Deliverables
IBM and HZB will deliver a report illustrating the structural integration cross section flow and the functionality of the chip
Ferroelectric multilayer engineering for FTJReport on the thinnest attainable MFM FTJs with sufficiently high ON currents which could improve the sensing of BEOLintegrated FTJ devices and circuits The devices will necessarily meet the requirements for BEOL integration and neuromorphic applications
Dissemination and communication activities report (Years 1+2)Annual report on the dissemination actions taken to promote the main project achievements as well as interactions and synergies with related industrial and research initiatives T61
Final FTJ SPICE Model based on D2.2, (D2.4 update)Final FTJ SPICE Model based on D22 D24 update
Design and optimization of composite stacks in FTJThis deliverable is a report on the final optimized FTJ stack Based on the models developed in T41 and on physical parameters and insight conveyed by abinitio calculations in T42 an extensive study of design and optimization of the composite stack in FTJs will be performed Different options for stack composition will be addressed
Phd teaching module preparedWe will prepare a teaching module for the project intern PhD students to speed up their learning in the field of ferroelectric Hf(Zr)O2-based devices. The courses will be used in a teaching session that we plan to perform in conjunction with a project meeting.
Communication and online strategy and presenceThis report will establish a homogeneous visual identity for the project, including guidelines and templates for producing reports, presentations and the website. Furthermore, the project web site will be launched at the start of the projectproviding information on partners, plans, goals and activities. Social media presence, including Twitter and LinkedIn profiles, will be created.
Final FeFET SPICE Model based on D3.2, D3.3 (D3.4 update)Final FeFET SPICE Model based on D32 D33 D34 update
Dissemination and communication activities report (Years 1+2+3)Annual report on the dissemination actions taken to promote the main project achievements as well as interactions and synergies with related industrial and research initiatives T61
Dissemination and communication activities report (Year 1)Annual report on the dissemination actions taken to promote the main project achievements, as well as interactions and synergies with related industrial and research initiatives (T6.1).
Neuromorphic chips packagedThis deliverable will be a report of the successful packaging and delivering of the neuromorphic chips to UZH and UNIBI for detailed characterization in T55
Demonstrator teaching module preparedHere we will prepare lectures and labs for establishing a new course that will train a new generation of researchers to design use and apply hybrid CMOSFeFET or CMOSFTJ spiking neural network architectures Particular emphasis will be given to the learning and plasticity circuits which represent the key component of the project
NaMlab will provide a first version of a SPICE model to Task 5.1. The model describes the basic electrical characteristics of the FTJ devices. The model will be based on an already available model for the ferroelectric switching and available FTJ measurement data. The model will then be refined throughout the project according the development of the FTJ devices.
Provide initial FeFET SPICE model for adoption in Task 5.1NaMlab will provide a first version of a SPICE model to Task 5.1. The model describes the basic electrical characteristics of the FeFET devices. The model will be based on an already available FEOL FeFET model. The model will then be refined throughout the project according the development of the FeFET devices.
This deliverable will consist of a demonstration of on-line learning and classification. The demonstration will be used to evaluate performances of the neuromorphic processor with respect to a suite of standard and project specific benchmarks.
Publications
Author(s):
Suzanne Lancaster; Quang T. Duong; Erika Covi; Thomas Mikolajick; Stefan Slesazeck
Published in:
IEEE 48th European Solid State Circuits Conference (ESSCIRC) 2022, 2022
Publisher:
IEEE
DOI:
10.1109/esscirc55480.2022.9911392
Author(s):
Madison Cotteret, Ole Richter, Michele Mastella, Hugh Greatorex, Ella Janotte, Willian Soares Girão, Martin Ziegler, Elisabetta Chicca
Published in:
IEEE International Symposium on Circuits and Systems (ISCAS) 2023, 2023
Publisher:
IEEE
DOI:
10.1109/iscas46773.2023.10181513
Author(s):
R. Fontanini; J. Barbot; M. Segatto; S. Lancaster; Q. Duong; F. Driussi; L. Grenouillet; F. Triozon; J. Coignus; T. Mikolajick; S. Slesazeck; D. Esseni
Published in:
ESSDERC 2021 - IEEE 51st European Solid-State Device Research Conference (ESSDERC), 2021
Publisher:
IEEE
DOI:
10.1109/essderc53440.2021.9631812
Author(s):
Cartiglia, Matteo; Rubino, Arianna; Narayanan, Shyam; Frenkel, Charlotte; Haessig, Germain; Indiveri, Giacomo; Payvand, Melika
Published in:
2022 IEEE International Symposium on Circuits and Systems (ISCAS), 2022
Publisher:
IEEE
DOI:
10.1109/iscas48785.2022.9937833
Author(s):
Laura Begon-Lours; Mattia Halter; Youri Popoff; Zhenming Yu; Donato Francesco Falcone; Bert Jan Offrein
Published in:
ESSCIRC 2021 - IEEE 47th European Solid State Circuits Conference (ESSCIRC), 2021, ISBN 978-1-6654-3751-6
Publisher:
IEEE
DOI:
10.1109/esscirc53450.2021.9567870
Author(s):
David Esseni, Francesco Driussi, Daniel Lizzit, Marco Massarotto, Mattia Segatto
Published in:
Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2023
Publisher:
IEEE
DOI:
10.48550/arxiv.2210.13382
Author(s):
M. Segatto; M. Massarotto; S. Lancaster; Q. T. Duong; A. Affanni; R. Fontanini; F. Driussi; D. Lizzit; T. Mikolajick; S. Slesazeck; D. Esseni
Published in:
ESSDERC 2021 - IEEE 51st European Solid-State Device Research Conference (ESSDERC), 2021
Publisher:
IEEE
DOI:
10.1109/essderc55479.2022.9947185
Author(s):
Daniel Lizzit, Thomas Bernardi, David Esseni
Published in:
IEEE European Solid-State Device Research Conference (ESSDERC) 2022, 2022
Publisher:
IEEE
DOI:
10.1109/essderc55479.2022.9947169
Author(s):
Michele Mastella, Hugh Greatorex, Madison Cotteret, Ella Janotte, Willian Soares Girão, Ole Richter, Elisabetta Chicca
Published in:
International Conference on Neuromorphic Systems 2023, 2023
Publisher:
ACM Press
DOI:
10.1145/3589737.3606007
Author(s):
Laura Begon-Lours, Mattia Halter, Diana Davila Pineda, Youri Popoff, Valeria Bragaglia, Antonio La Porta, Daniel Jubin, Jean Fompeyrine, Bert Jan Offrein
Published in:
2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), 2021, Page(s) 1-3, ISBN 978-1-7281-8176-9
Publisher:
IEEE
DOI:
10.1109/edtm50988.2021.9420886
Author(s):
Lorenzo Benatti, Paolo Pavan, Francesco Maria Puglisi
Published in:
IEEE International Reliability Physics Symposium (IRPS) 2022, 2022
Publisher:
IEEE
DOI:
10.1109/irps48227.2022.9764602
Author(s):
Ole Richter, Hugh Greatorex, Benjamin Hučko, Madison Cotteret, Willian Soares Girão, Ella Janotte, Michele Mastella, E. Chicca
Published in:
International Conference on Neuromorphic Systems 2023, 2023
Publisher:
ACM Press
DOI:
10.1145/3589737.360600
Author(s):
Suzanne Lancaster, Mattia Segatto, Cláudia Silva, Benjamin Max, Thomas Mikolajick, David Esseni, Francesco Driussi, Stefan Slesazeck
Published in:
Device Research Conference (DRC) 2023, 2023
Publisher:
IEEE
DOI:
10.1109/drc58590.2023.10187018
Author(s):
Lorenzo Benatti, Sara Vecchi, Milan Pesic, Francesco Maria Puglisi
Published in:
IEEE International Reliability Physics Symposium (IRPS) 2023, 2023
Publisher:
IEEE
DOI:
10.1109/irps48203.2023.10118229
Author(s):
Nikitas Siannas, Christina Zacharaki, Polychronis Tsipas, Stefanos Chaitoglou, Laura Begon-Lours, Athanasios Dimoulas
Published in:
IEEE European Solid-State Device Research Conference (ESSDERC) 2021, 2021
Publisher:
IEEE
DOI:
10.1109/essderc53440.2021.9631382
Author(s):
Lorenzo Benatti, Francesco Maria Puglisi
Published in:
IEEE International Workshop Integrated Reliability (IIRW) 2021, 2021
Publisher:
IEEE
DOI:
10.1109/iirw53245.2021.9635621
Author(s):
Lorenzo Benatti, Sara Vecchi, Francesco Maria Puglisi
Published in:
IEEE International Integrated Reliability Workshop (IIRW) 2022, 2022
Publisher:
IEEE
DOI:
10.1109/iirw56459.2022.10032741
Author(s):
Erika Covi, Quang T. Duong, Suzanne Lancaster, Viktor Havel, Jean Coignus, Justine Barbot, Ole Richter, Philip Klein, Elisabetta Chicca, Laurent Grenouillet, Athanasios Dimoulas, Thomas Mikolajick, Stefan Slesazeck
Published in:
2021 IEEE International Symposium on Circuits and Systems (ISCAS), 2021, Page(s) 1-5, ISBN 978-1-7281-9201-7
Publisher:
IEEE
DOI:
10.1109/iscas51556.2021.9401800
Author(s):
D. Esseni, R. Fontanini, D. Lizzit, M. Massarotto, F. Driussi, M. Loghi
Published in:
2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), 2021, Page(s) 1-3, ISBN 978-1-7281-8176-9
Publisher:
IEEE
DOI:
10.1109/edtm50988.2021.9420848
Author(s):
Arianna Rubino; Matteo Cartiglia; Melika Payvand; Giacomo Indiveri
Published in:
IEEE International Conference on Artificial Intelligence Circuits and Systems (AICAS) 2023, 2023
Publisher:
IEEE
DOI:
10.1109/aicas57966.2023.10168620
Author(s):
Arianna Rubino, Melika Payvand, Giacomo Indiveri
Published in:
27th IEEE International Conference on Electronics Circuits and Systems, 2020
Publisher:
IEEE
DOI:
10.1109/icecs46596.2019.8964713
Author(s):
M. Massarotto, M. Segatto, F. Driussi; A. Affanni, S. Lancaster, S. Slesazeck, T. Mikolajick, D. Esseni
Published in:
International Conference on Microelectronic Test Structure (ICMTS) 2023, 2023
Publisher:
IEEE
DOI:
10.1109/icmts55420.2023.10094178
Author(s):
Daniel Lizzit; David Esseni
Published in:
ESSDERC 2021 - IEEE 51st European Solid-State Device Research Conference (ESSDERC), 2021
Publisher:
IEEE
DOI:
10.1109/essderc53440.2021.9631764
Author(s):
Narayanan, Shyam; Covi, Erika; Havel, Viktor; Frenkel, Charlotte; Lancaster, Suzanne; Duong, Quang; Slesazeck, Stefan; Mikolajick, Thomas; Payvand, Melika; Indiveri, Giacomo
Published in:
2022 IEEE International Symposium on Circuits and Systems (ISCAS), 2022
Publisher:
IEEE
DOI:
10.1109/iscas48785.2022.9937555
Author(s):
L. Grenouillet, J. Barbot, J. Laguerre, S. Martin, C. Carabasse, M. Louro, M. Bedjaoui, S. Minoret, S. Kerdilès, C. Boixaderas, T. Magis, C. Jahan, F. Andrieu, J. Coignus
Published in:
IEEE International Reliability Physics Symposium (IRPS) 2023, 2023
Publisher:
IEEE
DOI:
10.1109/irps48203.2023.10118099
Author(s):
R. Fontanini, M. Massarotto, R. Specogna, F. Driussi, M. Loghi, D. Esseni
Published in:
2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), 2021, Page(s) 1-3, ISBN 978-1-7281-8176-9
Publisher:
IEEE
DOI:
10.1109/edtm50988.2021.9420863
Author(s):
Ruben Alcala, Monica Materano, Patrick D. Lomenzo, Pramoda Vishnumurthy, Wassim Hamouda, Catherine Dubourdieu, Alfred Kersch, Nicolas Barrett, Thomas Mikolajick, Uwe Schroeder
Published in:
Advanced Functional Materials, 2023, ISSN 1616-301X
Publisher:
John Wiley & Sons Ltd.
DOI:
10.1002/adfm.202303261
Author(s):
Erika Covi, Elisa Donati, Stefano Brivio, Hadi Heidari
Published in:
Frontiers in Neuroscience, 2022, ISSN 1662-4548
Publisher:
Frontiers Research Foundation
DOI:
10.3389/fnins.2022.863680
Author(s):
Veeresh Deshpande; Keerthana Shajil Nair; Keerthana Shajil Nair; Marco Holzer; Marco Holzer; Sourish Banerjee; Catherine Dubourdieu; Catherine Dubourdieu
Published in:
Applied Physics Letters, Issue 9, 2021, ISSN 0038-1101
Publisher:
Pergamon Press Ltd.
DOI:
10.1016/j.sse.2021.108054
Author(s):
Nikitas Siannas, Christina Zacharaki, Polychronis Tsipas, Dong Jik Kim, Wassim Hamouda, Cosmin Istrate, Lucian Pintilie, Martin Schmidbauer, Catherine Dubourdieu, Athanasios Dimoulas
Published in:
Advanced Functional materials, 2023, ISSN 1616-301X
Publisher:
John Wiley & Sons Ltd.
DOI:
10.1002/adfm.202311767
Author(s):
Thomas Mikolajick, Min Hyuk Park, Laura Begon-Lours, Stefan Slesazeck
Published in:
Advanced Materials, 2023, ISSN 1521-4095
Publisher:
Wiley
DOI:
10.1002/adma.202206042
Author(s):
Lorenzo Benatti, Sara Vecchi, Francesco Maria Puglisi
Published in:
IEEE Transactions on Device and Materials Reliability, 2023, ISSN 1558-2574
Publisher:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/tdmr.2023.3261441
Author(s):
Christina Zacharaki; Stefanos Chaitoglou; Nikitas Siannas; Polychronis Tsipas; Athanasios Dimoulas
Published in:
ACS Applied Electronic Materials, 2022, ISSN 2637-6113
Publisher:
American Chemical Society
DOI:
10.1021/acsaelm.2c00324
Author(s):
Erika Covi, Elisa Donati, Xiangpeng Liang, David Kappel, Hadi Heidari, Melika Payvand, Wei Wang
Published in:
Frontiers in Neuroscience, Issue 15, 2021, ISSN 1662-453X
Publisher:
Frontiers Media
DOI:
10.3389/fnins.2021.611300
Author(s):
Laura Bégon‐Lours; Mattia Halter; Francesco Maria Puglisi; Lorenzo Benatti; Donato Francesco Falcone; Youri Popoff; Diana Dávila Pineda; Marilyne Sousa; Bert Jan Offrein
Published in:
Advanced Electronic Materials, 2022, ISSN 2199-160x
Publisher:
Wiley Open Access
DOI:
10.1002/aelm.202101395
Author(s):
Laura Begon-Lours; Mattia Halter; Youri Popoff; Z. Yu; D.F. Falcone; D. Davila; Valeria Bragaglia; A. La Porta; Daniel Jubin; Jean Fompeyrine; Bert Jan Offrein
Published in:
IEEE Journal of the Electron Devices Society, Issue 33, 2021, ISSN 2168-6734
Publisher:
Institute of Electrical and Electronics Engineers Inc.
DOI:
10.1109/jeds.2021.3108523
Author(s):
Wen, Xin; Halter, Mattia; Bégon-Lours, Laura; Luisier, Mathieu
Published in:
Frontiers in Nanotechnology, 2023, ISSN 2673-3013
Publisher:
Frontiers Media
DOI:
10.3929/ethz-b-000594774
Author(s):
LORENZO BENATTI; Francesco Maria PUGLISI
Published in:
IEEE Transactions on Device and Materials Reliability, 2022, ISSN 1530-4388
Publisher:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/tdmr.2022.3182941
Author(s):
Suzanne Lancaster; Patrick D. Lomenzo; Moritz Engl; Bohan Xu; Thomas Mikolajick; Uwe Schroeder; Stefan Slesazeck
Published in:
Frontiers in Nanotechnology, 2023, ISSN 2673-3013
Publisher:
Frontiers Media
DOI:
10.3389/fnano.2022.939822
Author(s):
S. Lancaster, T. Mikolajick, S. Slesazeck
Published in:
Applied Physics Letters (APL), 2022, ISSN 0003-6951
Publisher:
American Institute of Physics
DOI:
10.1063/5.0078106
Author(s):
C. Zacharaki, P. Tsipas, S. Chaitoglou, L. Bégon-Lours, M. Halter, A. Dimoulas
Published in:
Applied Physics Letters, Issue 117/21, 2020, Page(s) 212905, ISSN 0003-6951
Publisher:
American Institute of Physics
DOI:
10.1063/5.0029657
Author(s):
Lyes Khacef; Philipp Klein; Matteo Cartiglia; Arianna Rubino; Giacomo Indiveri; Elisabetta Chicca
Published in:
Neuromorphic Computing and Engineering, 2023, ISSN 2634-4386
Publisher:
IOP Publishing
DOI:
10.1088/2634-4386/ad05da
Author(s):
M. Massarotto; F. Driussi; A. Affanni; S. Lancaster; S. Slesazeck; T. Mikolajick; D. Esseni
Published in:
Solid-State Electronics, 2022, ISSN 0038-1101
Publisher:
Pergamon Press Ltd.
DOI:
10.1016/j.sse.2022.108364
Author(s):
Arianna Rubino, Can Livanelioglu, Ning Qiao, Melika Payvand, Giacomo Indiveri
Published in:
IEEE Transactions on Circuits and Systems I: Regular Papers, Issue 68/1, 2021, Page(s) 45-56, ISSN 1549-8328
Publisher:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/tcsi.2020.3035575
Author(s):
Mattia Halter; Elisabetta Morabito; Antonis Olziersky; Cécile Carrétéro; André Chanthbouala; Donato Francesco Falcone; Bert Jan Offrein; Laura Bégon-Lours
Published in:
Journal of Materials Research, 2023, ISSN 0884-2914
Publisher:
Materials Research Society
DOI:
10.1557/s43578-023-01158-8
Author(s):
Nikitas Siannas, Christina Zacharaki, Polychronis Tsipas, Stefanos Chaitoglou, Laura Bégon-Lours, Cosmin Istrate, Lucian Pintilie, Athanasios Dimoulas
Published in:
Communications Physics, 2022, ISSN 2399-3650
Publisher:
Nature Physics
DOI:
10.1038/s42005-022-00951-x
Author(s):
José P. B. Silva, Ruben Alcala, Uygar E. Avci, Nick Barrett, Laura Bégon-Lours, Mattias Borg, Seungyong Byun, Sou-Chi Chang,Sang-Wook Cheong, Duk-Hyun Choe, Jean Coignus, Veeresh Deshpande, Athanasios Dimoulas, Catherine Dubourdieu, Ignasi Fina, Hiroshi Funakubo, Laurent Grenouillet, Alexei Gruverman, Jinseong Heo, Michael Hoffmann, H. Alex Hsain, Fei-Ting Huang, Cheol Seong Hwang, Jorge Íñigu
Published in:
APL Materials, 2023, ISSN 2166-532X
Publisher:
American Institute of Physics (AIP)
DOI:
10.1063/5.0148068
Author(s):
H Alex Hsain; Younghwan Lee; Suzanne Lancaster; Patrick D Lomenzo; Bohan Xu; Thomas Mikolajick; Uwe Schroeder; Gregory N Parsons; Jacob L Jones
Published in:
Nanotechnology, 2023, ISSN 0957-4484
Publisher:
Institute of Physics Publishing
DOI:
10.1088/1361-6528/acad0a
Author(s):
Laura Bégon-Lours, Mattia Halter, Youri Popoff, Bert Jan Offrein
Published in:
physica status solidi (RRL) – Rapid Research Letters, Issue 15/5, 2021, Page(s) 2000524, ISSN 1862-6254
Publisher:
Wiley - VCH Verlag GmbH & CO. KGaA
DOI:
10.1002/pssr.202000524
Author(s):
Mattia Segatto; Filippo Rupil; David Esseni
Published in:
IEEE Transactions on Electron Devices, 2023, ISSN 1557-9646
Publisher:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/ted.2023.3265626
Author(s):
Mattia Halter; Laura Bégon-Lours; Marilyne Sousa; Youri Popoff; Ute Drechsler; Valeria Bragaglia; Bert Jan Offrein
Published in:
Communications Materials, 2023, ISSN 2662-4443
Publisher:
Nature research
DOI:
10.1038/s43246-023-00342-x
Author(s):
Laura Bégon-Lours; Mattia Halter; Marilyne Sousa; Youri Popoff; Diana Dávila Pineda; Donato Francesco Falcone; Zhenming Yu; Steffen Reidt; Lorenzo Benatti; Francesco Maria Puglisi; Bert Jan Offrein
Published in:
Neuromorphic Computing and Engineering, 2022, ISSN 2634-4386
Publisher:
IOP Publishing
DOI:
10.1088/2634-4386/ac5b2d
Author(s):
Daniel Lizzit; David ESSENI; Mattia Segatto; Francesco Driussi; Riccardo Fontanini
Published in:
IEEE Journal of the Electron Devices Society, 2022, ISSN 2168-6734
Publisher:
Institute of Electrical and Electronics Engineers Inc.
DOI:
10.1109/jeds.2022.3164652
Author(s):
Marco Massarotto; Francesco Driussi; Antonio Affanni; Suzanne Lancaster; Stefan Slesazeck; Thomas Mikolajick; David Esseni
Published in:
Solid-State Electronics, 2023, ISSN 1879-2405
Publisher:
Elsevier
DOI:
10.1016/j.sse.2022.108569
Author(s):
Keerthana Shajil Nair, Marco Holzer, Catherine Dubourdieu, and Veeresh Deshpande
Published in:
Applied Physics Letters (APL), 2023, ISSN 0003-6951
Publisher:
American Institute of Physics
DOI:
10.1021/acsaelm.2c01492
Author(s):
R. Fontanini; J. Barbot; M. Segatto; S. Lancaster; Q. Duong; F. Driussi; L. Grenouillet; L. Triozon; J. Coignus; T. Mikolajick; S. Slesazeck; D. Esseni
Published in:
IEEE Journal of the Electron Devices Society, Issue 13, 2022, ISSN 2168-6734
Publisher:
Institute of Electrical and Electronics Engineers Inc.
DOI:
10.1109/jeds.2022.3171217
Author(s):
R. Fontanini; M. Segatto; K. S. Nair; M. Holzer; F. Driussi; I. Hausler; C. T. Koch; C. Dubourdieu; V. Deshpande; D. Esseni
Published in:
IEEE Transactions on Electron Devices, Issue 8, 2022, ISSN 0018-9383
Publisher:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/ted.2022.3175684
Author(s):
Dong Hyun Lee; Geun Hyeong Park; Se Hyun Kim; Ju Yong Park; Kun Yang; Stefan Slesazeck; Thomas Mikolajick; Min Hyuk Park
Published in:
InfoMat, 2022, ISSN 2567-3165
Publisher:
Wiley Open Access
DOI:
10.1002/inf2.12380
Author(s):
Benjamin Max, Michael Hoffmann, Halid Mulaosmanovic, Stefan Slesazeck, Thomas Mikolajick
Published in:
ACS Applied Electronic Materials, Issue 2/12, 2020, Page(s) 4023-4033, ISSN 2637-6113
Publisher:
American Chemical Society
DOI:
10.1021/acsaelm.0c00832
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