Micro assembled Terabit/s capable optical transceivers for Datacom applications

Rezultaty

Report on performance of ADPSK-16 TxRx-demonstrator

Document reporting on the final performance of the realized 16-ADPSK transceiver demonstrator

Report on performance of PAM-4 TxRx-demonstrator

Document reporting on the final performance of the realized PAM-4 transceiver demonstrator

Initial press release by partners

Press release outlining consortium and goals of the H2020 funded project CALADAN

1st report on the top-level optical transceiver designs

Document outlining the 1st iteration of the top-level optical transceiver high-level specifications

Final report on the top-level optical transceiver designs

Document outlining the final iteration of the toplevel optical transceiver highlevel specifications starting from D14 and taking into account input from design process

Final press release

Press release outlining the final outcome of the H2020 funded project CALADAN

Report on the PAM-4 demonstrator prototype evaluation

Document reporting the laboratory evaluation of the PAM-4 demonstrator

Report on the 16-ADPSK demonstrator prototype evaluation

Document reporting the laboratory evaluation of the 16-ADPSK demonstrator

Data Management Plan

Data Management Plan as required for Open Research Data Pilot

Publikacje

Micro-transfer printing for silicon photonics

Autorzy: G. Roelkens
Opublikowane w: imec Technology Forum - Photonics 2023, Numer 2023, 2023
Wydawca: not applicalbe

Design and integration of photonic and electronic integrated circuits for high-speed wireline transceivers

Autorzy: P. Ossieur
Opublikowane w: PIC International 2022, Numer June-22, 2022
Wydawca: Not applicable

VCSELs vs SiPh for disaggregated scalable data center architectures

Autorzy: P. Ossieur, G. Torfs, X. Yin and J. Bauwelinck
Opublikowane w: 2021 European Conference on Optical Communications - Workshop on dissaggregated data centers, Numer Sept-21, 2021
Wydawca: Not applicable

Micro-transfer printing for heterogeneous electronic-photonic integrated circuits

Autorzy: G. Roelkens
Opublikowane w: 2024 International Solid-State Circuits Conference - Forum F6 Toward next generation of highly integrated electrical and optical transceivers, Numer Feb-24, 2024
Wydawca: Not applicable

High Speed transceivers in Silicon Photonics

Autorzy: P. Ossieur
Opublikowane w: EPIXFab'Summerschool 2022, Numer 2022, 2022
Wydawca: not applicable

O-band GaAs QD-on-Si integrated optical amplifier realized using micro-transfer printing

Autorzy: J. Zhang, L. Bogaert, S. Qin, S. Cuyvers, I. Krestnikov, K. Morozov, A. Farrell, R. Loi, D. Gomez, J. Rimbock, P. Ossieur, G. Lepage, P. Verheyen, J. Van Campenhout, G. Morthier, G. Roelkens
Opublikowane w: Optoelectronics and Communications Conference, Numer 02-06 July 2023, 2023
Wydawca: IEEE

Co-design and integration of broadband electronic and photonic IC's for next-generation optical transceiver applications

Autorzy: P. Ossieur
Opublikowane w: 2021 ESSDERC and ESSCIRC (European Solid-State Circuits Conference), Numer Sept-21, 2021
Wydawca: Not applicable

High-speed and sensitive opto-electronics and systems for next-generation optical communication and sensing applications

Autorzy: P. Ossieur
Opublikowane w: imec Technology Forum - Photonics 2022, Numer 2020, 2020
Wydawca: not applicable

Enabling integrated photonics at scale through micro transfer printing

Autorzy: Ruggero Loi
Opublikowane w: EPIC Technology Meeting on Microelectronics & Photonics – Two Sides of One Coin –, Numer 14/11/2023, 2023
Wydawca: EPIC

Integration of photonics and electronics for optical access

Autorzy: P. Ossieur
Opublikowane w: 2021 Optical Fiber Conference - Is Photonic Integration ready for next-generation optical access, Numer 1/06/2021, 2021
Wydawca: not applicable

Photonic integrated circuits realized using micro-transfer printing

Autorzy: J. Zhang, L. Bogaert, M. Billet, D. Wang, B. Pan, S. Qin, E. Soltanian, S. Cuyvers, D. Maes, T. Vanackere, T. Vandekerckhove, S. Poelman, M. Kiewiet, I. Luntadila Lufungula, X. Guo, H. Li, J. De Witte, G. Lepage, P. Verheyen, J. Van Campenhout, B. Kuyken, G. Morthier, D. Van Thourhout, R. Baets, G. Roelkens
Opublikowane w: PhotonIcs and Electromagnetics Research Symposium(invited), Numer 3-6 July, 2023, 2023
Wydawca: IEEE

Dense integration of Photonics and Electronics through micro-transfer printing

Autorzy: Ruggero Loi, Prasanna Ramaswamy, Alex Farrell, Antonio Jose Trindade, Alin Fecioru, Johanna Rimböck, Marianna Pantouvaki, Guy Lepage, Joris Van Campenhout, Tinus Pannier, Ye Gu, David Gomez, Patrick Steglich and Peter Ossieur
Opublikowane w: 2022 European Conference on Optical Communications - Workshop 13 - Photonic and Electronic co-integration solutions, Numer Sept-22, 2022
Wydawca: Not applicable

Micro Transfer Printing for Integrated Photonics

Autorzy: Ruggero Loi
Opublikowane w: EPIC Online Technology Meeting on Hybrid Photonics Integration, Numer 18 set 2023, 2023
Wydawca: EPIC

High Speed transceivers in Silicon Photonics

Autorzy: P. Ossieur
Opublikowane w: EPIXFab'Summerschool 2023, Numer 2023, 2023
Wydawca: not applicable

Scaling datacenter networks with photonic integration

Autorzy: Elad Mentovich
Opublikowane w: 7th International Symposium for Optical Interconnect in Data Centres, 2019
Wydawca: IEEE

Electronics and photonics for beyond 200Gbps capable transceivers

Autorzy: P. Ossieur
Opublikowane w: 2023 International Solid-State Circuits Conference - Forum F1 Transceivers for Exascale, Numer Feb-23, 2023
Wydawca: Not applicable

Patterned InterVia for Heterogeneous Integration of III-V devices onto silicon photonics by using micro-Transfer Printing

Autorzy: Ali Uzun, Johanna Rimböck, Jacek Gasiorowski, , Alex Farrell, Alin Fecioru, Ruggero Loi and Brian Corbett
Opublikowane w: 3DIC conference 2023, Cork, Numer 11/05/2023, 2023
Wydawca: IEEE

micro-transfer-printing for photonic integrated circuits

Autorzy: J. Zhang, G. Muliuk, C. Op de Beeck, J. Goyvaerts, B. Haq, S. Kumari, B. Kuyken, J. Van Campenhout, R. Baets, G. Roelkens, J. Van Campenhout, G. Lepage, P. Verheyen, A. Gocalinska, E. Pelucchi, B. Corbett, A. Jose Trindade, C. Bower
Opublikowane w: International Conference on Wafer Bonding, Numer 2nd-4th Dec. 2019 (Wafer Bond '2019), 2019
Wydawca: Fraunhofer

Micro-transfer-printed O-band GaAs QD-on-Si DFB Laser on an advanced silicon photonics platform

Autorzy: J. Zhang, S. Qin, L. Bogaert, I. Krestnikov, K. Morozov, J. Rimbock, A. Farrel, R. Loi, D. Gomez, P. Ossieur, G. Lepage, P. Verheyen, J. Van Campenhout, G. Morthier, G. Roelkens
Opublikowane w: European Conference on Integrated Optics(TOP SCORING SESSION), Numer 19-21 April 2023, 2023
Wydawca: Springer

Compact and Transfer Printable 64 Gb/s Differential Transimpedance Amplifier in 130-nm BiCMOS

Autorzy: Mesut Inac; Adel Fatemi; Friedel Gerfers; Andrea Malignaggi
Opublikowane w: 2020 15th European Microwave Integrated Circuits Conference (EuMIC), 2021
Wydawca: IEEE

Narrow-Linewidth Micro-Transfer-Printed III-V-on-Si Laser with 110 nm Tuning Range

Autorzy: E. Soltanian, G. Muliuk, S. Uvin, D. Wang, G. Lepage, P. Verheyen, J. Van Campenhout, S. Ertl, J. Rimbock, N. Vaissiere, D. Neel, J. Ramirez, J. Decobert, B. Kuyken, J. Zhang, G. Roelkens
Opublikowane w: IEEE Photonics Society Summer Topicals Meeting Series (SUM) (invited), Numer 11-13 July 2022, 2022
Wydawca: IEEE
DOI: 10.1109/sum53465.2022.9858218

III-V-on-Si/SiN lasers realized using micro-transfer-printing

Autorzy: Jing Zhang, Camiel Op de Beeck, Bahawal Haq, Bart Kuyken, Dries Van Thourhout, Joris Van Campenhout, Guy Lepage, Peter Verheyen, Agnieszka Gocalinska, Stijn Cuyvers, Emanuele Pelucchi, Brian Corbett, Artur Hermans, Antonio Jose Trindade, Chris Bower, Roel Baets, Gunther Roelkens, Geert Morthier
Opublikowane w: Photonis West 2021, Numer 5 March 2021, 2021, Strona(/y) Proc. SPIE 11705
Wydawca: SPIE
DOI: 10.1117/12.2577157

High speed transceivers beyond 1.6Tb/s for data center networks

Autorzy: P. Ossieur, B. Moeneclaey, J. Lambrecht, J. Craninckx, E. Martens, J. Van Driessche, J. Declerq, S. Niu, T. Pannier, Y. Gu, J. Zhang, T. Vanackere, D. Maes, R. Oldenbeuving, X. Zhang, J. Van Campenhout, P. Absil, B. Kuyken, X. Yin, G. Torfs, G. Roelkens, J. Bauwelinck
Opublikowane w: European Conference on Optical Communication (invited), Numer 01-05 October 2023, 2023
Wydawca: IEEE

Transfer printing for heterogeneous silicon PICs

Autorzy: G. Roelkens, J. Zhang, S. Kumari, J. Juvert, A. Liles, G. Muliuk, J. Goyvaerts, B. Haq, N. Mahmoud, D. Van Thourhout
Opublikowane w: Smart Systems Integrations, Numer 10-11 April 2019, 2019, ISBN 978-3-8007-4919-5
Wydawca: VDE

Lossless high-speed silicon photonic MZI switch with a micro-transfer printed III-V amplifier (accepted)

Autorzy: J. Zhang, C. Kruckel, B. Haq, L. Bogaert, J. Rimbock, B. Matuskova, S. Ertl, A. Gocalinska, E. Pelucchi, B. Corbett, J. Van Campenhout, G. Lepage, P. Verheyen, D. Van Thourhout, R. Baets, G. Roelkens
Opublikowane w: 2022 IEEE 72nd Electronic Components and Technology Conference, Numer May 31- June 3, 2022, 2022
Wydawca: IEEE

III-V-on-silicon nitride narrow-linewidth tunable laser based on micro-transfer printing

Autorzy: B. Pan, Jerome Bourderionnet, Vincent Billault, Arnaud Brignon, S. Dwivedi, Marcus Dahlem, Cian Cummins, Sandeep S. Saseendran, Nga Pham, Philippe Helin, Nicolas Vaissiere, Delphine Neel, Joan Ramirez, Jean Decobert, Johanna Rimbock, Ruggero Loi, Alin Fecioru, E. Soltanian, J. Zhang, B. Kuyken, G. Roelkens
Opublikowane w: Optical Fiber Communication Conference, Numer 05–09 March 2023, 2023
Wydawca: Optica
DOI: 10.1364/ofc.2023.th3b.5

Integration of Quantum Dot Lasers with SOI Waveguides using Micro-Transfer Printing

Autorzy: A. Uzun, Ruggero Loi, Peter Ossieur, Johanna Rimb¨ock, Stefan Erlt, Marianna Pantouvaki, Brian Corbett
Opublikowane w: IEEE International 3D Systems Integration Conference (3DIC), Numer May 10-May 12 2023, 2023
Wydawca: IEEE

Integration of quantum dot lasers with SOI waveguides using Micro-Transfer printing

Autorzy: A. Uzun, F. Atar, J. Justice, R. Loi, A. Farrell, P. Ossieur, J. Zhang, G. Roelkens, I. Krestnikov, J. Rimbock, B. Corbett
Opublikowane w: European Conference on Integrated Optics, Numer 04–06 May, 2022, 2022
Wydawca: Springer

Micro transfer printing of electronic integrated circuits on Silicon photonics substrates

Autorzy: Ruggero Loi, Prasanna Ramaswamy, Alex Farrell, Antonio Jose Trindade, Alin Fecioru, Johanna Rimböck, Stefan Eartl, Marianna Pantouvaki, Guy Lepage, Joris Van Campenhout, Tinus Pannier, Ye Gu, David Gomez, Patrick Steglich and Peter Ossieur
Opublikowane w: EUROPEAN CONFERENCE ON INTEGRATED OPTICS 2022, MILAN, Numer 6/05/2022, 2022
Wydawca: Springer

Micro-Transfer-Printing Technology For Implementing Scalable III-V-on-Si Heterogeneous Integration

Autorzy: G. Muliuk, J. Zhang, G. Roelkens
Opublikowane w: International Conference on Nanoimprint and Nanoprint Technologies, Numer December 16.-17..2021, 2021
Wydawca: VTT Technical Research Centre of Finland

Integrated optical transmitter with micro-transfer-printed widely tunable III-V-on-Si laser (accepted)

Autorzy: J. Zhang, E. Soltanian, B. Haq, S. Ertl, J. Rimbock, B. Matuskova, E. Pelucchi, A. Gocalinska, J. Van Campenhout, G. Lepage, P.. Verheyen, W. Bogaerts, G Roelkens
Opublikowane w: Optical Fiber Communications Conference and Exhibition (OFC 2022), Numer 06 – 10 March 2022, 2022
Wydawca: Optica Publishing Group

Silicon Photonic Based High-speed Transceivers for Fiber-optic Short-reach Applications

Autorzy: Peter Ossieur
Opublikowane w: 2019 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA), Numer 1/04/2019, 2019, Strona(/y) 1-1, ISBN 978-1-7281-0942-8
Wydawca: IEEE
DOI: 10.1109/vlsi-tsa.2019.8804659

Wafer-level packaging of photonics and electronics for terabit-scale optical interconnects

Autorzy: Dimitris Kalavrouziotis, Paraskevas Bakopoulos
Opublikowane w: PIERS PhotonIcs & Electromagnetics Research Symposium, 2019
Wydawca: piers

Transfer Printable 64 Gbps Lumped Driver for Optical Communication

Autorzy: Mesut Inac; Adel Fatemi; Friedel Gerfers; Andrea Malignaggi
Opublikowane w: MikroSystemTechnik Congress 2021, 2021
Wydawca: IEEE

Heterogeneous integration in silicon photonics through micro-transfer-printing

Autorzy: Jing Zhang, Grigorij Muliuk, Jeroen Goyvaerts, Bahawal Haq, Sulakshna Kumari, Joan Juvert, Camiel Op de Beeck, Bart Kuyken, Joris Van Campenhout, Guy Lepage, Peter Verheyen, Agnieszka Gocalinska, Emanuele Pelucchi, Brian Corbett, Antonio Jose Trindade, Chris Bower, Gunther Roelkens
Opublikowane w: 2019 24th Microoptics Conference (MOC), Numer The 24th, 17 - 20 Nov 2019, 2019, Strona(/y) 64-65, ISBN 978-4-86348-712-3
Wydawca: IEEE
DOI: 10.23919/moc46630.2019.8982786

Micro-Transfer-Printing for III-V/Si PICs

Autorzy: J. Zhang, C. Op de Beeck, B. Haq, J. Goyvaerts, S. Cuyvers, S. Kumari, G. Muliuk, A. Hermans, A. Gocalinska, E. Pelucchi, B. Corbett, A.J. Trindade, C. Bower, J. Van Campenhout, G. Lepage, P. Verheyen, B. Kuyken, D. Van Thourhout, G. Morthier, R. Baets, G. Roelkens
Opublikowane w: 2020 Asia Communications and Photonics Conference (ACP) and International Conference on Information Photonics and Optical Communications (IPOC), Numer October 24-27, 2020., 2020, Strona(/y) p.paper T4G.3, ISBN 978-1-943580-82-8
Wydawca: IEEE
DOI: 10.1364/acpc.2020.t4g.3

Micro-Transfer-Printed O-band GaAs QD III-V-on-Si DFB Laser

Autorzy: J. Zhang, I. Krestnikov, R. Loi, P. Ossieur, G. Lepage, P. Verheyen, J. Van Campendhout, D. Van Thourhout, G. Roelkens
Opublikowane w: European Conference on Integrated Optics, Numer 04–06 May, 2022, 2023
Wydawca: Springer

III-V/Si PICs based on micro-transfer printing

Autorzy: G. Roelkens, J. Zhang, G. Muliuk, J. Goyvaerts, B. Haq, C. Op de Beeck, A. Liles, Z. Wang, S. Dhoore, S. Kumari, J. Juvert, J. Van Campenhout, B. Kuyken, D. Van Thourhout, B. Corbett
Opublikowane w: Optical Fiber Communications Conference and Exhibition (OFC 2019), Numer 3-7 March 2019, 2019, Strona(/y) p.paper W4E.6
Wydawca: IEEE
DOI: 10.1364/ofc.2019.w4e.6

Integration of Edge-Emitting Quantum Dot Lasers with Different Waveguide Platforms using Micro-Transfer Printing

Autorzy: Ali Uzun; Fatih Bilge Atar; Simone Iadanza; Ruggero Loi; Jing Zhang; Gunther Roelkens; Igor Krestnikov; Johanna Rimbock; Liam OFaolain; Brian Corbett
Opublikowane w: IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, Numer 5, 2023, Strona(/y) 1500210, ISSN 1558-4542
Wydawca: IEEE
DOI: 10.1109/jstqe.2023.3243943

Single-Chip Silicon Photonic Processor for Analog Optical and Microwave Signals

Autorzy: H. Deng, J. Zhang, E. Soltanian, X. Chen, C. Pang, N. Vaissiere, D. Neel, J. Ramirez, J. Decobert, N. Singh, G. Torfs, G. Roelkens, W. Bogaerts
Opublikowane w: Nature, 2024, ISSN 1476-4687
Wydawca: Springer Nature

Micro-Transfer Printing for Heterogeneous Si Photonic Integrated Circuits

Autorzy: G. Roelkens, J. Zhang, L. Bogaert, M. Billet, D. Wang, B. Pan, C.J. Kruckel, E. Soltanian, D. Maes, T. Vanackere, T. Vandekerckhove, S. Cuyvers, J. De Witte, I. Luntadila, X. Guo, H. Li, S. Qin, G. Muliuk, S. Uvin, B. Haq, C. Op de Beeck, J. Goyvaerts, G. Lepage, P. Verheyen, J. Van Campenhout, G. Morthier, B. Kuyken, D. Van Thourhout, R. Baets
Opublikowane w: IEEE Journal on Selected Topics in Quantum Electronics, 2023, Strona(/y) 8200414, ISSN 1558-4542
Wydawca: IEEE
DOI: 10.1109/jstqe.2022.3222686

Present and future of micro-transfer printing for heterogeneous photonic integrated circuits

Autorzy: G. Roelkens, J. Zhang, L. Bogaert, E. Soltanian, M. Billet, A. Uzun, B. Pan, Y. Liu, E. Delli, D. Wang, V. Bonito Oliva, L.Thi Ngoc Tran, X. Guo, H. Li, S. Qin, K. Akritidis, Y. Chen, Y. Xue, M. Niels, D. Maes, M. Kiewiet, T. Reep, T. Vanackere, T. Vandekerckhove, I. Luntadila Lufungula, J. De Witte, L. Reis, S. Poelman, Y. Tan, H. Deng, W. Bogaerts, G. Morthier, D. Van Thourhout, B. Kuyken
Opublikowane w: APL Photonics, 2024, ISSN 2378-0967
Wydawca: AIP
DOI: 10.1063/5.0181099

Micro-transfer-printed narrow-linewidth III-V-on-Si double laser structure with a combined 110 nm tuning range

Autorzy: Emadreza Soltanian, Grigorij Muliuk, Sarah Uvin, Dongbo Wang, Guy Lepage, Peter Verheyen, Joris Van Campenhout, Stefan Ertl, Johanna Rimböck, Nicolas Vaissiere, Delphine Néel, Joan Ramirez, Jean Decobert, Bart Kuyken, Jing Zhang, and Gunther Roelkens
Opublikowane w: Optics Express, 2022, Strona(/y) 39329, ISSN 1094-4087
Wydawca: Optical Society of America
DOI: 10.1364/oe.470497

III-V-on-Si DFB laser with co-integrated power amplifier realised using micro-transfer printing

Autorzy: J. Zhang, L. Bogaert, B. Haq, R. Wang, B. Matuskova, J. Rimbock, S. Ertl, A. Gocalinska, E. Pelucchi, B. Corbett, J. Van Campenhout, G. Lepage, P. Verheyen, G. Morthier, G. Roelkens
Opublikowane w: IEEE Photonics Technology Letters, 2023, Strona(/y) 593, ISSN 1941-0174
Wydawca: IEEE
DOI: 10.1109/lpt.2023.3263279

Micro-transfer printing InP C-band SOAs on advanced silicon photonics platform for lossless MZI switch fabrics and high-speed integrated transmitters

Autorzy: J. Zhang, L. Bogaert, C.J. Krückel, E. Soltanian, H. Deng, B. Haq, J.Rimbock, J. Van Kerrebrouck, G. Lepage, P. Verheyen, J. Van Campenhout, P. Ossieur, D. Van Thourhout, G. Morthier, W. Bogaerts, G. Roelkens
Opublikowane w: Optics Express, 2023, Strona(/y) 42807, ISSN 1094-4087
Wydawca: Optical Society of America
DOI: 10.1364/oe.505112

III-V-on-Si photonic integrated circuits realized using micro-transfer-printing

Autorzy: Jing Zhang, Grigorij Muliuk, Joan Juvert, Sulakshna Kumari, Jeroen Goyvaerts, Bahawal Haq, Camiel Op de Beeck, Bart Kuyken, Geert Morthier, Dries Van Thourhout, Roel Baets, Guy Lepage, Peter Verheyen, Joris Van Campenhout, Agnieszka Gocalinska, James O’Callaghan, Emanuele Pelucchi, Kevin Thomas, Brian Corbett, António José Trindade, Gunther Roelkens
Opublikowane w: APL Photonics, Numer 4/11, 2019, Strona(/y) 110803, ISSN 2378-0967
Wydawca: AIP
DOI: 10.1063/1.5120004

III-V-on-Si Transceivers Based on Micro-Transfer-Printing

Autorzy: Jing Zhang
Opublikowane w: 2021
Wydawca: Ghent University

Heterogeneous Integration of InAs/GaAs Quantum Dot Lasers on Silicon Photonics

Autorzy: Sarah Uvin
Opublikowane w: 2020
Wydawca: Ghent University

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