PRogram for ISolation Manufacturing in Europe (PRISME)

Project Information

PRISME

Grant agreement ID: 846455

DOI

10.3030/846455

Project closed

EC signature date 24 April 2019

Start date 1 September 2019

End date 31 August 2021

Funded under

EXCELLENT SCIENCE - Marie Skłodowska-Curie Actions

Total cost

€ 196 590,72

EU contribution

€ 196 590,72

196 590,72

Coordinated by

ANALOG DEVICES INTERNATIONAL UNLIMITED COMPANY
Ireland

CORDIS provides links to public deliverables and publications of HORIZON projects.

Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .

Publications

High-Field and High-Frequency Dependencies of Intrinsic Dielectric Properties in Polyimide Isolation at Sub-PDIV

Author(s): S. Diaham, G. Sheehan, K. Bennett, P. Lambkin, M. Canty and B. Chen
Published in: 4th IEEE International Conference on Dielectrics (ICD), Issue 1, 2022
Publisher: IEEE

The Effect of Aggregation on Electrical Percolation of Polyimide/Graphene Nanocomposites

Author(s): I. Benfridja, S. Diaham, B. Stenson, B. Chen and T. Kennedy
Published in: 4th IEEE International Conference on Dielectrics (ICD), Issue 1, 2022
Publisher: IEEE

Electric Field DC Conductivity Dependency of Polyimide Films

Author(s): L. Guinane, S. Diaham, B. Stenson, C. Glynn, J. O’Malley, S.A.M. Tofail
Published in: IEEE International Symposium on Electrets (ISE), Issue 1, 2019
Publisher: IEEE

The Effect of Graphene Dispersion on the Electrical Properties of Polyimide Nanocomposites

Author(s): I. Benfridja, S. Diaham, B. Stenson, B. Chen and T. Kennedy
Published in: IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Issue 1, 2021
Publisher: IEEE

Improving Polyimide Isolation Performance by Tailoring Interfaces with Nitride Layers for Digital Isolator Application

Author(s): S. Diaham, L. O’Sullivan, E. Ceccarelli, P. Lambkin, J. O’Malley, J. Fitzgibbon, B. Stenson, P.J. Murphy, Y. Zhao, J. Cornett, A. Sow, B. Chen, S. Geary
Published in: 3rd IEEE International Conference on Dielectrics (ICD), Issue 1, 2020
Publisher: IEEE
DOI: 10.1109/icd46958.2020.9341967

Electric Field DC Conductivity Dependency of Polyimide Films

Author(s): Luke Guinane; Syed A. M. Tofail; Bernard Stenson; John O'Malley; Colm Glynn; Shane Geary; Sombel Diaham
Published in: IEEE Transactions on Dielectrics and Electrical Insulation, Issue 1, 2020, ISSN 1070-9878
Publisher: Institute of Electrical and Electronics Engineers
DOI: 10.1109/tdei.2020.9215091

A Universal Study on the Effect Thermal Imidization Has on the Physico-Chemical, Mechanical, Thermal and Electrical Properties of Polyimide for Integrated Electronics Applications

Author(s): Imadeddine Benfridja, Sombel Diaham, Fathima Laffir, Grace Brennan, Ning Liu, and Tadhg Kennedy
Published in: Polymers, Issue 20734360, 2022, Page(s) 1713, ISSN 2073-4360
Publisher: MDPI
DOI: 10.3390/polym14091713

Nonlinear dielectric properties of polyimide in high AC electric field

Author(s): Sombel Diaham, Paul Lambkin, and Baoxing Chen
Published in: Journal of Applied Physics, Issue 00218979, 2022, Page(s) 154101, ISSN 0021-8979
Publisher: American Institute of Physics
DOI: 10.1063/5.0108674

Polyimide Films for Digital Isolators

Author(s): Baoxing Chen; Sombel Diaham
Published in: Polyimide for Electronic and Electrical Engineering Applications, Issue 1, 2020, ISBN 978-1-83880-098-7
Publisher: InTech Open
DOI: 10.5772/intechopen.93343

Polyimide in Electronics: Applications and Processability Overview

Author(s): S. Diaham
Published in: Polyimide for Electronic and Electrical Engineering Applications, Issue 1, 2021, ISBN 978-1-83880-098-7
Publisher: InTech Open
DOI: 10.5772/intechopen.92629

Polyimide for Electronic and Electrical Engineering Applications

Author(s): S. Diaham et al.
Published in: Polyimide for Electronic and Electrical Engineering Applications, Issue 1, 2021, Page(s) 294, ISBN 978-1-83880-098-7
Publisher: InTech Open
DOI: 10.5772/intechopen.77597

Polyimide Film Uses for Digital Isolators

Author(s): B. Chen and S. Diaham
Published in: Analog Devices Technical Articles, Issue 1, 2021
Publisher: Analog Devices

Intellectual Property Rights

ELECTRIC FIELD GRADING PROTECTION DESIGN SURROUNDING A GALVANIC OR CAPACITIVE ISOLATOR

Application/Publication number: 20 21000369
Date: 2021-05-27
Applicant(s): ANALOG DEVICES INTERNATIONAL UNLIMITED COMPANY

ISOLATIONSUMMANTELUNG FÜR EINE OBERE SPULE EINES ISOLIERTEN TRANSFORMATORS

Application/Publication number: 10 2020121783
Date: 2020-08-19
Applicant(s): ANALOG DEVICES INTERNATIONAL UNLIMITED COMPANY