Trusted European SiC Value Chain for a greener Economy

Project Information

TRANSFORM

Grant agreement ID: 101007237

DOI 10.3030/101007237

EC signature date 17 May 2021

Start date 1 May 2021

End date 31 October 2024

Funded under

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)

Total cost € 89 021 393,12

EU contribution € 20 564 256,86

Coordinated by

ROBERT BOSCH GMBH
Germany

Deliverables

Websites, patent fillings, videos etc. (2)

Initial dissemination & communication plan

This initial report will describe the plan and actions for the dissemination of the project results and describe the internal communication within the consortium

Project webpage and press release

This will describe the structure and layout of the project official public webpage including a press release describing the project partners and goals

Publications

Other (3)

SmartSiCTM : Boosting SiC performance for high-voltage power applications

Author(s): Walter Schwarzenbach, Severin Rouchier, G. Berre, R. Boulet, E. Cela, A. Drouin, A. Chapelle, S. Monnoye, H. Mank, C. Moisson, H. Biard, M. Lagrange, A. Quintero Colmenares, L. Kabelaan, L. Viravaux, N. Ben Mohamed, D. Radisson, E. Guiot, G. Lavaitte, A. Bouville-Lallart, J. Roi, J. Widiez, E. Rolland, G. Gélineau, K. Vladimirova, N. Troutot, A. Moulin, V. Prudkovski, S. Barbet, D. Delprat, N. Da
Published in: Industrial Session / ICSCRM 2022, 2022
Publisher: ICSCRM 2022

Evaluation of crystal quality and dopant activation ofSmart Cut™ transferred 4H SiC thin film

Author(s): G. Gelineau, J. Widiez, E.Rolland, K.Vladimirova, A. Moulin, V. Prudkovskiy, N.Troutot, P. Gergaud, D. Mariolle, S. Barbet, V.Amalbert, G. Lapertot, K. Mony, S. Rouchier, R. Boulet, G. Berre, W. Schwarzenbach, Y. Bogumilowicz
Published in: Scientific Poster / ICSCRM22, 2022
Publisher: ICSCRM22

Advancements in Non-contact High-resolution Resistivity Imaging of Wide Bandgap Materials

Author(s): M. Klein, S.Vinodh, B.Chen
Published in: Industry session / ICSCRM22, 2022
Publisher: ICSCRM22

Conference proceedings (20)

New Die Attach Materials: Silver and Silver/ Copper sintering pastes

Author(s): B. Rábay, A. Stelzer
Published in: 2022
Publisher: PCIM Europe Conference 2022

Smart CutTM SiC: enabling a larger adoption of SiC substrate for power devices

Author(s): E. Guiot et al
Published in: APEC 2022, 2022
Publisher: IEEE

Benchmarking experiment of substrate quality including SmartSiCTM wafers by epitaxy in a batch reactor

Author(s): B. Kallinger, P. Hens, P. Berwian, C. Kranert, K.M. Albrecht, J. Erlekampf
Published in: Solid State Phenomena,, Issue Volume 342, 2022, Page(s) 91-98, ISSN 1662-9779
Publisher: Trans Tech Publications Ltd
DOI: 10.4028/v-868lqn

Evaluation of Crystal Quality and Dopant Activation of Smart CutTM - Transferred 4H-SiC Thin Film

Author(s): G. Gelineau, J. Widiez, E.Rolland, K.Vladimirova, A. Moulin, V. Prudkovskiy, N.Troutot, P. Gergaud, D. Mariolle, S. Barbet, V.Amalbert, G. Lapertot, K. Mony, S. Rouchier, R. Boulet, G. Berre, W. Schwarzenbach, Y. Bogumilowicz
Published in: Materials Science Forum, Issue 1089(2), 2022, Page(s) 71-79, ISSN 1662-9752
Publisher: Trans Tech Publications Ltd
DOI: 10.4028/p-026sj4

Tailored Polycrystalline Substrate for SmartSiCTM Substrates Enabling High Performance Power Devices

Author(s): H. Biard, W. Schwarzenbach, S. Odoul, I. Radu,A. Potier, M. Ferrato, E. Guajioty
Published in: Diffusion and Defect Data Pt.B: Solid State Phenomena, Issue 344(12), 2022, Page(s) 47-52, ISSN 1662-9779
Publisher: Trans Tech Publications Ltd
DOI: 10.4028/p-65127n

Engineered SiC materials for power technologies

Author(s): W. Schwarzenbach, S. Rouchier, G. Berre, R. Boulet, O. Ledoux, E. Cela, A. Drouin, A. Chapelle, S. Monnoye, H. Biard, K. Alassaad, L. Viravaux, N. Ben Mohamed, D. Radisson, G. Picun, G. Lavaitte, A. Bouville-Lallart, J. Roi, J. Widiez, K. Abadie,E. Rolland, F. Fournel, G. Gélineau, F. Mazen, A. Moulin, C. Moulin, D. Delprat , N. Daval, S. Odoul, P. Sandri and C. Maleville
Published in: 2022 International Conference on IC Design and Technology (ICICDT), Issue INSPEC Accession Number: 22214351, 2022, Page(s) 55 - 56
Publisher: IEEE
DOI: 10.1109/icicdt56182.2022

High sensitivity surface defect inspection of SiC and SmartSiCTM substrates using a DUV laser-based system

Author(s): Enrica Cela, Sam Shahidi , Prasant Parangi , Ramesh Shrestha, Gavin Simpson, Julie Widiez, Nicolas Daval, Audrey Chapelle, Séverin Rouchier, Walter Schwarzenbach
Published in: International Conference on Silicon Carbide and Related Materials 2022, Issue Defect and Diffusion Forum Vol. 425, 2022, Page(s) 320-324, ISBN 978-3-0364-0167-6
Publisher: Trans Tech Publications Ltd
DOI: 10.4028/p-4918s1

Proven Power Cycling Reliability of Ohmic Annealing Free SiC Power Device through the Use of SmartSiCTM Substrate

Author(s): Eric Guiot, Frédéric Allibert, Jürgen Leib, Tom Becker, Walter Schwarzenbach, Tobias Erlbacher, Carsten Hellinger, Séverin Rouchier
Published in: Materials Science Forum, Issue 1092, 2022, Page(s) 201-207, ISSN 1662-9752
Publisher: Trans Tech Publications Ltd
DOI: 10.4028/p-777hqg

Proven Power Cycling Reliability of SmartSiC(TM) Substrate for Power Devices

Author(s): Eric Guiot, Gonzalo Picun, Frédéric Allibert, Jürgen Leib, Tom Becker, Walter Schwarzenbach, Alexis Drouin, Jean-Marc Béthoux, Julie Widiez, Séverin Rouchier, Tobias Erlbacher
Published in: PCIM Europe 2022; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 2022
Publisher: VDE
DOI: 10.30420/565822081

Supporting Collaborative Innovation Processes in Smart Product Value

Author(s): Damun Mollahassani, Jonas Gries, Sven Forte, Jens C. Göbel
Published in: Procedia CIRP, Issue Volume 109, 2022, Page(s) 349-355
Publisher: Elsevier
DOI: 10.1016/j.procir.2022.05.261

150 mm SiC engineered substrates for high-voltage power devices

Author(s): Séverin Rouchier, et al
Published in: ICSCRM 2021, 2021
Publisher: Material Science Forum published by Trans Tech Publications Ltd, Switzerland for ECSCRM 2021
DOI: 10.4028/p-mxxdef

Investigation of Stability and Oscillations at Power Modules with Low Stray Inductance

Author(s): S. Buetow, M. Spang
Published in: 2022
Publisher: ISPSD (International Symposium on Power Semiconductor Devices and ICs)

Supporting Collaborative Innovation Processes in Smart Product ValueCreation Networks

Author(s): Damun Mollahassani, Jonas Gries, Sven Forte, Jens C. Göbel
Published in: Supporting Collaborative Innovation Processes in Smart Product Value Creation Networks, 2022, Page(s) 5
Publisher: CIRP DESIGN 2022

SmartSiCTM for Manufacturing of SiC Power Devices

Author(s): Nicolas Daval et al
Published in: EDTM 2022, 2022
Publisher: EDTM 2022

The mobility scenario vs Green Deal Objectives

Author(s): A.Imbruglia, F.Gennaro, P.Di Grazia
Published in: Smart System Integration 2022, 2022, Page(s) 5
Publisher: SSI2022

A greener SiC wafer with Smart Cut technology

Author(s): OLIVIER BONNIN, ERIC GUIOT, WALTER SCHWARZENBACHM AND GONZALO PICUN
Published in: Compound Semiconductor, 2021
Publisher: Compound Semiconductor

Focus Topic: Wide Bandgap Semiconductors

Author(s): Filippo Di Giovanni
Published in: Oral presentation / Electronica 2022, 2022
Publisher: Electronica 2022

Impact of aluminum casing on high-frequency transformer leakage inductance and AC resistance

Author(s): R. Bakri, X. Margueron, W. da Cunha Alves, X. Cimetiere, F. Gillon, A. Bruyere, L. Vatamanu
Published in: 2022
Publisher: 24th European Conference on Power Electronics and Applications (EPE'22 ECCE Europe)

Wissensbasis zur Förderung von Innovationen Smarter PSS innerhalb eines Wertschöpfungsnetzwerkes

Author(s): Damun Mollahassani, Thomas Eickhoff, Andreas Eiden, Jens C. Göbel
Published in: Tag des Systems Engineering 2022 - Tagungsband Paderborn, Issue Band 20, 2022, ISBN 9783981880533
Publisher: Gesellschaft für Systems Engineering e.V.

Proven Power Cycling Reliability of SmartSiCTM Substrate for power device

Author(s): E. Guiot,Frédéric Allibert, Jürgen Leib, Tom Becker, Walter Schwarzenbach, Carsten Hellinger, Tobias Erlbacher, Séverin Rouchier
Published in: PCIM 2022, 2022
Publisher: Mesago for PCIM 2022

Peer reviewed articles (3)

Optimization-Based Capacitor Balancing Method with Customizable Switching Reduction for CHB Converters

Author(s): Luis Galván, Pablo Jesús Gómez, Eduardo Galván, Juan Manuel Carrasco
Published in: Special Issue Advances in Multilevel Converter/Inverter Topologies and Applications. Energies (MDPI), 2022, ISSN 1996-1073
Publisher: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/en15061976

Optimization-Based Capacitor Balancing Method with Selective DC Current Ripple Reduction for CHB Converters

Author(s): Luis Galván, Pablo Jesús Gómez, Eduardo Galván, Juan Manuel Carrasco
Published in: Special Issue Advances in Multilevel Converter/Inverter Topologies and Applications. Energies (MDPI), 2021, ISSN 1996-1073
Publisher: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/en15010243

Advanced Local Grid Control System for Offshore Wind Turbines with the Diode-Based Rectifier HVDC Link Implemented in a True Scalable Test Bench

Author(s): Danilo Herrera,Thiago Tricarico,Diego Oliveira,Mauricio Aredes,Eduardo Galván-Díez and Juan M. Carrasco
Published in: Energies 2022, Issue Volume 15 (Issue 16), 5826, 2022, ISSN 1996-1073
Publisher: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/en15165826