This project studies the interface of amorphous or microcrystalline silicon thin film with single crystalline silicon substrates. Different pre-deposition, deposition and post-deposition technologies are used together with many physico-chemical and electrical characterization techniques. The purpose is to optimize the process parameters from the feedback data of the different analyses in order to obtain non-crystalline or epitaxially structured thin layers for microelectronic applications.
Funding SchemeCSC - Cost-sharing contracts
5600 MB Eindhoven