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Surface Measurement System with Integrated TXRF

Objective

A proof of concept project is proposed to assess a new TXRF module for integration in a VPD preparation system for wafers up to 300 mm. This integrated VPD - TXRF system is the first instrument of its kind to be introduced in 2000. It targets the application of contamination monitoring in device manufacturing with special emphasis on 300 mm wafers. As a result of the project the tool should be ready for site evaluation.

Funding Scheme

ACM - Preparatory, accompanying and support measures

Coordinator

GEMETEC GESELLSCHAFT FUER MESSTECHNIK UND TECHNOLOGIE MBH
Address
Geretsrieder Strasse
81379 Muenchen
Germany

Participants (2)

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW
Belgium
Address
Kapeldreef 75
3001 Leuven
STMICROELECTRONICS SA
France
Address
29 Boulevard Romain Rolland
92120 Montrouge