Surface Measurement System with Integrated TXRF

Informazioni relative al progetto

SUMMIT

ID dell’accordo di sovvenzione: IST-1999-12676

Progetto chiuso

Data di avvio 1 Gennaio 2000

Data di completamento 30 Giugno 2000

Finanziato da

• Programme for research, technological development and demonstration on a "User-friendly information society, 1998-2002"

Costo totale € 279 737,00

Contributo UE € 199 218,00

Coordinato da

GEMETEC GESELLSCHAFT FUER MESSTECHNIK UND TECHNOLOGIE MBH
Germany

Obiettivo

A proof of concept project is proposed to assess a new TXRF module for integration in a VPD preparation system for wafers up to 300 mm. This integrated VPD - TXRF system is the first instrument of its kind to be introduced in 2000. It targets the application of contamination monitoring in device manufacturing with special emphasis on 300 mm wafers. As a result of the project the tool should be ready for site evaluation.

Programma(i)

• FP5-IST - Programme for research, technological development and demonstration on a "User-friendly information society, 1998-2002"

Argomento(i)

• 1.1.2.-4.8.3 - Processes, equipment and materials

Invito a presentare proposte

Data not available

Meccanismo di finanziamento

ACM - Preparatory, accompanying and support measures

Coordinatore

GEMETEC GESELLSCHAFT FUER MESSTECHNIK UND TECHNOLOGIE MBH

• Contributo UE: Nessun dato
• Indirizzo: GERETSRIEDER STRASSE ; 81379 MUENCHEN ; Germania
• Costo totale: Nessun dato

Partecipanti (2)

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW

Belgio

• Contributo UE: Nessun dato
• Indirizzo: KAPELDREEF 75 ; 3001 LEUVEN
• Costo totale: Nessun dato

STMICROELECTRONICS SA

Francia

• Contributo UE: Nessun dato
• Indirizzo: 29 BOULEVARD ROMAIN ROLLAND ; 92120 MONTROUGE
• Costo totale: Nessun dato