Surface Measurement System with Integrated TXRF

Project Information

SUMMIT

Grant agreement ID: IST-1999-12676

Project closed

Start date 1 January 2000

End date 30 June 2000

Funded under

• Programme for research, technological development and demonstration on a "User-friendly information society, 1998-2002"

Total cost € 279 737,00

EU contribution € 199 218,00

Coordinated by

GEMETEC GESELLSCHAFT FUER MESSTECHNIK UND TECHNOLOGIE MBH
Germany

Objective

A proof of concept project is proposed to assess a new TXRF module for integration in a VPD preparation system for wafers up to 300 mm. This integrated VPD - TXRF system is the first instrument of its kind to be introduced in 2000. It targets the application of contamination monitoring in device manufacturing with special emphasis on 300 mm wafers. As a result of the project the tool should be ready for site evaluation.

Programme(s)

• FP5-IST - Programme for research, technological development and demonstration on a "User-friendly information society, 1998-2002"

Topic(s)

• 1.1.2.-4.8.3 - Processes, equipment and materials

Call for proposal

Data not available

Funding Scheme

ACM - Preparatory, accompanying and support measures

Coordinator

GEMETEC GESELLSCHAFT FUER MESSTECHNIK UND TECHNOLOGIE MBH

• EU contribution: No data
• Address: GERETSRIEDER STRASSE ; 81379 MUENCHEN ; Germany
• Total cost: No data

Participants (2)

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW

Belgium

• EU contribution: No data
• Address: KAPELDREEF 75 ; 3001 LEUVEN
• Total cost: No data

STMICROELECTRONICS SA

France

• EU contribution: No data
• Address: 29 BOULEVARD ROMAIN ROLLAND ; 92120 MONTROUGE
• Total cost: No data