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Content archived on 2024-05-18

Surface Measurement System with Integrated TXRF

Objective

A proof of concept project is proposed to assess a new TXRF module for integration in a VPD preparation system for wafers up to 300 mm. This integrated VPD - TXRF system is the first instrument of its kind to be introduced in 2000. It targets the application of contamination monitoring in device manufacturing with special emphasis on 300 mm wafers. As a result of the project the tool should be ready for site evaluation.

Call for proposal

Data not available

Coordinator

GEMETEC GESELLSCHAFT FUER MESSTECHNIK UND TECHNOLOGIE MBH
EU contribution
No data
Address
GERETSRIEDER STRASSE
81379 MUENCHEN
Germany

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Total cost
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Participants (2)