Obiettivo This project studies the interface of amorphous or microcrystalline silicon thin film with single crystalline silicon substrates. Different pre-deposition, deposition and post-deposition technologies are used together with many physico-chemical and electrical characterization techniques. The purpose is to optimize the process parameters from the feedback data of the different analyses in order to obtain non-crystalline or epitaxially structured thin layers for microelectronic applications. Campo scientifico engineering and technologymaterials engineeringcoating and filmsnatural scienceschemical sciencesinorganic chemistrymetalloids Programma(i) FP2-SCIENCE - Programme plan (EEC) to stimulate the international cooperation and interchange needed by European research scientists (SCIENCE), 1988-1992 Argomento(i) Data not available Invito a presentare proposte Data not available Meccanismo di finanziamento CSC - Cost-sharing contracts Coordinatore INTERUNIVERSITAIR MIKRO-ELEKTRONICA CENTRUM VZW Contributo UE Nessun dato Indirizzo 75,Kapeldreef 75 3001 HEVERLEE Belgio Mostra sulla mappa Costo totale Nessun dato Partecipanti (2) Classifica in ordine alfabetico Classifica per Contributo UE Espandi tutto Riduci tutto EINDHOVEN UNIVERSITY OF TECHNOLOGY Paesi Bassi Contributo UE Nessun dato Indirizzo Den Dolech 2 5600 MB EINDHOVEN Mostra sulla mappa Costo totale Nessun dato UNIVERSITAET STUTTGART Germania Contributo UE Nessun dato Indirizzo Keplerstrasse 7 70174 STUTTGART Mostra sulla mappa Costo totale Nessun dato
