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Platform for Heterogeneous Integration of NEMS on ICs

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Wafer-Level Vacuum Packaging Enabled by Plastic Deformation and Low-Temperature Welding of Copper Sealing Rings With a Small Footprint

Author(s): X Wang, SJ Bleiker, M Antelius, G Stemme, F Niklaus
Published in: Journal of Microelectromechanical Systems, Issue PP, 99, 2017, Page(s) 1-9, ISSN 1057-7157
DOI: 10.1109/JMEMS.2017.2654510

Heterogeneous 3D integration of MOEMS and ICs

Author(s): Frank Niklaus, Andreas C. Fischer
Published in: 2016 International Conference on Optical MEMS and Nanophotonics (OMN), 2016, Page(s) 1-2
DOI: 10.1109/OMN.2016.7565909