Objective
The flip chip assembly process shall be made compatible with future wirebond pitches on an industrial scale. This shall result in miniature electrical modules for personal handheld applications.
The activities comprise:
- Waferscale bumping, capable for 40 micron pitch.
- Bump systems comprise NiAu, Au stud bumping and PbSn through solderjetting.
- Substrates with via and routing capability compabile with 40 micron bond pad pitch on the components (ICs).
- Substrate materials: polyamide flexible substrates, silicon substrates containing passive integration with CMOS or BiCMOS devices and glass ceramic substrates with integrated passive components.
- Fine pitch interconnect processes for personal electronics, capable of IO pitches down to 40 micron.
The processes will be based on soldering or adhesive technology, with or without underfill.
Objectives:
It is the aim of the present proposal to bring flip chip technology down to pitches of 40 ?m.
Technological objectives: To develop industrially viable waferscale bumping techniques, capable for 40 micron pitch. To develop substrates with via and routing capability compatible with the 40 micron bond pad pitch on the components (ICs). To develop thin film interconnect layers between the 500 (300) micron CSP Ball pitch and the 40 micron peripheral flip chip pitch for use in chipscale BGA packages. To develop high volume low cost fine pitch flip chip interconnect processes for personal electronics products, capable for I/O pitches down to 40 micron
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
- engineering and technology materials engineering coating and films
- engineering and technology materials engineering amorphous solids
- natural sciences chemical sciences inorganic chemistry metalloids
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Programme(s)
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Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Topic(s)
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Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
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Funding Scheme
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Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Coordinator
5621 JG EINDHOVEN
Netherlands
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.