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3D IC Design Flow for Hybrid-bonding 3D System on Chip

Project description

A novel process model will help us get more from Moore

Call for proposal

H2020-MSCA-IF-2019
See other projects for this call

Funding Scheme

MSCA-IF-EF-ST - Standard EF

Coordinator

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM
Address
Kapeldreef 75
3001 Leuven
Belgium
Activity type
Research Organisations
EU contribution
€ 178 320