Project description DEENESFRITPL Magnetic alignment could boost performance of 3D integrated circuits Three-dimensional (3D) integrated circuits offer a way to continue the trend of compact and powerful microelectronic devices by stacking 2D dies and connecting them in the third dimension. 3D integration promises many significant benefits including heterogeneous integration of components and increased data transfer bandwidth in a memory device stacked on top of the processor. In the chip-to-wafer bonding process, the number of interchip interconnects is limited by the accuracy of the alignment process. Current alignment methods rely on optical alignment techniques that have poor resolution and therefore limit the bandwidth of interchip communication. The EU-funded MAGALIGN project plans to use a novel magnetic alignment approach based on nanomagnetism and spin electronics that could yield unprecedented alignment accuracy during wafer bonding. Show the project objective Hide the project objective Objective In microelectronics, 3D integration and assembly definitely appears as a very efficient option to achieve highly integrated chips. It offers major benefits such as combining heterogeneous technologies, combining high-performance and low-power chips, increasing data transfer bandwidth in memory above logic circuits, etc. 3D assembly is realized by bonding two wafers or chips face to face on a wafer. In this bonding process, the number of interchips interconnects is limited by the accuracy of the alignment process. Presently, alignment methods rely on optical alignment techniques which offer ±0.2m resolution for wafer-to-wafer bonding or only ±1m resolution for die-to-wafer bonding. This is relatively poor and limit the density of interconnects and therefore the bandwidth of interchip communication. In this ERC PoC project, we intend to establish the viability of a novel magnetic alignment approach based on nanomagnetism and spin electronics which could yield unprecedented accuracy in alignment during wafer bonding. The goals of MAGALIGN are i) to make a proof of concept of this novel alignment method, ii) optimize it and develop the design tools to exploit it, iii) Develop industrialization strategy. Fields of science natural sciencesphysical scienceselectromagnetism and electronicsmicroelectronics Programme(s) H2020-EU.1.1. - EXCELLENT SCIENCE - European Research Council (ERC) Main Programme Topic(s) ERC-2020-POC - Call for proposals for ERC Proof of Concept Grant Call for proposal ERC-2020-PoC See other projects for this call Funding Scheme ERC-POC-LS - ERC Proof of Concept Lump Sum Pilot Host institution COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES Net EU contribution € 150 000,00 Address RUE LEBLANC 25 75015 PARIS 15 France See on map Region Ile-de-France Ile-de-France Paris Activity type Research Organisations Links Contact the organisation Opens in new window Website Opens in new window Participation in EU R&I programmes Opens in new window HORIZON collaboration network Opens in new window Total cost No data Beneficiaries (1) Sort alphabetically Sort by Net EU contribution Expand all Collapse all COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES France Net EU contribution € 150 000,00 Address RUE LEBLANC 25 75015 PARIS 15 See on map Region Ile-de-France Ile-de-France Paris Activity type Research Organisations Links Contact the organisation Opens in new window Website Opens in new window Participation in EU R&I programmes Opens in new window HORIZON collaboration network Opens in new window Total cost No data
