3D IC Design Flow for Hybrid-bonding 3D System on Chip

Project Information

H-3D-SOC

Grant agreement ID: 894805

DOI 10.3030/894805

Project closed

EC signature date 26 March 2020

Start date 1 April 2020

End date 31 March 2022

Funded under

• EXCELLENT SCIENCE - Marie Skłodowska-Curie Actions

Total cost € 178 320,00

EU contribution € 178 320,00

Coordinated by

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM
Belgium

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Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .

Publications

Conference proceedings (4)

Design and Optimization of SRAM Macro and Logic Using Backside Interconnects at 2nm node

Author(s): R Chen, G Sisto, A Jourdain, G Hiblot, M Stucchi, N Kakarla, B Chehab, SM Salahuddin, F Schleicher, A Veloso, G Hellings, P Weckx, D Milojevic, G Van der Plas, J Ryckaert, E Beyne
Published in: 2021 IEEE International Electron Devices Meeting (IEDM), Issue yearly, 2021, Page(s) 22.4. 1-22.4. 4
Publisher: IEEE
DOI: 10.1109/iedm19574.2021.9720528

IR-Drop Analysis of Hybrid Bonded 3D-ICs with Backside Power Delivery and μ-& n-TSVs

Author(s): G Sisto, B Chehab, B Genneret, R Baert, R Chen, P Weckx, J Ryckaert, R Chou, G van Der Plas, E Beyne, D Milojevic
Published in: 2021 IEEE International Interconnect Technology Conference (IITC), Issue yearly, 2020, Page(s) 1~3
Publisher: IEEE
DOI: 10.1109/iitc51362.2021.9537541

Design And Sign-off Methodologies For Wafer-To-Wafer Bonded 3D-ICs At Advanced Nodes (invited)

Author(s): Giuliano Sisto; Rongmei Chen; Richard Chou; Geert Van der Plas; Eric Beyne; Rod Metcalfe; Dragomir Milojevic
Published in: 2021 ACM/IEEE International Workshop on System Level Interconnect Prediction (SLIP), Issue yearly, 2022
Publisher: IEEE
DOI: 10.1109/slip52707.2021.00011

3D-optimized SRAM Macro Design and Application to Memory-on-Logic 3D-IC at Advanced Nodes

Author(s): R Chen, P Weckx, SM Salahuddin, S-W Kim, G Sisto, G Van der Plas, M Stucchi, R Baert, P Debacker, MH Na, J Ryckaert, D Milojevic, E Beyne
Published in: 2020 IEEE International Electron Devices Meeting (IEDM), Issue yearly, 2020, Page(s) 15.2. 1-15.2. 4
Publisher: IEEE
DOI: 10.1109/iedm13553.2020.9371905

Peer reviewed articles (3)

Carbon Nanotube SRAM in 5-nm Technology Node Design, Optimization, and Performance Evaluation—Part II: CNT Interconnect Optimization

Author(s): Rongmei Chen, Lin Chen, Jie Liang, Yuanqing Cheng, Souhir Elloumi, Jaehyun Lee, Kangwei Xu, Vihar P Georgiev, Kai Ni, Peter Debacker, Asen Asenov, Aida Todri-Sanial
Published in: IEEE Transactions on Very Large Scale Integration (VLSI) Systems, Issue montly, 2022, Page(s) 440-448, ISSN 1063-8210
Publisher: Institute of Electrical and Electronics Engineers
DOI: 10.1109/tvlsi.2022.3146064

Carbon Nanotube SRAM in 5-nm Technology Node Design, Optimization, and Performance Evaluation—Part I: CNFET Transistor Optimization

Author(s): Rongmei Chen, Lin Chen, Jie Liang, Yuanqing Cheng, Souhir Elloumi, Jaehyun Lee, Kangwei Xu, Vihar P Georgiev, Kai Ni, Peter Debacker, Asen Asenov, Aida Todri-Sanial
Published in: IEEE Transactions on Very Large Scale Integration (VLSI) Systems, Issue montly, 2022, Page(s) 432-439, ISSN 1063-8210
Publisher: Institute of Electrical and Electronics Engineers
DOI: 10.1109/tvlsi.2022.3146125

Extended Methodology to Determine SRAM Write Margin in Resistance-Dominated Technology Node

Author(s): Liu, Hsiao-Hsuan, Salahuddin, Shairfe M ; Abdi, Dawit ; Chen, Rongmei ; Weckx, Pieter ; Matagne, Philippe ; Catthoor, Francky
Published in: IEEE TRANSACTIONS ON ELECTRON DEVICES, Issue montly, 2022, Page(s) 3113 - 3117, ISSN 0018-9383
Publisher: Institute of Electrical and Electronics Engineers
DOI: 10.1109/ted.2022.3165738