HYPHEN: Hybrid Photonic Engines for Massive Cloud Connectivity

Project Information

HYPHEN

Grant agreement ID: 680916

DOI 10.3030/680916

Project closed

EC signature date 6 July 2015

Start date 1 August 2015

End date 31 January 2017

Funded under

• EXCELLENT SCIENCE - European Research Council (ERC)

Total cost € 149 875,00

EU contribution € 149 875,00

Coordinated by

KARLSRUHER INSTITUT FUER TECHNOLOGIE
Germany

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Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .

Publications

Peer reviewed articles (5)

Optical coherence tomography system mass-producible on a silicon photonic chip

Author(s): Simon Schneider, Matthias Lauermann, Philipp-Immanuel Dietrich, Claudius Weimann, Wolfgang Freude, Christian Koos
Published in: Optics Express, Issue 24/2, 2016, Page(s) 1573, ISSN 1094-4087
Publisher: Optical Society of America
DOI: 10.1364/OE.24.001573

Connecting Silicon Photonic Circuits to Multicore Fibers by Photonic Wire Bonding

Author(s): Nicole Lindenmann, Stephan Dottermusch, Maria Laura Goedecke, Tobias Hoose, Muhammad Rodlin Billah, Temitope Paul Onanuga, Andreas Hofmann, Wolfgang Freude, Christian Koos
Published in: Journal of Lightwave Technology, Issue 33/4, 2015, Page(s) 755-760, ISSN 0733-8724
Publisher: Optical Society of America
DOI: 10.1109/JLT.2014.2373051

Tailored probes for atomic force microscopy fabricated by two-photon polymerization

Author(s): Gerald Göring, Philipp-Immanuel Dietrich, Matthias Blaicher, Swati Sharma, Jan G. Korvink, Thomas Schimmel, Christian Koos, Hendrik Hölscher
Published in: Applied Physics Letters, Issue 109/6, 2016, Page(s) 063101, ISSN 0003-6951
Publisher: American Institute of Physics
DOI: 10.1063/1.4960386

Silicon-Organic Hybrid (SOH) and Plasmonic-Organic Hybrid (POH) Integration

Author(s): Christian Koos, Juerg Leuthold, Wolfgang Freude, Manfred Kohl, Larry Dalton, Wim Bogaerts, Anna Lena Giesecke, Matthias Lauermann, Argishti Melikyan, Sebastian Koeber, Stefan Wolf, Claudius Weimann, Sascha Muehlbrandt, Kira Koehnle, Joerg Pfeifle, Wladislaw Hartmann, Yasar Kutuvantavida, Sandeep Ummethala, Robert Palmer, Dietmar Korn, Luca Alloatti, Philipp Claudius Schindler, Delwin L. Elder, Tho
Published in: Journal of Lightwave Technology, Issue 34/2, 2016, Page(s) 256-268, ISSN 0733-8724
Publisher: Optical Society of America
DOI: 10.1109/JLT.2015.2499763

Photonic wire bonding: a novel concept for chip-scale interconnects

Author(s): N. Lindenmann, G. Balthasar, D. Hillerkuss, R. Schmogrow, M. Jordan, J. Leuthold, W. Freude, C. Koos
Published in: Optics Express, Issue 20/16, 2012, Page(s) 17667, ISSN 1094-4087
Publisher: Optical Society of America
DOI: 10.1364/OE.20.017667

Conference proceedings (11)

Multi-Chip Integration by Photonic Wire Bonding:<br /> Connecting Surface and Edge Emitting Lasers to Silicon Chips

Author(s): Tobias Hoose, Muhammad Billah, Pablo Marin, Matthias Blaicher, Philipp I. Dietrich, Andreas Hofmann, Ute Troppenz, Martin Möhrle, Nicole Lindenmann, Michael Thiel, Philipp Simon, Joerg Hoffmann, Maria L. Goedecke, Wolfgang Freude, Christian Koos
Published in: Optical Fiber Communication Conference, 2016, Page(s) M2I.7, ISBN 978-1-943580-07-1
Publisher: OSA
DOI: 10.1364/OFC.2016.M2I.7

Silicon-organic hybrid (SOH) integration and photonic multi-chip systems: Technologies for high-speed optical interconnects

Author(s): C. Koos, W. Freude, J. Leuthold, L. R. Dalton, S. Wolf, H. Zwickel, T. Hoose, M. R. Billah, M. Lauermann, C. Weimann, W. Hartmann, A. Melikyan, N. Lindenmann, S. Koeber, R. Palmer, D. Korn, L. Alloatti, A.-L. Giesecke, T. Wahlbrink
Published in: 2016 IEEE Optical Interconnects Conference (OI), 2016, Page(s) 86-87, ISBN 978-1-5090-1874-1
Publisher: IEEE
DOI: 10.1109/OIC.2016.7483033

Hybrid 2D/3D photonic integration for non-planar circuit topologies

Author(s): Nesic, A.; Blaicher, M.; Hoose, T.; Lauermann, M.; Kutuvantavida, Y.; Freude, W.; Koos, C.
Published in: 42th European Conf. Opt. Commun. (ECOC'16), Düsseldorf, Germany, Sept. 18–22, 2016
Publisher: VDE

Herstellung mikrooptischer Komponenten durch Zwei-Photonen-Polymerisation

Author(s): Dietrich, P.-I.; Wondimu, S. F.; Wienhold, T.; Steidle, M.; Hofmann, A.; Lindenmann, N.; Billah, M. R.; Hoose, T.; Blaicher, M.; Freude, W.; Koos, C.
Published in: MikroSystemTechnik-Kongress 2015, Karlsruhe, Germany, Oct. 26–28, 2015
Publisher: VDE

Lenses for Low-Loss Chip-to-Fiber and Fiber-to-Fiber Coupling Fabricated by 3D Direct-Write Lithography

Author(s): Philipp-Immanuel C. Dietrich, Ingo Reuter, Matthias Blaicher, Simon Schneider, Muhammad R. Billah, Tobias Hoose, Andreas Hofmann, Charles Caer, Roger Dangel, Bert Offrein, Martin Möhrle, Ute Troppenz, Marlene Zander, Wolfgang Freude, Christian Koos
Published in: Conference on Lasers and Electro-Optics, 2016, Page(s) SM1G.4, ISBN 978-1-943580-11-8
Publisher: OSA
DOI: 10.1364/CLEO_SI.2016.SM1G.4

Optische Schnittstelle für photonische Wirebonds in photonischer BiCMOS-Technologie

Author(s): Mai, C.; Lischke, S.; Kroh, M.; Hoose, T.; Lindenmann, N.; Koos, C.; Mai, A.; Zimmermann, L.
Published in: MikroSystemTechnik-Kongress 2015, Karlsruhe, Germany, Oct. 26–28, 2015
Publisher: VDE

Nanophotonic modulators and photodetectors using silicon photonic and plasmonic device concepts

Author(s): Koos, C.; Freude, W.; Leuthold, J.; Dalton, L. R.; Wolf, S.; Muehlbrandt, S.; Melikyan, A.; Zwickel, H.; Kutuvantavida, Y.; Harter, T.; Lauermann, M.; Elder, D. L.
Published in: SPIE Physics and Simulation of Optoelectronic Devices XXV (OPTO-SPIE'17), San Francisco (CA), USA, Jan. 28 - Feb. 2, 2017, Page(s) paper 10098-6
Publisher: SPIE

Multi-terabit/s transmission using chip-scale frequency comb sources

Author(s): C. Koos, T. J. Kippenberg, L. P. Barry, L. Dalton, A. Ramdane, F. Lelarge, W. Freude, J. N. Kemal, P. Marin, S. Wolf, P. Trocha, J. Pfeifle, C. Weimann, M. Lauermann, T. Herr, V. Brasch, R. T. Watts, D. Elder, A. Martinez, V. Panapakkam, N. Chimot
Published in: 2016 18th International Conference on Transparent Optical Networks (ICTON), 2016, Page(s) 1-2, ISBN 978-1-5090-1467-5
Publisher: IEEE
DOI: 10.1109/ICTON.2016.7550524

Silicon-organic hybrid (SOH) integration and photonic multi-chip systems: Extending the capabilities of the silicon photonic platform

Author(s): C. Koos, W. Freude, J. Leuthold, M. Kohl, L. R. Dalton, W. Bogaerts, M. Lauermann, S. Wolf, C. Weimann, A. Melikyan, N. Lindenmann, M. R. Billah, S. Muehlbrandt, S. Koeber, R. Palmer, K. Koehnle, L. Alloatti, D. L. Elder, A.-L Giesecke, T. Wahlbrink
Published in: 2015 IEEE Photonics Conference (IPC), 2015, Page(s) 480-481, ISBN 978-1-4799-7465-8
Publisher: IEEE
DOI: 10.1109/IPCon.2015.7323735

Silicon-organic hybrid (SOH) devices and their use in comb-based communication systems

Author(s): Koos, C.; Freude, W.; Dalton, L. R.; Kippenberg, T. J.; Barry, L. P.; Ramdane, A.; Lelarge, F.; Wolf, S.; Zwickel, H.; Lauermann, M.; Weimann, C.; Hartmann, W.; Kemal, J. N.; Marin-Palomo, P.; Trocha, P.; Pfeifle, J.; Herr, T.; Brasch, V.; Watts, R. T.; Elder, D. L.; Martinez, A.; Panapakkam, V.; Chimot, N.
Published in: 13th International Conference on Group IV Photonics (GFP'16), Shanghai, China, August 24–26, 2016
Publisher: IEEE

Chip-scale frequency comb generators for high-speed communications and optical metrology

Author(s): Koos, C.; Kippenberg, T. J.; Barry, L. P.; Ramdane, A.; Lelarge, F.; Freude, W.; Marin-Palomo, P.; Kemal, J. N.; Weimann, C.; Wolf, S.; Trocha, P.; Pfeifle, J.; Karpov, M.; Kordts, A.; Brasch, V.; Watts, R. T.; Martinez, A.; Panapakkam, V.; Chimot, N.
Published in: SPIE Nonlinear Frequency Generation and Conversion: Materials and Devices XVI, (LASE-SPIE'17), San Francisco (CA), USA, Jan. 28 - Feb. 2, 2017, Page(s) paper 10090-15
Publisher: SPIE

Other (1)

Silicon Photonics, Hybrid Integration, and Frequency Combs: Technologies for Terabit/s Communications

Author(s): Koos, C.
Published in: 18th International Workshop on Physics of Semiconductor Devices (IPWSD-2015), Bangalore, India, December 7-10, 2015
Publisher: Indian Institute of Technology Kharagpur

Intellectual Property Rights

Patent (3)

Method for Producing Photonic Wire Bonds

Application/Publication number: US 9034222 B2
Date: 2012-02-23

Herstellung von 3D-Freiform-Wellenleiterstrukturen

Application/Publication number: DE 10 2013 005 565.2
Date: 2013-03-28

Three-dimensional freeform waveguides for chip-chip connections

Application/Publication number: US 8903205 B2
Date: 2012-02-23