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Surface Measurement System with Integrated TXRF

Objectif

A proof of concept project is proposed to assess a new TXRF module for integration in a VPD preparation system for wafers up to 300 mm. This integrated VPD - TXRF system is the first instrument of its kind to be introduced in 2000. It targets the application of contamination monitoring in device manufacturing with special emphasis on 300 mm wafers. As a result of the project the tool should be ready for site evaluation.

Appel à propositions

Data not available

Coordinateur

GEMETEC GESELLSCHAFT FUER MESSTECHNIK UND TECHNOLOGIE MBH
Contribution de l’UE
Aucune donnée
Adresse
GERETSRIEDER STRASSE
81379 MUENCHEN
Allemagne

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Coût total
Aucune donnée

Participants (2)