Risultati finali
IBM and HZB will deliver a report illustrating the structural integration cross section flow and the functionality of the chip
Ferroelectric multilayer engineering for FTJReport on the thinnest attainable MFM FTJs with sufficiently high ON currents which could improve the sensing of BEOLintegrated FTJ devices and circuits The devices will necessarily meet the requirements for BEOL integration and neuromorphic applications
Dissemination and communication activities report (Years 1+2)Annual report on the dissemination actions taken to promote the main project achievements as well as interactions and synergies with related industrial and research initiatives T61
Final FTJ SPICE Model based on D2.2, (D2.4 update)Final FTJ SPICE Model based on D22 D24 update
Design and optimization of composite stacks in FTJThis deliverable is a report on the final optimized FTJ stack Based on the models developed in T41 and on physical parameters and insight conveyed by abinitio calculations in T42 an extensive study of design and optimization of the composite stack in FTJs will be performed Different options for stack composition will be addressed
Phd teaching module preparedWe will prepare a teaching module for the project intern PhD students to speed up their learning in the field of ferroelectric Hf(Zr)O2-based devices. The courses will be used in a teaching session that we plan to perform in conjunction with a project meeting.
Communication and online strategy and presenceThis report will establish a homogeneous visual identity for the project, including guidelines and templates for producing reports, presentations and the website. Furthermore, the project web site will be launched at the start of the projectproviding information on partners, plans, goals and activities. Social media presence, including Twitter and LinkedIn profiles, will be created.
Final FeFET SPICE Model based on D3.2, D3.3 (D3.4 update)Final FeFET SPICE Model based on D32 D33 D34 update
Dissemination and communication activities report (Years 1+2+3)Annual report on the dissemination actions taken to promote the main project achievements as well as interactions and synergies with related industrial and research initiatives T61
Dissemination and communication activities report (Year 1)Annual report on the dissemination actions taken to promote the main project achievements, as well as interactions and synergies with related industrial and research initiatives (T6.1).
Neuromorphic chips packagedThis deliverable will be a report of the successful packaging and delivering of the neuromorphic chips to UZH and UNIBI for detailed characterization in T55
Demonstrator teaching module preparedHere we will prepare lectures and labs for establishing a new course that will train a new generation of researchers to design use and apply hybrid CMOSFeFET or CMOSFTJ spiking neural network architectures Particular emphasis will be given to the learning and plasticity circuits which represent the key component of the project
NaMlab will provide a first version of a SPICE model to Task 5.1. The model describes the basic electrical characteristics of the FTJ devices. The model will be based on an already available model for the ferroelectric switching and available FTJ measurement data. The model will then be refined throughout the project according the development of the FTJ devices.
Provide initial FeFET SPICE model for adoption in Task 5.1NaMlab will provide a first version of a SPICE model to Task 5.1. The model describes the basic electrical characteristics of the FeFET devices. The model will be based on an already available FEOL FeFET model. The model will then be refined throughout the project according the development of the FeFET devices.
This deliverable will consist of a demonstration of on-line learning and classification. The demonstration will be used to evaluate performances of the neuromorphic processor with respect to a suite of standard and project specific benchmarks.
Pubblicazioni
Autori:
Suzanne Lancaster; Quang T. Duong; Erika Covi; Thomas Mikolajick; Stefan Slesazeck
Pubblicato in:
IEEE 48th European Solid State Circuits Conference (ESSCIRC) 2022, 2022
Editore:
IEEE
DOI:
10.1109/esscirc55480.2022.9911392
Autori:
Madison Cotteret, Ole Richter, Michele Mastella, Hugh Greatorex, Ella Janotte, Willian Soares Girão, Martin Ziegler, Elisabetta Chicca
Pubblicato in:
IEEE International Symposium on Circuits and Systems (ISCAS) 2023, 2023
Editore:
IEEE
DOI:
10.1109/iscas46773.2023.10181513
Autori:
R. Fontanini; J. Barbot; M. Segatto; S. Lancaster; Q. Duong; F. Driussi; L. Grenouillet; F. Triozon; J. Coignus; T. Mikolajick; S. Slesazeck; D. Esseni
Pubblicato in:
ESSDERC 2021 - IEEE 51st European Solid-State Device Research Conference (ESSDERC), 2021
Editore:
IEEE
DOI:
10.1109/essderc53440.2021.9631812
Autori:
Cartiglia, Matteo; Rubino, Arianna; Narayanan, Shyam; Frenkel, Charlotte; Haessig, Germain; Indiveri, Giacomo; Payvand, Melika
Pubblicato in:
2022 IEEE International Symposium on Circuits and Systems (ISCAS), 2022
Editore:
IEEE
DOI:
10.1109/iscas48785.2022.9937833
Autori:
Laura Begon-Lours; Mattia Halter; Youri Popoff; Zhenming Yu; Donato Francesco Falcone; Bert Jan Offrein
Pubblicato in:
ESSCIRC 2021 - IEEE 47th European Solid State Circuits Conference (ESSCIRC), 2021, ISBN 978-1-6654-3751-6
Editore:
IEEE
DOI:
10.1109/esscirc53450.2021.9567870
Autori:
David Esseni, Francesco Driussi, Daniel Lizzit, Marco Massarotto, Mattia Segatto
Pubblicato in:
Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2023
Editore:
IEEE
DOI:
10.48550/arxiv.2210.13382
Autori:
M. Segatto; M. Massarotto; S. Lancaster; Q. T. Duong; A. Affanni; R. Fontanini; F. Driussi; D. Lizzit; T. Mikolajick; S. Slesazeck; D. Esseni
Pubblicato in:
ESSDERC 2021 - IEEE 51st European Solid-State Device Research Conference (ESSDERC), 2021
Editore:
IEEE
DOI:
10.1109/essderc55479.2022.9947185
Autori:
Daniel Lizzit, Thomas Bernardi, David Esseni
Pubblicato in:
IEEE European Solid-State Device Research Conference (ESSDERC) 2022, 2022
Editore:
IEEE
DOI:
10.1109/essderc55479.2022.9947169
Autori:
Michele Mastella, Hugh Greatorex, Madison Cotteret, Ella Janotte, Willian Soares Girão, Ole Richter, Elisabetta Chicca
Pubblicato in:
International Conference on Neuromorphic Systems 2023, 2023
Editore:
ACM Press
DOI:
10.1145/3589737.3606007
Autori:
Laura Begon-Lours, Mattia Halter, Diana Davila Pineda, Youri Popoff, Valeria Bragaglia, Antonio La Porta, Daniel Jubin, Jean Fompeyrine, Bert Jan Offrein
Pubblicato in:
2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), 2021, Pagina/e 1-3, ISBN 978-1-7281-8176-9
Editore:
IEEE
DOI:
10.1109/edtm50988.2021.9420886
Autori:
Lorenzo Benatti, Paolo Pavan, Francesco Maria Puglisi
Pubblicato in:
IEEE International Reliability Physics Symposium (IRPS) 2022, 2022
Editore:
IEEE
DOI:
10.1109/irps48227.2022.9764602
Autori:
Ole Richter, Hugh Greatorex, Benjamin Hučko, Madison Cotteret, Willian Soares Girão, Ella Janotte, Michele Mastella, E. Chicca
Pubblicato in:
International Conference on Neuromorphic Systems 2023, 2023
Editore:
ACM Press
DOI:
10.1145/3589737.360600
Autori:
Suzanne Lancaster, Mattia Segatto, Cláudia Silva, Benjamin Max, Thomas Mikolajick, David Esseni, Francesco Driussi, Stefan Slesazeck
Pubblicato in:
Device Research Conference (DRC) 2023, 2023
Editore:
IEEE
DOI:
10.1109/drc58590.2023.10187018
Autori:
Lorenzo Benatti, Sara Vecchi, Milan Pesic, Francesco Maria Puglisi
Pubblicato in:
IEEE International Reliability Physics Symposium (IRPS) 2023, 2023
Editore:
IEEE
DOI:
10.1109/irps48203.2023.10118229
Autori:
Nikitas Siannas, Christina Zacharaki, Polychronis Tsipas, Stefanos Chaitoglou, Laura Begon-Lours, Athanasios Dimoulas
Pubblicato in:
IEEE European Solid-State Device Research Conference (ESSDERC) 2021, 2021
Editore:
IEEE
DOI:
10.1109/essderc53440.2021.9631382
Autori:
Lorenzo Benatti, Francesco Maria Puglisi
Pubblicato in:
IEEE International Workshop Integrated Reliability (IIRW) 2021, 2021
Editore:
IEEE
DOI:
10.1109/iirw53245.2021.9635621
Autori:
Lorenzo Benatti, Sara Vecchi, Francesco Maria Puglisi
Pubblicato in:
IEEE International Integrated Reliability Workshop (IIRW) 2022, 2022
Editore:
IEEE
DOI:
10.1109/iirw56459.2022.10032741
Autori:
Erika Covi, Quang T. Duong, Suzanne Lancaster, Viktor Havel, Jean Coignus, Justine Barbot, Ole Richter, Philip Klein, Elisabetta Chicca, Laurent Grenouillet, Athanasios Dimoulas, Thomas Mikolajick, Stefan Slesazeck
Pubblicato in:
2021 IEEE International Symposium on Circuits and Systems (ISCAS), 2021, Pagina/e 1-5, ISBN 978-1-7281-9201-7
Editore:
IEEE
DOI:
10.1109/iscas51556.2021.9401800
Autori:
D. Esseni, R. Fontanini, D. Lizzit, M. Massarotto, F. Driussi, M. Loghi
Pubblicato in:
2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), 2021, Pagina/e 1-3, ISBN 978-1-7281-8176-9
Editore:
IEEE
DOI:
10.1109/edtm50988.2021.9420848
Autori:
Arianna Rubino; Matteo Cartiglia; Melika Payvand; Giacomo Indiveri
Pubblicato in:
IEEE International Conference on Artificial Intelligence Circuits and Systems (AICAS) 2023, 2023
Editore:
IEEE
DOI:
10.1109/aicas57966.2023.10168620
Autori:
Arianna Rubino, Melika Payvand, Giacomo Indiveri
Pubblicato in:
27th IEEE International Conference on Electronics Circuits and Systems, 2020
Editore:
IEEE
DOI:
10.1109/icecs46596.2019.8964713
Autori:
M. Massarotto, M. Segatto, F. Driussi; A. Affanni, S. Lancaster, S. Slesazeck, T. Mikolajick, D. Esseni
Pubblicato in:
International Conference on Microelectronic Test Structure (ICMTS) 2023, 2023
Editore:
IEEE
DOI:
10.1109/icmts55420.2023.10094178
Autori:
Daniel Lizzit; David Esseni
Pubblicato in:
ESSDERC 2021 - IEEE 51st European Solid-State Device Research Conference (ESSDERC), 2021
Editore:
IEEE
DOI:
10.1109/essderc53440.2021.9631764
Autori:
Narayanan, Shyam; Covi, Erika; Havel, Viktor; Frenkel, Charlotte; Lancaster, Suzanne; Duong, Quang; Slesazeck, Stefan; Mikolajick, Thomas; Payvand, Melika; Indiveri, Giacomo
Pubblicato in:
2022 IEEE International Symposium on Circuits and Systems (ISCAS), 2022
Editore:
IEEE
DOI:
10.1109/iscas48785.2022.9937555
Autori:
L. Grenouillet, J. Barbot, J. Laguerre, S. Martin, C. Carabasse, M. Louro, M. Bedjaoui, S. Minoret, S. Kerdilès, C. Boixaderas, T. Magis, C. Jahan, F. Andrieu, J. Coignus
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IEEE International Reliability Physics Symposium (IRPS) 2023, 2023
Editore:
IEEE
DOI:
10.1109/irps48203.2023.10118099
Autori:
R. Fontanini, M. Massarotto, R. Specogna, F. Driussi, M. Loghi, D. Esseni
Pubblicato in:
2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), 2021, Pagina/e 1-3, ISBN 978-1-7281-8176-9
Editore:
IEEE
DOI:
10.1109/edtm50988.2021.9420863
Autori:
Ruben Alcala, Monica Materano, Patrick D. Lomenzo, Pramoda Vishnumurthy, Wassim Hamouda, Catherine Dubourdieu, Alfred Kersch, Nicolas Barrett, Thomas Mikolajick, Uwe Schroeder
Pubblicato in:
Advanced Functional Materials, 2023, ISSN 1616-301X
Editore:
John Wiley & Sons Ltd.
DOI:
10.1002/adfm.202303261
Autori:
Erika Covi, Elisa Donati, Stefano Brivio, Hadi Heidari
Pubblicato in:
Frontiers in Neuroscience, 2022, ISSN 1662-4548
Editore:
Frontiers Research Foundation
DOI:
10.3389/fnins.2022.863680
Autori:
Veeresh Deshpande; Keerthana Shajil Nair; Keerthana Shajil Nair; Marco Holzer; Marco Holzer; Sourish Banerjee; Catherine Dubourdieu; Catherine Dubourdieu
Pubblicato in:
Applied Physics Letters, Numero 9, 2021, ISSN 0038-1101
Editore:
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DOI:
10.1016/j.sse.2021.108054
Autori:
Nikitas Siannas, Christina Zacharaki, Polychronis Tsipas, Dong Jik Kim, Wassim Hamouda, Cosmin Istrate, Lucian Pintilie, Martin Schmidbauer, Catherine Dubourdieu, Athanasios Dimoulas
Pubblicato in:
Advanced Functional materials, 2023, ISSN 1616-301X
Editore:
John Wiley & Sons Ltd.
DOI:
10.1002/adfm.202311767
Autori:
Thomas Mikolajick, Min Hyuk Park, Laura Begon-Lours, Stefan Slesazeck
Pubblicato in:
Advanced Materials, 2023, ISSN 1521-4095
Editore:
Wiley
DOI:
10.1002/adma.202206042
Autori:
Lorenzo Benatti, Sara Vecchi, Francesco Maria Puglisi
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IEEE Transactions on Device and Materials Reliability, 2023, ISSN 1558-2574
Editore:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/tdmr.2023.3261441
Autori:
Christina Zacharaki; Stefanos Chaitoglou; Nikitas Siannas; Polychronis Tsipas; Athanasios Dimoulas
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Editore:
American Chemical Society
DOI:
10.1021/acsaelm.2c00324
Autori:
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Editore:
Frontiers Media
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Editore:
Wiley Open Access
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10.1002/aelm.202101395
Autori:
Laura Begon-Lours; Mattia Halter; Youri Popoff; Z. Yu; D.F. Falcone; D. Davila; Valeria Bragaglia; A. La Porta; Daniel Jubin; Jean Fompeyrine; Bert Jan Offrein
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Editore:
Institute of Electrical and Electronics Engineers Inc.
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Editore:
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Autori:
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Editore:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/tdmr.2022.3182941
Autori:
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Editore:
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DOI:
10.3389/fnano.2022.939822
Autori:
S. Lancaster, T. Mikolajick, S. Slesazeck
Pubblicato in:
Applied Physics Letters (APL), 2022, ISSN 0003-6951
Editore:
American Institute of Physics
DOI:
10.1063/5.0078106
Autori:
C. Zacharaki, P. Tsipas, S. Chaitoglou, L. Bégon-Lours, M. Halter, A. Dimoulas
Pubblicato in:
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Editore:
American Institute of Physics
DOI:
10.1063/5.0029657
Autori:
Lyes Khacef; Philipp Klein; Matteo Cartiglia; Arianna Rubino; Giacomo Indiveri; Elisabetta Chicca
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Neuromorphic Computing and Engineering, 2023, ISSN 2634-4386
Editore:
IOP Publishing
DOI:
10.1088/2634-4386/ad05da
Autori:
M. Massarotto; F. Driussi; A. Affanni; S. Lancaster; S. Slesazeck; T. Mikolajick; D. Esseni
Pubblicato in:
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Editore:
Pergamon Press Ltd.
DOI:
10.1016/j.sse.2022.108364
Autori:
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Editore:
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DOI:
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Autori:
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Pubblicato in:
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Editore:
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DOI:
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Autori:
Nikitas Siannas, Christina Zacharaki, Polychronis Tsipas, Stefanos Chaitoglou, Laura Bégon-Lours, Cosmin Istrate, Lucian Pintilie, Athanasios Dimoulas
Pubblicato in:
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Editore:
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Autori:
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Pubblicato in:
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Editore:
American Institute of Physics (AIP)
DOI:
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Autori:
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Editore:
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DOI:
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Laura Bégon-Lours, Mattia Halter, Youri Popoff, Bert Jan Offrein
Pubblicato in:
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Editore:
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DOI:
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Autori:
Mattia Segatto; Filippo Rupil; David Esseni
Pubblicato in:
IEEE Transactions on Electron Devices, 2023, ISSN 1557-9646
Editore:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/ted.2023.3265626
Autori:
Mattia Halter; Laura Bégon-Lours; Marilyne Sousa; Youri Popoff; Ute Drechsler; Valeria Bragaglia; Bert Jan Offrein
Pubblicato in:
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Editore:
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DOI:
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Autori:
Laura Bégon-Lours; Mattia Halter; Marilyne Sousa; Youri Popoff; Diana Dávila Pineda; Donato Francesco Falcone; Zhenming Yu; Steffen Reidt; Lorenzo Benatti; Francesco Maria Puglisi; Bert Jan Offrein
Pubblicato in:
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Editore:
IOP Publishing
DOI:
10.1088/2634-4386/ac5b2d
Autori:
Daniel Lizzit; David ESSENI; Mattia Segatto; Francesco Driussi; Riccardo Fontanini
Pubblicato in:
IEEE Journal of the Electron Devices Society, 2022, ISSN 2168-6734
Editore:
Institute of Electrical and Electronics Engineers Inc.
DOI:
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Autori:
Marco Massarotto; Francesco Driussi; Antonio Affanni; Suzanne Lancaster; Stefan Slesazeck; Thomas Mikolajick; David Esseni
Pubblicato in:
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Editore:
Elsevier
DOI:
10.1016/j.sse.2022.108569
Autori:
Keerthana Shajil Nair, Marco Holzer, Catherine Dubourdieu, and Veeresh Deshpande
Pubblicato in:
Applied Physics Letters (APL), 2023, ISSN 0003-6951
Editore:
American Institute of Physics
DOI:
10.1021/acsaelm.2c01492
Autori:
R. Fontanini; J. Barbot; M. Segatto; S. Lancaster; Q. Duong; F. Driussi; L. Grenouillet; L. Triozon; J. Coignus; T. Mikolajick; S. Slesazeck; D. Esseni
Pubblicato in:
IEEE Journal of the Electron Devices Society, Numero 13, 2022, ISSN 2168-6734
Editore:
Institute of Electrical and Electronics Engineers Inc.
DOI:
10.1109/jeds.2022.3171217
Autori:
R. Fontanini; M. Segatto; K. S. Nair; M. Holzer; F. Driussi; I. Hausler; C. T. Koch; C. Dubourdieu; V. Deshpande; D. Esseni
Pubblicato in:
IEEE Transactions on Electron Devices, Numero 8, 2022, ISSN 0018-9383
Editore:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/ted.2022.3175684
Autori:
Dong Hyun Lee; Geun Hyeong Park; Se Hyun Kim; Ju Yong Park; Kun Yang; Stefan Slesazeck; Thomas Mikolajick; Min Hyuk Park
Pubblicato in:
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Editore:
Wiley Open Access
DOI:
10.1002/inf2.12380
Autori:
Benjamin Max, Michael Hoffmann, Halid Mulaosmanovic, Stefan Slesazeck, Thomas Mikolajick
Pubblicato in:
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Editore:
American Chemical Society
DOI:
10.1021/acsaelm.0c00832
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