Rezultaty
IBM and HZB will deliver a report illustrating the structural integration cross section flow and the functionality of the chip
Ferroelectric multilayer engineering for FTJReport on the thinnest attainable MFM FTJs with sufficiently high ON currents which could improve the sensing of BEOLintegrated FTJ devices and circuits The devices will necessarily meet the requirements for BEOL integration and neuromorphic applications
Dissemination and communication activities report (Years 1+2)Annual report on the dissemination actions taken to promote the main project achievements as well as interactions and synergies with related industrial and research initiatives T61
Final FTJ SPICE Model based on D2.2, (D2.4 update)Final FTJ SPICE Model based on D22 D24 update
Design and optimization of composite stacks in FTJThis deliverable is a report on the final optimized FTJ stack Based on the models developed in T41 and on physical parameters and insight conveyed by abinitio calculations in T42 an extensive study of design and optimization of the composite stack in FTJs will be performed Different options for stack composition will be addressed
Phd teaching module preparedWe will prepare a teaching module for the project intern PhD students to speed up their learning in the field of ferroelectric Hf(Zr)O2-based devices. The courses will be used in a teaching session that we plan to perform in conjunction with a project meeting.
Communication and online strategy and presenceThis report will establish a homogeneous visual identity for the project, including guidelines and templates for producing reports, presentations and the website. Furthermore, the project web site will be launched at the start of the projectproviding information on partners, plans, goals and activities. Social media presence, including Twitter and LinkedIn profiles, will be created.
Final FeFET SPICE Model based on D3.2, D3.3 (D3.4 update)Final FeFET SPICE Model based on D32 D33 D34 update
Dissemination and communication activities report (Years 1+2+3)Annual report on the dissemination actions taken to promote the main project achievements as well as interactions and synergies with related industrial and research initiatives T61
Dissemination and communication activities report (Year 1)Annual report on the dissemination actions taken to promote the main project achievements, as well as interactions and synergies with related industrial and research initiatives (T6.1).
Neuromorphic chips packagedThis deliverable will be a report of the successful packaging and delivering of the neuromorphic chips to UZH and UNIBI for detailed characterization in T55
Demonstrator teaching module preparedHere we will prepare lectures and labs for establishing a new course that will train a new generation of researchers to design use and apply hybrid CMOSFeFET or CMOSFTJ spiking neural network architectures Particular emphasis will be given to the learning and plasticity circuits which represent the key component of the project
NaMlab will provide a first version of a SPICE model to Task 5.1. The model describes the basic electrical characteristics of the FTJ devices. The model will be based on an already available model for the ferroelectric switching and available FTJ measurement data. The model will then be refined throughout the project according the development of the FTJ devices.
Provide initial FeFET SPICE model for adoption in Task 5.1NaMlab will provide a first version of a SPICE model to Task 5.1. The model describes the basic electrical characteristics of the FeFET devices. The model will be based on an already available FEOL FeFET model. The model will then be refined throughout the project according the development of the FeFET devices.
This deliverable will consist of a demonstration of on-line learning and classification. The demonstration will be used to evaluate performances of the neuromorphic processor with respect to a suite of standard and project specific benchmarks.
Publikacje
Autorzy:
Suzanne Lancaster; Quang T. Duong; Erika Covi; Thomas Mikolajick; Stefan Slesazeck
Opublikowane w:
IEEE 48th European Solid State Circuits Conference (ESSCIRC) 2022, 2022
Wydawca:
IEEE
DOI:
10.1109/esscirc55480.2022.9911392
Autorzy:
Madison Cotteret, Ole Richter, Michele Mastella, Hugh Greatorex, Ella Janotte, Willian Soares Girão, Martin Ziegler, Elisabetta Chicca
Opublikowane w:
IEEE International Symposium on Circuits and Systems (ISCAS) 2023, 2023
Wydawca:
IEEE
DOI:
10.1109/iscas46773.2023.10181513
Autorzy:
R. Fontanini; J. Barbot; M. Segatto; S. Lancaster; Q. Duong; F. Driussi; L. Grenouillet; F. Triozon; J. Coignus; T. Mikolajick; S. Slesazeck; D. Esseni
Opublikowane w:
ESSDERC 2021 - IEEE 51st European Solid-State Device Research Conference (ESSDERC), 2021
Wydawca:
IEEE
DOI:
10.1109/essderc53440.2021.9631812
Autorzy:
Cartiglia, Matteo; Rubino, Arianna; Narayanan, Shyam; Frenkel, Charlotte; Haessig, Germain; Indiveri, Giacomo; Payvand, Melika
Opublikowane w:
2022 IEEE International Symposium on Circuits and Systems (ISCAS), 2022
Wydawca:
IEEE
DOI:
10.1109/iscas48785.2022.9937833
Autorzy:
Laura Begon-Lours; Mattia Halter; Youri Popoff; Zhenming Yu; Donato Francesco Falcone; Bert Jan Offrein
Opublikowane w:
ESSCIRC 2021 - IEEE 47th European Solid State Circuits Conference (ESSCIRC), 2021, ISBN 978-1-6654-3751-6
Wydawca:
IEEE
DOI:
10.1109/esscirc53450.2021.9567870
Autorzy:
David Esseni, Francesco Driussi, Daniel Lizzit, Marco Massarotto, Mattia Segatto
Opublikowane w:
Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2023
Wydawca:
IEEE
DOI:
10.48550/arxiv.2210.13382
Autorzy:
M. Segatto; M. Massarotto; S. Lancaster; Q. T. Duong; A. Affanni; R. Fontanini; F. Driussi; D. Lizzit; T. Mikolajick; S. Slesazeck; D. Esseni
Opublikowane w:
ESSDERC 2021 - IEEE 51st European Solid-State Device Research Conference (ESSDERC), 2021
Wydawca:
IEEE
DOI:
10.1109/essderc55479.2022.9947185
Autorzy:
Daniel Lizzit, Thomas Bernardi, David Esseni
Opublikowane w:
IEEE European Solid-State Device Research Conference (ESSDERC) 2022, 2022
Wydawca:
IEEE
DOI:
10.1109/essderc55479.2022.9947169
Autorzy:
Michele Mastella, Hugh Greatorex, Madison Cotteret, Ella Janotte, Willian Soares Girão, Ole Richter, Elisabetta Chicca
Opublikowane w:
International Conference on Neuromorphic Systems 2023, 2023
Wydawca:
ACM Press
DOI:
10.1145/3589737.3606007
Autorzy:
Laura Begon-Lours, Mattia Halter, Diana Davila Pineda, Youri Popoff, Valeria Bragaglia, Antonio La Porta, Daniel Jubin, Jean Fompeyrine, Bert Jan Offrein
Opublikowane w:
2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), 2021, Strona(/y) 1-3, ISBN 978-1-7281-8176-9
Wydawca:
IEEE
DOI:
10.1109/edtm50988.2021.9420886
Autorzy:
Lorenzo Benatti, Paolo Pavan, Francesco Maria Puglisi
Opublikowane w:
IEEE International Reliability Physics Symposium (IRPS) 2022, 2022
Wydawca:
IEEE
DOI:
10.1109/irps48227.2022.9764602
Autorzy:
Ole Richter, Hugh Greatorex, Benjamin Hučko, Madison Cotteret, Willian Soares Girão, Ella Janotte, Michele Mastella, E. Chicca
Opublikowane w:
International Conference on Neuromorphic Systems 2023, 2023
Wydawca:
ACM Press
DOI:
10.1145/3589737.360600
Autorzy:
Suzanne Lancaster, Mattia Segatto, Cláudia Silva, Benjamin Max, Thomas Mikolajick, David Esseni, Francesco Driussi, Stefan Slesazeck
Opublikowane w:
Device Research Conference (DRC) 2023, 2023
Wydawca:
IEEE
DOI:
10.1109/drc58590.2023.10187018
Autorzy:
Lorenzo Benatti, Sara Vecchi, Milan Pesic, Francesco Maria Puglisi
Opublikowane w:
IEEE International Reliability Physics Symposium (IRPS) 2023, 2023
Wydawca:
IEEE
DOI:
10.1109/irps48203.2023.10118229
Autorzy:
Nikitas Siannas, Christina Zacharaki, Polychronis Tsipas, Stefanos Chaitoglou, Laura Begon-Lours, Athanasios Dimoulas
Opublikowane w:
IEEE European Solid-State Device Research Conference (ESSDERC) 2021, 2021
Wydawca:
IEEE
DOI:
10.1109/essderc53440.2021.9631382
Autorzy:
Lorenzo Benatti, Francesco Maria Puglisi
Opublikowane w:
IEEE International Workshop Integrated Reliability (IIRW) 2021, 2021
Wydawca:
IEEE
DOI:
10.1109/iirw53245.2021.9635621
Autorzy:
Lorenzo Benatti, Sara Vecchi, Francesco Maria Puglisi
Opublikowane w:
IEEE International Integrated Reliability Workshop (IIRW) 2022, 2022
Wydawca:
IEEE
DOI:
10.1109/iirw56459.2022.10032741
Autorzy:
Erika Covi, Quang T. Duong, Suzanne Lancaster, Viktor Havel, Jean Coignus, Justine Barbot, Ole Richter, Philip Klein, Elisabetta Chicca, Laurent Grenouillet, Athanasios Dimoulas, Thomas Mikolajick, Stefan Slesazeck
Opublikowane w:
2021 IEEE International Symposium on Circuits and Systems (ISCAS), 2021, Strona(/y) 1-5, ISBN 978-1-7281-9201-7
Wydawca:
IEEE
DOI:
10.1109/iscas51556.2021.9401800
Autorzy:
D. Esseni, R. Fontanini, D. Lizzit, M. Massarotto, F. Driussi, M. Loghi
Opublikowane w:
2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), 2021, Strona(/y) 1-3, ISBN 978-1-7281-8176-9
Wydawca:
IEEE
DOI:
10.1109/edtm50988.2021.9420848
Autorzy:
Arianna Rubino; Matteo Cartiglia; Melika Payvand; Giacomo Indiveri
Opublikowane w:
IEEE International Conference on Artificial Intelligence Circuits and Systems (AICAS) 2023, 2023
Wydawca:
IEEE
DOI:
10.1109/aicas57966.2023.10168620
Autorzy:
Arianna Rubino, Melika Payvand, Giacomo Indiveri
Opublikowane w:
27th IEEE International Conference on Electronics Circuits and Systems, 2020
Wydawca:
IEEE
DOI:
10.1109/icecs46596.2019.8964713
Autorzy:
M. Massarotto, M. Segatto, F. Driussi; A. Affanni, S. Lancaster, S. Slesazeck, T. Mikolajick, D. Esseni
Opublikowane w:
International Conference on Microelectronic Test Structure (ICMTS) 2023, 2023
Wydawca:
IEEE
DOI:
10.1109/icmts55420.2023.10094178
Autorzy:
Daniel Lizzit; David Esseni
Opublikowane w:
ESSDERC 2021 - IEEE 51st European Solid-State Device Research Conference (ESSDERC), 2021
Wydawca:
IEEE
DOI:
10.1109/essderc53440.2021.9631764
Autorzy:
Narayanan, Shyam; Covi, Erika; Havel, Viktor; Frenkel, Charlotte; Lancaster, Suzanne; Duong, Quang; Slesazeck, Stefan; Mikolajick, Thomas; Payvand, Melika; Indiveri, Giacomo
Opublikowane w:
2022 IEEE International Symposium on Circuits and Systems (ISCAS), 2022
Wydawca:
IEEE
DOI:
10.1109/iscas48785.2022.9937555
Autorzy:
L. Grenouillet, J. Barbot, J. Laguerre, S. Martin, C. Carabasse, M. Louro, M. Bedjaoui, S. Minoret, S. Kerdilès, C. Boixaderas, T. Magis, C. Jahan, F. Andrieu, J. Coignus
Opublikowane w:
IEEE International Reliability Physics Symposium (IRPS) 2023, 2023
Wydawca:
IEEE
DOI:
10.1109/irps48203.2023.10118099
Autorzy:
R. Fontanini, M. Massarotto, R. Specogna, F. Driussi, M. Loghi, D. Esseni
Opublikowane w:
2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), 2021, Strona(/y) 1-3, ISBN 978-1-7281-8176-9
Wydawca:
IEEE
DOI:
10.1109/edtm50988.2021.9420863
Autorzy:
Ruben Alcala, Monica Materano, Patrick D. Lomenzo, Pramoda Vishnumurthy, Wassim Hamouda, Catherine Dubourdieu, Alfred Kersch, Nicolas Barrett, Thomas Mikolajick, Uwe Schroeder
Opublikowane w:
Advanced Functional Materials, 2023, ISSN 1616-301X
Wydawca:
John Wiley & Sons Ltd.
DOI:
10.1002/adfm.202303261
Autorzy:
Erika Covi, Elisa Donati, Stefano Brivio, Hadi Heidari
Opublikowane w:
Frontiers in Neuroscience, 2022, ISSN 1662-4548
Wydawca:
Frontiers Research Foundation
DOI:
10.3389/fnins.2022.863680
Autorzy:
Veeresh Deshpande; Keerthana Shajil Nair; Keerthana Shajil Nair; Marco Holzer; Marco Holzer; Sourish Banerjee; Catherine Dubourdieu; Catherine Dubourdieu
Opublikowane w:
Applied Physics Letters, Numer 9, 2021, ISSN 0038-1101
Wydawca:
Pergamon Press Ltd.
DOI:
10.1016/j.sse.2021.108054
Autorzy:
Nikitas Siannas, Christina Zacharaki, Polychronis Tsipas, Dong Jik Kim, Wassim Hamouda, Cosmin Istrate, Lucian Pintilie, Martin Schmidbauer, Catherine Dubourdieu, Athanasios Dimoulas
Opublikowane w:
Advanced Functional materials, 2023, ISSN 1616-301X
Wydawca:
John Wiley & Sons Ltd.
DOI:
10.1002/adfm.202311767
Autorzy:
Thomas Mikolajick, Min Hyuk Park, Laura Begon-Lours, Stefan Slesazeck
Opublikowane w:
Advanced Materials, 2023, ISSN 1521-4095
Wydawca:
Wiley
DOI:
10.1002/adma.202206042
Autorzy:
Lorenzo Benatti, Sara Vecchi, Francesco Maria Puglisi
Opublikowane w:
IEEE Transactions on Device and Materials Reliability, 2023, ISSN 1558-2574
Wydawca:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/tdmr.2023.3261441
Autorzy:
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Opublikowane w:
ACS Applied Electronic Materials, 2022, ISSN 2637-6113
Wydawca:
American Chemical Society
DOI:
10.1021/acsaelm.2c00324
Autorzy:
Erika Covi, Elisa Donati, Xiangpeng Liang, David Kappel, Hadi Heidari, Melika Payvand, Wei Wang
Opublikowane w:
Frontiers in Neuroscience, Numer 15, 2021, ISSN 1662-453X
Wydawca:
Frontiers Media
DOI:
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Autorzy:
Laura Bégon‐Lours; Mattia Halter; Francesco Maria Puglisi; Lorenzo Benatti; Donato Francesco Falcone; Youri Popoff; Diana Dávila Pineda; Marilyne Sousa; Bert Jan Offrein
Opublikowane w:
Advanced Electronic Materials, 2022, ISSN 2199-160x
Wydawca:
Wiley Open Access
DOI:
10.1002/aelm.202101395
Autorzy:
Laura Begon-Lours; Mattia Halter; Youri Popoff; Z. Yu; D.F. Falcone; D. Davila; Valeria Bragaglia; A. La Porta; Daniel Jubin; Jean Fompeyrine; Bert Jan Offrein
Opublikowane w:
IEEE Journal of the Electron Devices Society, Numer 33, 2021, ISSN 2168-6734
Wydawca:
Institute of Electrical and Electronics Engineers Inc.
DOI:
10.1109/jeds.2021.3108523
Autorzy:
Wen, Xin; Halter, Mattia; Bégon-Lours, Laura; Luisier, Mathieu
Opublikowane w:
Frontiers in Nanotechnology, 2023, ISSN 2673-3013
Wydawca:
Frontiers Media
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Autorzy:
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Opublikowane w:
IEEE Transactions on Device and Materials Reliability, 2022, ISSN 1530-4388
Wydawca:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/tdmr.2022.3182941
Autorzy:
Suzanne Lancaster; Patrick D. Lomenzo; Moritz Engl; Bohan Xu; Thomas Mikolajick; Uwe Schroeder; Stefan Slesazeck
Opublikowane w:
Frontiers in Nanotechnology, 2023, ISSN 2673-3013
Wydawca:
Frontiers Media
DOI:
10.3389/fnano.2022.939822
Autorzy:
S. Lancaster, T. Mikolajick, S. Slesazeck
Opublikowane w:
Applied Physics Letters (APL), 2022, ISSN 0003-6951
Wydawca:
American Institute of Physics
DOI:
10.1063/5.0078106
Autorzy:
C. Zacharaki, P. Tsipas, S. Chaitoglou, L. Bégon-Lours, M. Halter, A. Dimoulas
Opublikowane w:
Applied Physics Letters, Numer 117/21, 2020, Strona(/y) 212905, ISSN 0003-6951
Wydawca:
American Institute of Physics
DOI:
10.1063/5.0029657
Autorzy:
Lyes Khacef; Philipp Klein; Matteo Cartiglia; Arianna Rubino; Giacomo Indiveri; Elisabetta Chicca
Opublikowane w:
Neuromorphic Computing and Engineering, 2023, ISSN 2634-4386
Wydawca:
IOP Publishing
DOI:
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Autorzy:
M. Massarotto; F. Driussi; A. Affanni; S. Lancaster; S. Slesazeck; T. Mikolajick; D. Esseni
Opublikowane w:
Solid-State Electronics, 2022, ISSN 0038-1101
Wydawca:
Pergamon Press Ltd.
DOI:
10.1016/j.sse.2022.108364
Autorzy:
Arianna Rubino, Can Livanelioglu, Ning Qiao, Melika Payvand, Giacomo Indiveri
Opublikowane w:
IEEE Transactions on Circuits and Systems I: Regular Papers, Numer 68/1, 2021, Strona(/y) 45-56, ISSN 1549-8328
Wydawca:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/tcsi.2020.3035575
Autorzy:
Mattia Halter; Elisabetta Morabito; Antonis Olziersky; Cécile Carrétéro; André Chanthbouala; Donato Francesco Falcone; Bert Jan Offrein; Laura Bégon-Lours
Opublikowane w:
Journal of Materials Research, 2023, ISSN 0884-2914
Wydawca:
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Autorzy:
Nikitas Siannas, Christina Zacharaki, Polychronis Tsipas, Stefanos Chaitoglou, Laura Bégon-Lours, Cosmin Istrate, Lucian Pintilie, Athanasios Dimoulas
Opublikowane w:
Communications Physics, 2022, ISSN 2399-3650
Wydawca:
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Autorzy:
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Opublikowane w:
APL Materials, 2023, ISSN 2166-532X
Wydawca:
American Institute of Physics (AIP)
DOI:
10.1063/5.0148068
Autorzy:
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Opublikowane w:
Nanotechnology, 2023, ISSN 0957-4484
Wydawca:
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DOI:
10.1088/1361-6528/acad0a
Autorzy:
Laura Bégon-Lours, Mattia Halter, Youri Popoff, Bert Jan Offrein
Opublikowane w:
physica status solidi (RRL) – Rapid Research Letters, Numer 15/5, 2021, Strona(/y) 2000524, ISSN 1862-6254
Wydawca:
Wiley - VCH Verlag GmbH & CO. KGaA
DOI:
10.1002/pssr.202000524
Autorzy:
Mattia Segatto; Filippo Rupil; David Esseni
Opublikowane w:
IEEE Transactions on Electron Devices, 2023, ISSN 1557-9646
Wydawca:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/ted.2023.3265626
Autorzy:
Mattia Halter; Laura Bégon-Lours; Marilyne Sousa; Youri Popoff; Ute Drechsler; Valeria Bragaglia; Bert Jan Offrein
Opublikowane w:
Communications Materials, 2023, ISSN 2662-4443
Wydawca:
Nature research
DOI:
10.1038/s43246-023-00342-x
Autorzy:
Laura Bégon-Lours; Mattia Halter; Marilyne Sousa; Youri Popoff; Diana Dávila Pineda; Donato Francesco Falcone; Zhenming Yu; Steffen Reidt; Lorenzo Benatti; Francesco Maria Puglisi; Bert Jan Offrein
Opublikowane w:
Neuromorphic Computing and Engineering, 2022, ISSN 2634-4386
Wydawca:
IOP Publishing
DOI:
10.1088/2634-4386/ac5b2d
Autorzy:
Daniel Lizzit; David ESSENI; Mattia Segatto; Francesco Driussi; Riccardo Fontanini
Opublikowane w:
IEEE Journal of the Electron Devices Society, 2022, ISSN 2168-6734
Wydawca:
Institute of Electrical and Electronics Engineers Inc.
DOI:
10.1109/jeds.2022.3164652
Autorzy:
Marco Massarotto; Francesco Driussi; Antonio Affanni; Suzanne Lancaster; Stefan Slesazeck; Thomas Mikolajick; David Esseni
Opublikowane w:
Solid-State Electronics, 2023, ISSN 1879-2405
Wydawca:
Elsevier
DOI:
10.1016/j.sse.2022.108569
Autorzy:
Keerthana Shajil Nair, Marco Holzer, Catherine Dubourdieu, and Veeresh Deshpande
Opublikowane w:
Applied Physics Letters (APL), 2023, ISSN 0003-6951
Wydawca:
American Institute of Physics
DOI:
10.1021/acsaelm.2c01492
Autorzy:
R. Fontanini; J. Barbot; M. Segatto; S. Lancaster; Q. Duong; F. Driussi; L. Grenouillet; L. Triozon; J. Coignus; T. Mikolajick; S. Slesazeck; D. Esseni
Opublikowane w:
IEEE Journal of the Electron Devices Society, Numer 13, 2022, ISSN 2168-6734
Wydawca:
Institute of Electrical and Electronics Engineers Inc.
DOI:
10.1109/jeds.2022.3171217
Autorzy:
R. Fontanini; M. Segatto; K. S. Nair; M. Holzer; F. Driussi; I. Hausler; C. T. Koch; C. Dubourdieu; V. Deshpande; D. Esseni
Opublikowane w:
IEEE Transactions on Electron Devices, Numer 8, 2022, ISSN 0018-9383
Wydawca:
Institute of Electrical and Electronics Engineers
DOI:
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Autorzy:
Dong Hyun Lee; Geun Hyeong Park; Se Hyun Kim; Ju Yong Park; Kun Yang; Stefan Slesazeck; Thomas Mikolajick; Min Hyuk Park
Opublikowane w:
InfoMat, 2022, ISSN 2567-3165
Wydawca:
Wiley Open Access
DOI:
10.1002/inf2.12380
Autorzy:
Benjamin Max, Michael Hoffmann, Halid Mulaosmanovic, Stefan Slesazeck, Thomas Mikolajick
Opublikowane w:
ACS Applied Electronic Materials, Numer 2/12, 2020, Strona(/y) 4023-4033, ISSN 2637-6113
Wydawca:
American Chemical Society
DOI:
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