Micro assembled Terabit/s capable optical transceivers for Datacom applications

Risultati finali

Report on performance of ADPSK-16 TxRx-demonstrator

Document reporting on the final performance of the realized 16-ADPSK transceiver demonstrator

Report on performance of PAM-4 TxRx-demonstrator

Document reporting on the final performance of the realized PAM-4 transceiver demonstrator

Initial press release by partners

Press release outlining consortium and goals of the H2020 funded project CALADAN

1st report on the top-level optical transceiver designs

Document outlining the 1st iteration of the top-level optical transceiver high-level specifications

Final report on the top-level optical transceiver designs

Document outlining the final iteration of the toplevel optical transceiver highlevel specifications starting from D14 and taking into account input from design process

Final press release

Press release outlining the final outcome of the H2020 funded project CALADAN

Report on the PAM-4 demonstrator prototype evaluation

Document reporting the laboratory evaluation of the PAM-4 demonstrator

Report on the 16-ADPSK demonstrator prototype evaluation

Document reporting the laboratory evaluation of the 16-ADPSK demonstrator

Data Management Plan

Data Management Plan as required for Open Research Data Pilot

Pubblicazioni

Micro-transfer printing for silicon photonics

Autori: G. Roelkens
Pubblicato in: imec Technology Forum - Photonics 2023, Numero 2023, 2023
Editore: not applicalbe

Design and integration of photonic and electronic integrated circuits for high-speed wireline transceivers

Autori: P. Ossieur
Pubblicato in: PIC International 2022, Numero June-22, 2022
Editore: Not applicable

VCSELs vs SiPh for disaggregated scalable data center architectures

Autori: P. Ossieur, G. Torfs, X. Yin and J. Bauwelinck
Pubblicato in: 2021 European Conference on Optical Communications - Workshop on dissaggregated data centers, Numero Sept-21, 2021
Editore: Not applicable

Micro-transfer printing for heterogeneous electronic-photonic integrated circuits

Autori: G. Roelkens
Pubblicato in: 2024 International Solid-State Circuits Conference - Forum F6 Toward next generation of highly integrated electrical and optical transceivers, Numero Feb-24, 2024
Editore: Not applicable

High Speed transceivers in Silicon Photonics

Autori: P. Ossieur
Pubblicato in: EPIXFab'Summerschool 2022, Numero 2022, 2022
Editore: not applicable

O-band GaAs QD-on-Si integrated optical amplifier realized using micro-transfer printing

Autori: J. Zhang, L. Bogaert, S. Qin, S. Cuyvers, I. Krestnikov, K. Morozov, A. Farrell, R. Loi, D. Gomez, J. Rimbock, P. Ossieur, G. Lepage, P. Verheyen, J. Van Campenhout, G. Morthier, G. Roelkens
Pubblicato in: Optoelectronics and Communications Conference, Numero 02-06 July 2023, 2023
Editore: IEEE

Co-design and integration of broadband electronic and photonic IC's for next-generation optical transceiver applications

Autori: P. Ossieur
Pubblicato in: 2021 ESSDERC and ESSCIRC (European Solid-State Circuits Conference), Numero Sept-21, 2021
Editore: Not applicable

High-speed and sensitive opto-electronics and systems for next-generation optical communication and sensing applications

Autori: P. Ossieur
Pubblicato in: imec Technology Forum - Photonics 2022, Numero 2020, 2020
Editore: not applicable

Enabling integrated photonics at scale through micro transfer printing

Autori: Ruggero Loi
Pubblicato in: EPIC Technology Meeting on Microelectronics & Photonics – Two Sides of One Coin –, Numero 14/11/2023, 2023
Editore: EPIC

Integration of photonics and electronics for optical access

Autori: P. Ossieur
Pubblicato in: 2021 Optical Fiber Conference - Is Photonic Integration ready for next-generation optical access, Numero 1/06/2021, 2021
Editore: not applicable

Photonic integrated circuits realized using micro-transfer printing

Autori: J. Zhang, L. Bogaert, M. Billet, D. Wang, B. Pan, S. Qin, E. Soltanian, S. Cuyvers, D. Maes, T. Vanackere, T. Vandekerckhove, S. Poelman, M. Kiewiet, I. Luntadila Lufungula, X. Guo, H. Li, J. De Witte, G. Lepage, P. Verheyen, J. Van Campenhout, B. Kuyken, G. Morthier, D. Van Thourhout, R. Baets, G. Roelkens
Pubblicato in: PhotonIcs and Electromagnetics Research Symposium(invited), Numero 3-6 July, 2023, 2023
Editore: IEEE

Dense integration of Photonics and Electronics through micro-transfer printing

Autori: Ruggero Loi, Prasanna Ramaswamy, Alex Farrell, Antonio Jose Trindade, Alin Fecioru, Johanna Rimböck, Marianna Pantouvaki, Guy Lepage, Joris Van Campenhout, Tinus Pannier, Ye Gu, David Gomez, Patrick Steglich and Peter Ossieur
Pubblicato in: 2022 European Conference on Optical Communications - Workshop 13 - Photonic and Electronic co-integration solutions, Numero Sept-22, 2022
Editore: Not applicable

Micro Transfer Printing for Integrated Photonics

Autori: Ruggero Loi
Pubblicato in: EPIC Online Technology Meeting on Hybrid Photonics Integration, Numero 18 set 2023, 2023
Editore: EPIC

High Speed transceivers in Silicon Photonics

Autori: P. Ossieur
Pubblicato in: EPIXFab'Summerschool 2023, Numero 2023, 2023
Editore: not applicable

Scaling datacenter networks with photonic integration

Autori: Elad Mentovich
Pubblicato in: 7th International Symposium for Optical Interconnect in Data Centres, 2019
Editore: IEEE

Electronics and photonics for beyond 200Gbps capable transceivers

Autori: P. Ossieur
Pubblicato in: 2023 International Solid-State Circuits Conference - Forum F1 Transceivers for Exascale, Numero Feb-23, 2023
Editore: Not applicable

Patterned InterVia for Heterogeneous Integration of III-V devices onto silicon photonics by using micro-Transfer Printing

Autori: Ali Uzun, Johanna Rimböck, Jacek Gasiorowski, , Alex Farrell, Alin Fecioru, Ruggero Loi and Brian Corbett
Pubblicato in: 3DIC conference 2023, Cork, Numero 11/05/2023, 2023
Editore: IEEE

micro-transfer-printing for photonic integrated circuits

Autori: J. Zhang, G. Muliuk, C. Op de Beeck, J. Goyvaerts, B. Haq, S. Kumari, B. Kuyken, J. Van Campenhout, R. Baets, G. Roelkens, J. Van Campenhout, G. Lepage, P. Verheyen, A. Gocalinska, E. Pelucchi, B. Corbett, A. Jose Trindade, C. Bower
Pubblicato in: International Conference on Wafer Bonding, Numero 2nd-4th Dec. 2019 (Wafer Bond '2019), 2019
Editore: Fraunhofer

Micro-transfer-printed O-band GaAs QD-on-Si DFB Laser on an advanced silicon photonics platform

Autori: J. Zhang, S. Qin, L. Bogaert, I. Krestnikov, K. Morozov, J. Rimbock, A. Farrel, R. Loi, D. Gomez, P. Ossieur, G. Lepage, P. Verheyen, J. Van Campenhout, G. Morthier, G. Roelkens
Pubblicato in: European Conference on Integrated Optics(TOP SCORING SESSION), Numero 19-21 April 2023, 2023
Editore: Springer

Compact and Transfer Printable 64 Gb/s Differential Transimpedance Amplifier in 130-nm BiCMOS

Autori: Mesut Inac; Adel Fatemi; Friedel Gerfers; Andrea Malignaggi
Pubblicato in: 2020 15th European Microwave Integrated Circuits Conference (EuMIC), 2021
Editore: IEEE

Narrow-Linewidth Micro-Transfer-Printed III-V-on-Si Laser with 110 nm Tuning Range

Autori: E. Soltanian, G. Muliuk, S. Uvin, D. Wang, G. Lepage, P. Verheyen, J. Van Campenhout, S. Ertl, J. Rimbock, N. Vaissiere, D. Neel, J. Ramirez, J. Decobert, B. Kuyken, J. Zhang, G. Roelkens
Pubblicato in: IEEE Photonics Society Summer Topicals Meeting Series (SUM) (invited), Numero 11-13 July 2022, 2022
Editore: IEEE
DOI: 10.1109/sum53465.2022.9858218

III-V-on-Si/SiN lasers realized using micro-transfer-printing

Autori: Jing Zhang, Camiel Op de Beeck, Bahawal Haq, Bart Kuyken, Dries Van Thourhout, Joris Van Campenhout, Guy Lepage, Peter Verheyen, Agnieszka Gocalinska, Stijn Cuyvers, Emanuele Pelucchi, Brian Corbett, Artur Hermans, Antonio Jose Trindade, Chris Bower, Roel Baets, Gunther Roelkens, Geert Morthier
Pubblicato in: Photonis West 2021, Numero 5 March 2021, 2021, Pagina/e Proc. SPIE 11705
Editore: SPIE
DOI: 10.1117/12.2577157

High speed transceivers beyond 1.6Tb/s for data center networks

Autori: P. Ossieur, B. Moeneclaey, J. Lambrecht, J. Craninckx, E. Martens, J. Van Driessche, J. Declerq, S. Niu, T. Pannier, Y. Gu, J. Zhang, T. Vanackere, D. Maes, R. Oldenbeuving, X. Zhang, J. Van Campenhout, P. Absil, B. Kuyken, X. Yin, G. Torfs, G. Roelkens, J. Bauwelinck
Pubblicato in: European Conference on Optical Communication (invited), Numero 01-05 October 2023, 2023
Editore: IEEE

Transfer printing for heterogeneous silicon PICs

Autori: G. Roelkens, J. Zhang, S. Kumari, J. Juvert, A. Liles, G. Muliuk, J. Goyvaerts, B. Haq, N. Mahmoud, D. Van Thourhout
Pubblicato in: Smart Systems Integrations, Numero 10-11 April 2019, 2019, ISBN 978-3-8007-4919-5
Editore: VDE

Lossless high-speed silicon photonic MZI switch with a micro-transfer printed III-V amplifier (accepted)

Autori: J. Zhang, C. Kruckel, B. Haq, L. Bogaert, J. Rimbock, B. Matuskova, S. Ertl, A. Gocalinska, E. Pelucchi, B. Corbett, J. Van Campenhout, G. Lepage, P. Verheyen, D. Van Thourhout, R. Baets, G. Roelkens
Pubblicato in: 2022 IEEE 72nd Electronic Components and Technology Conference, Numero May 31- June 3, 2022, 2022
Editore: IEEE

III-V-on-silicon nitride narrow-linewidth tunable laser based on micro-transfer printing

Autori: B. Pan, Jerome Bourderionnet, Vincent Billault, Arnaud Brignon, S. Dwivedi, Marcus Dahlem, Cian Cummins, Sandeep S. Saseendran, Nga Pham, Philippe Helin, Nicolas Vaissiere, Delphine Neel, Joan Ramirez, Jean Decobert, Johanna Rimbock, Ruggero Loi, Alin Fecioru, E. Soltanian, J. Zhang, B. Kuyken, G. Roelkens
Pubblicato in: Optical Fiber Communication Conference, Numero 05–09 March 2023, 2023
Editore: Optica
DOI: 10.1364/ofc.2023.th3b.5

Integration of Quantum Dot Lasers with SOI Waveguides using Micro-Transfer Printing

Autori: A. Uzun, Ruggero Loi, Peter Ossieur, Johanna Rimb¨ock, Stefan Erlt, Marianna Pantouvaki, Brian Corbett
Pubblicato in: IEEE International 3D Systems Integration Conference (3DIC), Numero May 10-May 12 2023, 2023
Editore: IEEE

Integration of quantum dot lasers with SOI waveguides using Micro-Transfer printing

Autori: A. Uzun, F. Atar, J. Justice, R. Loi, A. Farrell, P. Ossieur, J. Zhang, G. Roelkens, I. Krestnikov, J. Rimbock, B. Corbett
Pubblicato in: European Conference on Integrated Optics, Numero 04–06 May, 2022, 2022
Editore: Springer

Micro transfer printing of electronic integrated circuits on Silicon photonics substrates

Autori: Ruggero Loi, Prasanna Ramaswamy, Alex Farrell, Antonio Jose Trindade, Alin Fecioru, Johanna Rimböck, Stefan Eartl, Marianna Pantouvaki, Guy Lepage, Joris Van Campenhout, Tinus Pannier, Ye Gu, David Gomez, Patrick Steglich and Peter Ossieur
Pubblicato in: EUROPEAN CONFERENCE ON INTEGRATED OPTICS 2022, MILAN, Numero 6/05/2022, 2022
Editore: Springer

Micro-Transfer-Printing Technology For Implementing Scalable III-V-on-Si Heterogeneous Integration

Autori: G. Muliuk, J. Zhang, G. Roelkens
Pubblicato in: International Conference on Nanoimprint and Nanoprint Technologies, Numero December 16.-17..2021, 2021
Editore: VTT Technical Research Centre of Finland

Integrated optical transmitter with micro-transfer-printed widely tunable III-V-on-Si laser (accepted)

Autori: J. Zhang, E. Soltanian, B. Haq, S. Ertl, J. Rimbock, B. Matuskova, E. Pelucchi, A. Gocalinska, J. Van Campenhout, G. Lepage, P.. Verheyen, W. Bogaerts, G Roelkens
Pubblicato in: Optical Fiber Communications Conference and Exhibition (OFC 2022), Numero 06 – 10 March 2022, 2022
Editore: Optica Publishing Group

Silicon Photonic Based High-speed Transceivers for Fiber-optic Short-reach Applications

Autori: Peter Ossieur
Pubblicato in: 2019 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA), Numero 1/04/2019, 2019, Pagina/e 1-1, ISBN 978-1-7281-0942-8
Editore: IEEE
DOI: 10.1109/vlsi-tsa.2019.8804659

Wafer-level packaging of photonics and electronics for terabit-scale optical interconnects

Autori: Dimitris Kalavrouziotis, Paraskevas Bakopoulos
Pubblicato in: PIERS PhotonIcs & Electromagnetics Research Symposium, 2019
Editore: piers

Transfer Printable 64 Gbps Lumped Driver for Optical Communication

Autori: Mesut Inac; Adel Fatemi; Friedel Gerfers; Andrea Malignaggi
Pubblicato in: MikroSystemTechnik Congress 2021, 2021
Editore: IEEE

Heterogeneous integration in silicon photonics through micro-transfer-printing

Autori: Jing Zhang, Grigorij Muliuk, Jeroen Goyvaerts, Bahawal Haq, Sulakshna Kumari, Joan Juvert, Camiel Op de Beeck, Bart Kuyken, Joris Van Campenhout, Guy Lepage, Peter Verheyen, Agnieszka Gocalinska, Emanuele Pelucchi, Brian Corbett, Antonio Jose Trindade, Chris Bower, Gunther Roelkens
Pubblicato in: 2019 24th Microoptics Conference (MOC), Numero The 24th, 17 - 20 Nov 2019, 2019, Pagina/e 64-65, ISBN 978-4-86348-712-3
Editore: IEEE
DOI: 10.23919/moc46630.2019.8982786

Micro-Transfer-Printing for III-V/Si PICs

Autori: J. Zhang, C. Op de Beeck, B. Haq, J. Goyvaerts, S. Cuyvers, S. Kumari, G. Muliuk, A. Hermans, A. Gocalinska, E. Pelucchi, B. Corbett, A.J. Trindade, C. Bower, J. Van Campenhout, G. Lepage, P. Verheyen, B. Kuyken, D. Van Thourhout, G. Morthier, R. Baets, G. Roelkens
Pubblicato in: 2020 Asia Communications and Photonics Conference (ACP) and International Conference on Information Photonics and Optical Communications (IPOC), Numero October 24-27, 2020., 2020, Pagina/e p.paper T4G.3, ISBN 978-1-943580-82-8
Editore: IEEE
DOI: 10.1364/acpc.2020.t4g.3

Micro-Transfer-Printed O-band GaAs QD III-V-on-Si DFB Laser

Autori: J. Zhang, I. Krestnikov, R. Loi, P. Ossieur, G. Lepage, P. Verheyen, J. Van Campendhout, D. Van Thourhout, G. Roelkens
Pubblicato in: European Conference on Integrated Optics, Numero 04–06 May, 2022, 2023
Editore: Springer

III-V/Si PICs based on micro-transfer printing

Autori: G. Roelkens, J. Zhang, G. Muliuk, J. Goyvaerts, B. Haq, C. Op de Beeck, A. Liles, Z. Wang, S. Dhoore, S. Kumari, J. Juvert, J. Van Campenhout, B. Kuyken, D. Van Thourhout, B. Corbett
Pubblicato in: Optical Fiber Communications Conference and Exhibition (OFC 2019), Numero 3-7 March 2019, 2019, Pagina/e p.paper W4E.6
Editore: IEEE
DOI: 10.1364/ofc.2019.w4e.6

Integration of Edge-Emitting Quantum Dot Lasers with Different Waveguide Platforms using Micro-Transfer Printing

Autori: Ali Uzun; Fatih Bilge Atar; Simone Iadanza; Ruggero Loi; Jing Zhang; Gunther Roelkens; Igor Krestnikov; Johanna Rimbock; Liam OFaolain; Brian Corbett
Pubblicato in: IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, Numero 5, 2023, Pagina/e 1500210, ISSN 1558-4542
Editore: IEEE
DOI: 10.1109/jstqe.2023.3243943

Single-Chip Silicon Photonic Processor for Analog Optical and Microwave Signals

Autori: H. Deng, J. Zhang, E. Soltanian, X. Chen, C. Pang, N. Vaissiere, D. Neel, J. Ramirez, J. Decobert, N. Singh, G. Torfs, G. Roelkens, W. Bogaerts
Pubblicato in: Nature, 2024, ISSN 1476-4687
Editore: Springer Nature

Micro-Transfer Printing for Heterogeneous Si Photonic Integrated Circuits

Autori: G. Roelkens, J. Zhang, L. Bogaert, M. Billet, D. Wang, B. Pan, C.J. Kruckel, E. Soltanian, D. Maes, T. Vanackere, T. Vandekerckhove, S. Cuyvers, J. De Witte, I. Luntadila, X. Guo, H. Li, S. Qin, G. Muliuk, S. Uvin, B. Haq, C. Op de Beeck, J. Goyvaerts, G. Lepage, P. Verheyen, J. Van Campenhout, G. Morthier, B. Kuyken, D. Van Thourhout, R. Baets
Pubblicato in: IEEE Journal on Selected Topics in Quantum Electronics, 2023, Pagina/e 8200414, ISSN 1558-4542
Editore: IEEE
DOI: 10.1109/jstqe.2022.3222686

Present and future of micro-transfer printing for heterogeneous photonic integrated circuits

Autori: G. Roelkens, J. Zhang, L. Bogaert, E. Soltanian, M. Billet, A. Uzun, B. Pan, Y. Liu, E. Delli, D. Wang, V. Bonito Oliva, L.Thi Ngoc Tran, X. Guo, H. Li, S. Qin, K. Akritidis, Y. Chen, Y. Xue, M. Niels, D. Maes, M. Kiewiet, T. Reep, T. Vanackere, T. Vandekerckhove, I. Luntadila Lufungula, J. De Witte, L. Reis, S. Poelman, Y. Tan, H. Deng, W. Bogaerts, G. Morthier, D. Van Thourhout, B. Kuyken
Pubblicato in: APL Photonics, 2024, ISSN 2378-0967
Editore: AIP
DOI: 10.1063/5.0181099

Micro-transfer-printed narrow-linewidth III-V-on-Si double laser structure with a combined 110 nm tuning range

Autori: Emadreza Soltanian, Grigorij Muliuk, Sarah Uvin, Dongbo Wang, Guy Lepage, Peter Verheyen, Joris Van Campenhout, Stefan Ertl, Johanna Rimböck, Nicolas Vaissiere, Delphine Néel, Joan Ramirez, Jean Decobert, Bart Kuyken, Jing Zhang, and Gunther Roelkens
Pubblicato in: Optics Express, 2022, Pagina/e 39329, ISSN 1094-4087
Editore: Optical Society of America
DOI: 10.1364/oe.470497

III-V-on-Si DFB laser with co-integrated power amplifier realised using micro-transfer printing

Autori: J. Zhang, L. Bogaert, B. Haq, R. Wang, B. Matuskova, J. Rimbock, S. Ertl, A. Gocalinska, E. Pelucchi, B. Corbett, J. Van Campenhout, G. Lepage, P. Verheyen, G. Morthier, G. Roelkens
Pubblicato in: IEEE Photonics Technology Letters, 2023, Pagina/e 593, ISSN 1941-0174
Editore: IEEE
DOI: 10.1109/lpt.2023.3263279

Micro-transfer printing InP C-band SOAs on advanced silicon photonics platform for lossless MZI switch fabrics and high-speed integrated transmitters

Autori: J. Zhang, L. Bogaert, C.J. Krückel, E. Soltanian, H. Deng, B. Haq, J.Rimbock, J. Van Kerrebrouck, G. Lepage, P. Verheyen, J. Van Campenhout, P. Ossieur, D. Van Thourhout, G. Morthier, W. Bogaerts, G. Roelkens
Pubblicato in: Optics Express, 2023, Pagina/e 42807, ISSN 1094-4087
Editore: Optical Society of America
DOI: 10.1364/oe.505112

III-V-on-Si photonic integrated circuits realized using micro-transfer-printing

Autori: Jing Zhang, Grigorij Muliuk, Joan Juvert, Sulakshna Kumari, Jeroen Goyvaerts, Bahawal Haq, Camiel Op de Beeck, Bart Kuyken, Geert Morthier, Dries Van Thourhout, Roel Baets, Guy Lepage, Peter Verheyen, Joris Van Campenhout, Agnieszka Gocalinska, James O’Callaghan, Emanuele Pelucchi, Kevin Thomas, Brian Corbett, António José Trindade, Gunther Roelkens
Pubblicato in: APL Photonics, Numero 4/11, 2019, Pagina/e 110803, ISSN 2378-0967
Editore: AIP
DOI: 10.1063/1.5120004

III-V-on-Si Transceivers Based on Micro-Transfer-Printing

Autori: Jing Zhang
Pubblicato in: 2021
Editore: Ghent University

Heterogeneous Integration of InAs/GaAs Quantum Dot Lasers on Silicon Photonics

Autori: Sarah Uvin
Pubblicato in: 2020
Editore: Ghent University

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