A proof of concept project is proposed to assess a new TXRF module for integration in a VPD preparation system for wafers up to 300 mm. This integrated VPD - TXRF system is the first instrument of its kind to be introduced in 2000. It targets the application of contamination monitoring in device manufacturing with special emphasis on 300 mm wafers. As a result of the project the tool should be ready for site evaluation.
Funding SchemeACM - Preparatory, accompanying and support measures