Ye Gu, David Gomez, Patrick Steglich and Peter Ossieur
Publié dans: EUROPEAN CONFERENCE ON INTEGRATED OPTICS 2022, MILAN, Numéro 6/05/2022, 2022
Éditeur: Springer

Micro-Transfer-Printing Technology For Implementing Scalable III-V-on-Si Heterogeneous Integration

Auteurs: G. Muliuk, J. Zhang, G. Roelkens
Publié dans: International Conference on Nanoimprint and Nanoprint Technologies, Numéro December 16.-17..2021, 2021
Éditeur: VTT Technical Research Centre of Finland

Integrated optical transmitter with micro-transfer-printed widely tunable III-V-on-Si laser (accepted)

Auteurs: J. Zhang, E. Soltanian, B. Haq, S. Ertl, J. Rimbock, B. Matuskova, E. Pelucchi, A. Gocalinska, J. Van Campenhout, G. Lepage, P.. Verheyen, W. Bogaerts, G Roelkens
Publié dans: Optical Fiber Communications Conference and Exhibition (OFC 2022), Numéro 06 – 10 March 2022, 2022
Éditeur: Optica Publishing Group

Silicon Photonic Based High-speed Transceivers for Fiber-optic Short-reach Applications

Auteurs: Peter Ossieur
Publié dans: 2019 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA), Numéro 1/04/2019, 2019, Page(s) 1-1, ISBN 978-1-7281-0942-8
Éditeur: IEEE
DOI: 10.1109/vlsi-tsa.2019.8804659

Wafer-level packaging of photonics and electronics for terabit-scale optical interconnects

Auteurs: Dimitris Kalavrouziotis, Paraskevas Bakopoulos
Publié dans: PIERS PhotonIcs & Electromagnetics Research Symposium, 2019
Éditeur: piers

Transfer Printable 64 Gbps Lumped Driver for Optical Communication

Auteurs: Mesut Inac; Adel Fatemi; Friedel Gerfers; Andrea Malignaggi
Publié dans: MikroSystemTechnik Congress 2021, 2021
Éditeur: IEEE

Heterogeneous integration in silicon photonics through micro-transfer-printing

Auteurs: Jing Zhang, Grigorij Muliuk, Jeroen Goyvaerts, Bahawal Haq, Sulakshna Kumari, Joan Juvert, Camiel Op de Beeck, Bart Kuyken, Joris Van Campenhout, Guy Lepage, Peter Verheyen, Agnieszka Gocalinska, Emanuele Pelucchi, Brian Corbett, Antonio Jose Trindade, Chris Bower, Gunther Roelkens
Publié dans: 2019 24th Microoptics Conference (MOC), Numéro The 24th, 17 - 20 Nov 2019, 2019, Page(s) 64-65, ISBN 978-4-86348-712-3
Éditeur: IEEE
DOI: 10.23919/moc46630.2019.8982786

Micro-Transfer-Printing for III-V/Si PICs

Auteurs: J. Zhang, C. Op de Beeck, B. Haq, J. Goyvaerts, S. Cuyvers, S. Kumari, G. Muliuk, A. Hermans, A. Gocalinska, E. Pelucchi, B. Corbett, A.J. Trindade, C. Bower, J. Van Campenhout, G. Lepage, P. Verheyen, B. Kuyken, D. Van Thourhout, G. Morthier, R. Baets, G. Roelkens
Publié dans: 2020 Asia Communications and Photonics Conference (ACP) and International Conference on Information Photonics and Optical Communications (IPOC), Numéro October 24-27, 2020., 2020, Page(s) p.paper T4G.3, ISBN 978-1-943580-82-8
Éditeur: IEEE
DOI: 10.1364/acpc.2020.t4g.3

Micro-Transfer-Printed O-band GaAs QD III-V-on-Si DFB Laser

Auteurs: J. Zhang, I. Krestnikov, R. Loi, P. Ossieur, G. Lepage, P. Verheyen, J. Van Campendhout, D. Van Thourhout, G. Roelkens
Publié dans: European Conference on Integrated Optics, Numéro 04–06 May, 2022, 2023
Éditeur: Springer

III-V/Si PICs based on micro-transfer printing

Auteurs: G. Roelkens, J. Zhang, G. Muliuk, J. Goyvaerts, B. Haq, C. Op de Beeck, A. Liles, Z. Wang, S. Dhoore, S. Kumari, J. Juvert, J. Van Campenhout, B. Kuyken, D. Van Thourhout, B. Corbett
Publié dans: Optical Fiber Communications Conference and Exhibition (OFC 2019), Numéro 3-7 March 2019, 2019, Page(s) p.paper W4E.6
Éditeur: IEEE
DOI: 10.1364/ofc.2019.w4e.6

Integration of Edge-Emitting Quantum Dot Lasers with Different Waveguide Platforms using Micro-Transfer Printing

Auteurs: Ali Uzun; Fatih Bilge Atar; Simone Iadanza; Ruggero Loi; Jing Zhang; Gunther Roelkens; Igor Krestnikov; Johanna Rimbock; Liam OFaolain; Brian Corbett
Publié dans: IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, Numéro 5, 2023, Page(s) 1500210, ISSN 1558-4542
Éditeur: IEEE
DOI: 10.1109/jstqe.2023.3243943

Single-Chip Silicon Photonic Processor for Analog Optical and Microwave Signals

Auteurs: H. Deng, J. Zhang, E. Soltanian, X. Chen, C. Pang, N. Vaissiere, D. Neel, J. Ramirez, J. Decobert, N. Singh, G. Torfs, G. Roelkens, W. Bogaerts
Publié dans: Nature, 2024, ISSN 1476-4687
Éditeur: Springer Nature

Micro-Transfer Printing for Heterogeneous Si Photonic Integrated Circuits

Auteurs: G. Roelkens, J. Zhang, L. Bogaert, M. Billet, D. Wang, B. Pan, C.J. Kruckel, E. Soltanian, D. Maes, T. Vanackere, T. Vandekerckhove, S. Cuyvers, J. De Witte, I. Luntadila, X. Guo, H. Li, S. Qin, G. Muliuk, S. Uvin, B. Haq, C. Op de Beeck, J. Goyvaerts, G. Lepage, P. Verheyen, J. Van Campenhout, G. Morthier, B. Kuyken, D. Van Thourhout, R. Baets
Publié dans: IEEE Journal on Selected Topics in Quantum Electronics, 2023, Page(s) 8200414, ISSN 1558-4542
Éditeur: IEEE
DOI: 10.1109/jstqe.2022.3222686

Present and future of micro-transfer printing for heterogeneous photonic integrated circuits

Auteurs: G. Roelkens, J. Zhang, L. Bogaert, E. Soltanian, M. Billet, A. Uzun, B. Pan, Y. Liu, E. Delli, D. Wang, V. Bonito Oliva, L.Thi Ngoc Tran, X. Guo, H. Li, S. Qin, K. Akritidis, Y. Chen, Y. Xue, M. Niels, D. Maes, M. Kiewiet, T. Reep, T. Vanackere, T. Vandekerckhove, I. Luntadila Lufungula, J. De Witte, L. Reis, S. Poelman, Y. Tan, H. Deng, W. Bogaerts, G. Morthier, D. Van Thourhout, B. Kuyken
Publié dans: APL Photonics, 2024, ISSN 2378-0967
Éditeur: AIP
DOI: 10.1063/5.0181099

Micro-transfer-printed narrow-linewidth III-V-on-Si double laser structure with a combined 110 nm tuning range

Auteurs: Emadreza Soltanian, Grigorij Muliuk, Sarah Uvin, Dongbo Wang, Guy Lepage, Peter Verheyen, Joris Van Campenhout, Stefan Ertl, Johanna Rimböck, Nicolas Vaissiere, Delphine Néel, Joan Ramirez, Jean Decobert, Bart Kuyken, Jing Zhang, and Gunther Roelkens
Publié dans: Optics Express, 2022, Page(s) 39329, ISSN 1094-4087
Éditeur: Optical Society of America
DOI: 10.1364/oe.470497

III-V-on-Si DFB laser with co-integrated power amplifier realised using micro-transfer printing

Auteurs: J. Zhang, L. Bogaert, B. Haq, R. Wang, B. Matuskova, J. Rimbock, S. Ertl, A. Gocalinska, E. Pelucchi, B. Corbett, J. Van Campenhout, G. Lepage, P. Verheyen, G. Morthier, G. Roelkens
Publié dans: IEEE Photonics Technology Letters, 2023, Page(s) 593, ISSN 1941-0174
Éditeur: IEEE
DOI: 10.1109/lpt.2023.3263279

Micro-transfer printing InP C-band SOAs on advanced silicon photonics platform for lossless MZI switch fabrics and high-speed integrated transmitters

Auteurs: J. Zhang, L. Bogaert, C.J. Krückel, E. Soltanian, H. Deng, B. Haq, J.Rimbock, J. Van Kerrebrouck, G. Lepage, P. Verheyen, J. Van Campenhout, P. Ossieur, D. Van Thourhout, G. Morthier, W. Bogaerts, G. Roelkens
Publié dans: Optics Express, 2023, Page(s) 42807, ISSN 1094-4087
Éditeur: Optical Society of America
DOI: 10.1364/oe.505112

III-V-on-Si photonic integrated circuits realized using micro-transfer-printing

Auteurs: Jing Zhang, Grigorij Muliuk, Joan Juvert, Sulakshna Kumari, Jeroen Goyvaerts, Bahawal Haq, Camiel Op de Beeck, Bart Kuyken, Geert Morthier, Dries Van Thourhout, Roel Baets, Guy Lepage, Peter Verheyen, Joris Van Campenhout, Agnieszka Gocalinska, James O’Callaghan, Emanuele Pelucchi, Kevin Thomas, Brian Corbett, António José Trindade, Gunther Roelkens
Publié dans: APL Photonics, Numéro 4/11, 2019, Page(s) 110803, ISSN 2378-0967
Éditeur: AIP
DOI: 10.1063/1.5120004

III-V-on-Si Transceivers Based on Micro-Transfer-Printing

Auteurs: Jing Zhang
Publié dans: 2021
Éditeur: Ghent University

Heterogeneous Integration of InAs/GaAs Quantum Dot Lasers on Silicon Photonics

Auteurs: Sarah Uvin
Publié dans: 2020
Éditeur: Ghent University

Recherche de données OpenAIRE...

Livrables

Publications

Partager cette page

Télécharger