Bonding is one key technology in the fabrication of micro-chips. Anodic bonding is for example used to bond silicon and glass wafers; though, this technique is expensive and needs high voltage (400 � 1000 V) and elevated temperature (300 degrees C). Fusion bonding is also used to join quartz and Pyrex materials; quartz wafer is suitable to optical analysis, however, the technique requires more than 1000 degrees C and takes about one day to bond two wafers. An alternative is HF and water glass bonding, which are used to bond glass and silicon wafers for MEMS and µ-TAS respectively; handling HF is very dangerous, and the water glass is sodium rich, which is not applicable for chemical analysis. Glue bonding is also suitable for the µ-TAS; this technique brings macroscopic amount of extra material (silicone, epoxy resin) and requires curing (with temperature, UV light,�) to bond the two wafers.
Approach:
Our approach is based on the use of simple commercial molecules and has the following advantages:
- Very little amount (2µl)of material necessary;
- Very easy deposition of the 'glue' monolayer;
- Does not need to apply pressure;
- Glue layer thickness is in the range of few nm (less than 10 nm);
- Perfect for flat/smooth surfaces;
- Does only improve with time, by nature of the chemistry;
- Very resistive to humidity;
- Works at room T; T increase only speeds up a first bonding phase; a key factor for biochips;
- Could be used for silicon wafers, or other flat metal oxide surfaces;
- May be adequate for "stamp" deposition technique.
LISE is still evaluating the possibility to apply for a patent. In the meantime, no more information is given.