Resultado final
IBM and HZB will deliver a report illustrating the structural integration cross section flow and the functionality of the chip
Ferroelectric multilayer engineering for FTJReport on the thinnest attainable MFM FTJs with sufficiently high ON currents which could improve the sensing of BEOLintegrated FTJ devices and circuits The devices will necessarily meet the requirements for BEOL integration and neuromorphic applications
Dissemination and communication activities report (Years 1+2)Annual report on the dissemination actions taken to promote the main project achievements as well as interactions and synergies with related industrial and research initiatives T61
Final FTJ SPICE Model based on D2.2, (D2.4 update)Final FTJ SPICE Model based on D22 D24 update
Design and optimization of composite stacks in FTJThis deliverable is a report on the final optimized FTJ stack Based on the models developed in T41 and on physical parameters and insight conveyed by abinitio calculations in T42 an extensive study of design and optimization of the composite stack in FTJs will be performed Different options for stack composition will be addressed
Phd teaching module preparedWe will prepare a teaching module for the project intern PhD students to speed up their learning in the field of ferroelectric Hf(Zr)O2-based devices. The courses will be used in a teaching session that we plan to perform in conjunction with a project meeting.
Communication and online strategy and presenceThis report will establish a homogeneous visual identity for the project, including guidelines and templates for producing reports, presentations and the website. Furthermore, the project web site will be launched at the start of the projectproviding information on partners, plans, goals and activities. Social media presence, including Twitter and LinkedIn profiles, will be created.
Final FeFET SPICE Model based on D3.2, D3.3 (D3.4 update)Final FeFET SPICE Model based on D32 D33 D34 update
Dissemination and communication activities report (Years 1+2+3)Annual report on the dissemination actions taken to promote the main project achievements as well as interactions and synergies with related industrial and research initiatives T61
Dissemination and communication activities report (Year 1)Annual report on the dissemination actions taken to promote the main project achievements, as well as interactions and synergies with related industrial and research initiatives (T6.1).
Neuromorphic chips packagedThis deliverable will be a report of the successful packaging and delivering of the neuromorphic chips to UZH and UNIBI for detailed characterization in T55
Demonstrator teaching module preparedHere we will prepare lectures and labs for establishing a new course that will train a new generation of researchers to design use and apply hybrid CMOSFeFET or CMOSFTJ spiking neural network architectures Particular emphasis will be given to the learning and plasticity circuits which represent the key component of the project
NaMlab will provide a first version of a SPICE model to Task 5.1. The model describes the basic electrical characteristics of the FTJ devices. The model will be based on an already available model for the ferroelectric switching and available FTJ measurement data. The model will then be refined throughout the project according the development of the FTJ devices.
Provide initial FeFET SPICE model for adoption in Task 5.1NaMlab will provide a first version of a SPICE model to Task 5.1. The model describes the basic electrical characteristics of the FeFET devices. The model will be based on an already available FEOL FeFET model. The model will then be refined throughout the project according the development of the FeFET devices.
This deliverable will consist of a demonstration of on-line learning and classification. The demonstration will be used to evaluate performances of the neuromorphic processor with respect to a suite of standard and project specific benchmarks.
Publicaciones
Autores:
Suzanne Lancaster; Quang T. Duong; Erika Covi; Thomas Mikolajick; Stefan Slesazeck
Publicado en:
IEEE 48th European Solid State Circuits Conference (ESSCIRC) 2022, 2022
Editor:
IEEE
DOI:
10.1109/esscirc55480.2022.9911392
Autores:
Madison Cotteret, Ole Richter, Michele Mastella, Hugh Greatorex, Ella Janotte, Willian Soares Girão, Martin Ziegler, Elisabetta Chicca
Publicado en:
IEEE International Symposium on Circuits and Systems (ISCAS) 2023, 2023
Editor:
IEEE
DOI:
10.1109/iscas46773.2023.10181513
Autores:
R. Fontanini; J. Barbot; M. Segatto; S. Lancaster; Q. Duong; F. Driussi; L. Grenouillet; F. Triozon; J. Coignus; T. Mikolajick; S. Slesazeck; D. Esseni
Publicado en:
ESSDERC 2021 - IEEE 51st European Solid-State Device Research Conference (ESSDERC), 2021
Editor:
IEEE
DOI:
10.1109/essderc53440.2021.9631812
Autores:
Cartiglia, Matteo; Rubino, Arianna; Narayanan, Shyam; Frenkel, Charlotte; Haessig, Germain; Indiveri, Giacomo; Payvand, Melika
Publicado en:
2022 IEEE International Symposium on Circuits and Systems (ISCAS), 2022
Editor:
IEEE
DOI:
10.1109/iscas48785.2022.9937833
Autores:
Laura Begon-Lours; Mattia Halter; Youri Popoff; Zhenming Yu; Donato Francesco Falcone; Bert Jan Offrein
Publicado en:
ESSCIRC 2021 - IEEE 47th European Solid State Circuits Conference (ESSCIRC), 2021, ISBN 978-1-6654-3751-6
Editor:
IEEE
DOI:
10.1109/esscirc53450.2021.9567870
Autores:
David Esseni, Francesco Driussi, Daniel Lizzit, Marco Massarotto, Mattia Segatto
Publicado en:
Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2023
Editor:
IEEE
DOI:
10.48550/arxiv.2210.13382
Autores:
M. Segatto; M. Massarotto; S. Lancaster; Q. T. Duong; A. Affanni; R. Fontanini; F. Driussi; D. Lizzit; T. Mikolajick; S. Slesazeck; D. Esseni
Publicado en:
ESSDERC 2021 - IEEE 51st European Solid-State Device Research Conference (ESSDERC), 2021
Editor:
IEEE
DOI:
10.1109/essderc55479.2022.9947185
Autores:
Daniel Lizzit, Thomas Bernardi, David Esseni
Publicado en:
IEEE European Solid-State Device Research Conference (ESSDERC) 2022, 2022
Editor:
IEEE
DOI:
10.1109/essderc55479.2022.9947169
Autores:
Michele Mastella, Hugh Greatorex, Madison Cotteret, Ella Janotte, Willian Soares Girão, Ole Richter, Elisabetta Chicca
Publicado en:
International Conference on Neuromorphic Systems 2023, 2023
Editor:
ACM Press
DOI:
10.1145/3589737.3606007
Autores:
Laura Begon-Lours, Mattia Halter, Diana Davila Pineda, Youri Popoff, Valeria Bragaglia, Antonio La Porta, Daniel Jubin, Jean Fompeyrine, Bert Jan Offrein
Publicado en:
2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), 2021, Página(s) 1-3, ISBN 978-1-7281-8176-9
Editor:
IEEE
DOI:
10.1109/edtm50988.2021.9420886
Autores:
Lorenzo Benatti, Paolo Pavan, Francesco Maria Puglisi
Publicado en:
IEEE International Reliability Physics Symposium (IRPS) 2022, 2022
Editor:
IEEE
DOI:
10.1109/irps48227.2022.9764602
Autores:
Ole Richter, Hugh Greatorex, Benjamin Hučko, Madison Cotteret, Willian Soares Girão, Ella Janotte, Michele Mastella, E. Chicca
Publicado en:
International Conference on Neuromorphic Systems 2023, 2023
Editor:
ACM Press
DOI:
10.1145/3589737.360600
Autores:
Suzanne Lancaster, Mattia Segatto, Cláudia Silva, Benjamin Max, Thomas Mikolajick, David Esseni, Francesco Driussi, Stefan Slesazeck
Publicado en:
Device Research Conference (DRC) 2023, 2023
Editor:
IEEE
DOI:
10.1109/drc58590.2023.10187018
Autores:
Lorenzo Benatti, Sara Vecchi, Milan Pesic, Francesco Maria Puglisi
Publicado en:
IEEE International Reliability Physics Symposium (IRPS) 2023, 2023
Editor:
IEEE
DOI:
10.1109/irps48203.2023.10118229
Autores:
Nikitas Siannas, Christina Zacharaki, Polychronis Tsipas, Stefanos Chaitoglou, Laura Begon-Lours, Athanasios Dimoulas
Publicado en:
IEEE European Solid-State Device Research Conference (ESSDERC) 2021, 2021
Editor:
IEEE
DOI:
10.1109/essderc53440.2021.9631382
Autores:
Lorenzo Benatti, Francesco Maria Puglisi
Publicado en:
IEEE International Workshop Integrated Reliability (IIRW) 2021, 2021
Editor:
IEEE
DOI:
10.1109/iirw53245.2021.9635621
Autores:
Lorenzo Benatti, Sara Vecchi, Francesco Maria Puglisi
Publicado en:
IEEE International Integrated Reliability Workshop (IIRW) 2022, 2022
Editor:
IEEE
DOI:
10.1109/iirw56459.2022.10032741
Autores:
Erika Covi, Quang T. Duong, Suzanne Lancaster, Viktor Havel, Jean Coignus, Justine Barbot, Ole Richter, Philip Klein, Elisabetta Chicca, Laurent Grenouillet, Athanasios Dimoulas, Thomas Mikolajick, Stefan Slesazeck
Publicado en:
2021 IEEE International Symposium on Circuits and Systems (ISCAS), 2021, Página(s) 1-5, ISBN 978-1-7281-9201-7
Editor:
IEEE
DOI:
10.1109/iscas51556.2021.9401800
Autores:
D. Esseni, R. Fontanini, D. Lizzit, M. Massarotto, F. Driussi, M. Loghi
Publicado en:
2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), 2021, Página(s) 1-3, ISBN 978-1-7281-8176-9
Editor:
IEEE
DOI:
10.1109/edtm50988.2021.9420848
Autores:
Arianna Rubino; Matteo Cartiglia; Melika Payvand; Giacomo Indiveri
Publicado en:
IEEE International Conference on Artificial Intelligence Circuits and Systems (AICAS) 2023, 2023
Editor:
IEEE
DOI:
10.1109/aicas57966.2023.10168620
Autores:
Arianna Rubino, Melika Payvand, Giacomo Indiveri
Publicado en:
27th IEEE International Conference on Electronics Circuits and Systems, 2020
Editor:
IEEE
DOI:
10.1109/icecs46596.2019.8964713
Autores:
M. Massarotto, M. Segatto, F. Driussi; A. Affanni, S. Lancaster, S. Slesazeck, T. Mikolajick, D. Esseni
Publicado en:
International Conference on Microelectronic Test Structure (ICMTS) 2023, 2023
Editor:
IEEE
DOI:
10.1109/icmts55420.2023.10094178
Autores:
Daniel Lizzit; David Esseni
Publicado en:
ESSDERC 2021 - IEEE 51st European Solid-State Device Research Conference (ESSDERC), 2021
Editor:
IEEE
DOI:
10.1109/essderc53440.2021.9631764
Autores:
Narayanan, Shyam; Covi, Erika; Havel, Viktor; Frenkel, Charlotte; Lancaster, Suzanne; Duong, Quang; Slesazeck, Stefan; Mikolajick, Thomas; Payvand, Melika; Indiveri, Giacomo
Publicado en:
2022 IEEE International Symposium on Circuits and Systems (ISCAS), 2022
Editor:
IEEE
DOI:
10.1109/iscas48785.2022.9937555
Autores:
L. Grenouillet, J. Barbot, J. Laguerre, S. Martin, C. Carabasse, M. Louro, M. Bedjaoui, S. Minoret, S. Kerdilès, C. Boixaderas, T. Magis, C. Jahan, F. Andrieu, J. Coignus
Publicado en:
IEEE International Reliability Physics Symposium (IRPS) 2023, 2023
Editor:
IEEE
DOI:
10.1109/irps48203.2023.10118099
Autores:
R. Fontanini, M. Massarotto, R. Specogna, F. Driussi, M. Loghi, D. Esseni
Publicado en:
2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), 2021, Página(s) 1-3, ISBN 978-1-7281-8176-9
Editor:
IEEE
DOI:
10.1109/edtm50988.2021.9420863
Autores:
Ruben Alcala, Monica Materano, Patrick D. Lomenzo, Pramoda Vishnumurthy, Wassim Hamouda, Catherine Dubourdieu, Alfred Kersch, Nicolas Barrett, Thomas Mikolajick, Uwe Schroeder
Publicado en:
Advanced Functional Materials, 2023, ISSN 1616-301X
Editor:
John Wiley & Sons Ltd.
DOI:
10.1002/adfm.202303261
Autores:
Erika Covi, Elisa Donati, Stefano Brivio, Hadi Heidari
Publicado en:
Frontiers in Neuroscience, 2022, ISSN 1662-4548
Editor:
Frontiers Research Foundation
DOI:
10.3389/fnins.2022.863680
Autores:
Veeresh Deshpande; Keerthana Shajil Nair; Keerthana Shajil Nair; Marco Holzer; Marco Holzer; Sourish Banerjee; Catherine Dubourdieu; Catherine Dubourdieu
Publicado en:
Applied Physics Letters, Edición 9, 2021, ISSN 0038-1101
Editor:
Pergamon Press Ltd.
DOI:
10.1016/j.sse.2021.108054
Autores:
Nikitas Siannas, Christina Zacharaki, Polychronis Tsipas, Dong Jik Kim, Wassim Hamouda, Cosmin Istrate, Lucian Pintilie, Martin Schmidbauer, Catherine Dubourdieu, Athanasios Dimoulas
Publicado en:
Advanced Functional materials, 2023, ISSN 1616-301X
Editor:
John Wiley & Sons Ltd.
DOI:
10.1002/adfm.202311767
Autores:
Thomas Mikolajick, Min Hyuk Park, Laura Begon-Lours, Stefan Slesazeck
Publicado en:
Advanced Materials, 2023, ISSN 1521-4095
Editor:
Wiley
DOI:
10.1002/adma.202206042
Autores:
Lorenzo Benatti, Sara Vecchi, Francesco Maria Puglisi
Publicado en:
IEEE Transactions on Device and Materials Reliability, 2023, ISSN 1558-2574
Editor:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/tdmr.2023.3261441
Autores:
Christina Zacharaki; Stefanos Chaitoglou; Nikitas Siannas; Polychronis Tsipas; Athanasios Dimoulas
Publicado en:
ACS Applied Electronic Materials, 2022, ISSN 2637-6113
Editor:
American Chemical Society
DOI:
10.1021/acsaelm.2c00324
Autores:
Erika Covi, Elisa Donati, Xiangpeng Liang, David Kappel, Hadi Heidari, Melika Payvand, Wei Wang
Publicado en:
Frontiers in Neuroscience, Edición 15, 2021, ISSN 1662-453X
Editor:
Frontiers Media
DOI:
10.3389/fnins.2021.611300
Autores:
Laura Bégon‐Lours; Mattia Halter; Francesco Maria Puglisi; Lorenzo Benatti; Donato Francesco Falcone; Youri Popoff; Diana Dávila Pineda; Marilyne Sousa; Bert Jan Offrein
Publicado en:
Advanced Electronic Materials, 2022, ISSN 2199-160x
Editor:
Wiley Open Access
DOI:
10.1002/aelm.202101395
Autores:
Laura Begon-Lours; Mattia Halter; Youri Popoff; Z. Yu; D.F. Falcone; D. Davila; Valeria Bragaglia; A. La Porta; Daniel Jubin; Jean Fompeyrine; Bert Jan Offrein
Publicado en:
IEEE Journal of the Electron Devices Society, Edición 33, 2021, ISSN 2168-6734
Editor:
Institute of Electrical and Electronics Engineers Inc.
DOI:
10.1109/jeds.2021.3108523
Autores:
Wen, Xin; Halter, Mattia; Bégon-Lours, Laura; Luisier, Mathieu
Publicado en:
Frontiers in Nanotechnology, 2023, ISSN 2673-3013
Editor:
Frontiers Media
DOI:
10.3929/ethz-b-000594774
Autores:
LORENZO BENATTI; Francesco Maria PUGLISI
Publicado en:
IEEE Transactions on Device and Materials Reliability, 2022, ISSN 1530-4388
Editor:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/tdmr.2022.3182941
Autores:
Suzanne Lancaster; Patrick D. Lomenzo; Moritz Engl; Bohan Xu; Thomas Mikolajick; Uwe Schroeder; Stefan Slesazeck
Publicado en:
Frontiers in Nanotechnology, 2023, ISSN 2673-3013
Editor:
Frontiers Media
DOI:
10.3389/fnano.2022.939822
Autores:
S. Lancaster, T. Mikolajick, S. Slesazeck
Publicado en:
Applied Physics Letters (APL), 2022, ISSN 0003-6951
Editor:
American Institute of Physics
DOI:
10.1063/5.0078106
Autores:
C. Zacharaki, P. Tsipas, S. Chaitoglou, L. Bégon-Lours, M. Halter, A. Dimoulas
Publicado en:
Applied Physics Letters, Edición 117/21, 2020, Página(s) 212905, ISSN 0003-6951
Editor:
American Institute of Physics
DOI:
10.1063/5.0029657
Autores:
Lyes Khacef; Philipp Klein; Matteo Cartiglia; Arianna Rubino; Giacomo Indiveri; Elisabetta Chicca
Publicado en:
Neuromorphic Computing and Engineering, 2023, ISSN 2634-4386
Editor:
IOP Publishing
DOI:
10.1088/2634-4386/ad05da
Autores:
M. Massarotto; F. Driussi; A. Affanni; S. Lancaster; S. Slesazeck; T. Mikolajick; D. Esseni
Publicado en:
Solid-State Electronics, 2022, ISSN 0038-1101
Editor:
Pergamon Press Ltd.
DOI:
10.1016/j.sse.2022.108364
Autores:
Arianna Rubino, Can Livanelioglu, Ning Qiao, Melika Payvand, Giacomo Indiveri
Publicado en:
IEEE Transactions on Circuits and Systems I: Regular Papers, Edición 68/1, 2021, Página(s) 45-56, ISSN 1549-8328
Editor:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/tcsi.2020.3035575
Autores:
Mattia Halter; Elisabetta Morabito; Antonis Olziersky; Cécile Carrétéro; André Chanthbouala; Donato Francesco Falcone; Bert Jan Offrein; Laura Bégon-Lours
Publicado en:
Journal of Materials Research, 2023, ISSN 0884-2914
Editor:
Materials Research Society
DOI:
10.1557/s43578-023-01158-8
Autores:
Nikitas Siannas, Christina Zacharaki, Polychronis Tsipas, Stefanos Chaitoglou, Laura Bégon-Lours, Cosmin Istrate, Lucian Pintilie, Athanasios Dimoulas
Publicado en:
Communications Physics, 2022, ISSN 2399-3650
Editor:
Nature Physics
DOI:
10.1038/s42005-022-00951-x
Autores:
José P. B. Silva, Ruben Alcala, Uygar E. Avci, Nick Barrett, Laura Bégon-Lours, Mattias Borg, Seungyong Byun, Sou-Chi Chang,Sang-Wook Cheong, Duk-Hyun Choe, Jean Coignus, Veeresh Deshpande, Athanasios Dimoulas, Catherine Dubourdieu, Ignasi Fina, Hiroshi Funakubo, Laurent Grenouillet, Alexei Gruverman, Jinseong Heo, Michael Hoffmann, H. Alex Hsain, Fei-Ting Huang, Cheol Seong Hwang, Jorge Íñigu
Publicado en:
APL Materials, 2023, ISSN 2166-532X
Editor:
American Institute of Physics (AIP)
DOI:
10.1063/5.0148068
Autores:
H Alex Hsain; Younghwan Lee; Suzanne Lancaster; Patrick D Lomenzo; Bohan Xu; Thomas Mikolajick; Uwe Schroeder; Gregory N Parsons; Jacob L Jones
Publicado en:
Nanotechnology, 2023, ISSN 0957-4484
Editor:
Institute of Physics Publishing
DOI:
10.1088/1361-6528/acad0a
Autores:
Laura Bégon-Lours, Mattia Halter, Youri Popoff, Bert Jan Offrein
Publicado en:
physica status solidi (RRL) – Rapid Research Letters, Edición 15/5, 2021, Página(s) 2000524, ISSN 1862-6254
Editor:
Wiley - VCH Verlag GmbH & CO. KGaA
DOI:
10.1002/pssr.202000524
Autores:
Mattia Segatto; Filippo Rupil; David Esseni
Publicado en:
IEEE Transactions on Electron Devices, 2023, ISSN 1557-9646
Editor:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/ted.2023.3265626
Autores:
Mattia Halter; Laura Bégon-Lours; Marilyne Sousa; Youri Popoff; Ute Drechsler; Valeria Bragaglia; Bert Jan Offrein
Publicado en:
Communications Materials, 2023, ISSN 2662-4443
Editor:
Nature research
DOI:
10.1038/s43246-023-00342-x
Autores:
Laura Bégon-Lours; Mattia Halter; Marilyne Sousa; Youri Popoff; Diana Dávila Pineda; Donato Francesco Falcone; Zhenming Yu; Steffen Reidt; Lorenzo Benatti; Francesco Maria Puglisi; Bert Jan Offrein
Publicado en:
Neuromorphic Computing and Engineering, 2022, ISSN 2634-4386
Editor:
IOP Publishing
DOI:
10.1088/2634-4386/ac5b2d
Autores:
Daniel Lizzit; David ESSENI; Mattia Segatto; Francesco Driussi; Riccardo Fontanini
Publicado en:
IEEE Journal of the Electron Devices Society, 2022, ISSN 2168-6734
Editor:
Institute of Electrical and Electronics Engineers Inc.
DOI:
10.1109/jeds.2022.3164652
Autores:
Marco Massarotto; Francesco Driussi; Antonio Affanni; Suzanne Lancaster; Stefan Slesazeck; Thomas Mikolajick; David Esseni
Publicado en:
Solid-State Electronics, 2023, ISSN 1879-2405
Editor:
Elsevier
DOI:
10.1016/j.sse.2022.108569
Autores:
Keerthana Shajil Nair, Marco Holzer, Catherine Dubourdieu, and Veeresh Deshpande
Publicado en:
Applied Physics Letters (APL), 2023, ISSN 0003-6951
Editor:
American Institute of Physics
DOI:
10.1021/acsaelm.2c01492
Autores:
R. Fontanini; J. Barbot; M. Segatto; S. Lancaster; Q. Duong; F. Driussi; L. Grenouillet; L. Triozon; J. Coignus; T. Mikolajick; S. Slesazeck; D. Esseni
Publicado en:
IEEE Journal of the Electron Devices Society, Edición 13, 2022, ISSN 2168-6734
Editor:
Institute of Electrical and Electronics Engineers Inc.
DOI:
10.1109/jeds.2022.3171217
Autores:
R. Fontanini; M. Segatto; K. S. Nair; M. Holzer; F. Driussi; I. Hausler; C. T. Koch; C. Dubourdieu; V. Deshpande; D. Esseni
Publicado en:
IEEE Transactions on Electron Devices, Edición 8, 2022, ISSN 0018-9383
Editor:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/ted.2022.3175684
Autores:
Dong Hyun Lee; Geun Hyeong Park; Se Hyun Kim; Ju Yong Park; Kun Yang; Stefan Slesazeck; Thomas Mikolajick; Min Hyuk Park
Publicado en:
InfoMat, 2022, ISSN 2567-3165
Editor:
Wiley Open Access
DOI:
10.1002/inf2.12380
Autores:
Benjamin Max, Michael Hoffmann, Halid Mulaosmanovic, Stefan Slesazeck, Thomas Mikolajick
Publicado en:
ACS Applied Electronic Materials, Edición 2/12, 2020, Página(s) 4023-4033, ISSN 2637-6113
Editor:
American Chemical Society
DOI:
10.1021/acsaelm.0c00832
Buscando datos de OpenAIRE...
Se ha producido un error en la búsqueda de datos de OpenAIRE
No hay resultados disponibles