Trusted European SiC Value Chain for a greener Economy

Rezultaty

Initial dissemination & communication plan

This initial report will describe the plan and actions for the dissemination of the project results and describe the internal communication within the consortium

Project webpage and press release

This will describe the structure and layout of the project official public webpage including a press release describing the project partners and goals

Publikacje

SmartSiCTM : Boosting SiC performance for high-voltage power applications

Autorzy: Walter Schwarzenbach, Severin Rouchier, G. Berre, R. Boulet, E. Cela, A. Drouin, A. Chapelle, S. Monnoye, H. Mank, C. Moisson, H. Biard, M. Lagrange, A. Quintero Colmenares, L. Kabelaan, L. Viravaux, N. Ben Mohamed, D. Radisson, E. Guiot, G. Lavaitte, A. Bouville-Lallart, J. Roi, J. Widiez, E. Rolland, G. Gélineau, K. Vladimirova, N. Troutot, A. Moulin, V. Prudkovski, S. Barbet, D. Delprat, N. Da
Opublikowane w: Industrial Session / ICSCRM 2022, 2022
Wydawca: ICSCRM 2022

Evaluation of crystal quality and dopant activation ofSmart Cut™ transferred 4H SiC thin film

Autorzy: G. Gelineau, J. Widiez, E.Rolland, K.Vladimirova, A. Moulin, V. Prudkovskiy, N.Troutot, P. Gergaud, D. Mariolle, S. Barbet, V.Amalbert, G. Lapertot, K. Mony, S. Rouchier, R. Boulet, G. Berre, W. Schwarzenbach, Y. Bogumilowicz
Opublikowane w: Scientific Poster / ICSCRM22, 2022
Wydawca: ICSCRM22

Advancements in Non-contact High-resolution Resistivity Imaging of Wide Bandgap Materials

Autorzy: M. Klein, S.Vinodh, B.Chen
Opublikowane w: Industry session / ICSCRM22, 2022
Wydawca: ICSCRM22

New Die Attach Materials: Silver and Silver/ Copper sintering pastes

Autorzy: B. Rábay, A. Stelzer
Opublikowane w: 2022
Wydawca: PCIM Europe Conference 2022

Smart CutTM SiC: enabling a larger adoption of SiC substrate for power devices

Autorzy: E. Guiot et al
Opublikowane w: APEC 2022, 2022
Wydawca: IEEE

Benchmarking experiment of substrate quality including SmartSiCTM wafers by epitaxy in a batch reactor

Autorzy: B. Kallinger, P. Hens, P. Berwian, C. Kranert, K.M. Albrecht, J. Erlekampf
Opublikowane w: Solid State Phenomena,, Numer Volume 342, 2022, Strona(/y) 91-98, ISSN 1662-9779
Wydawca: Trans Tech Publications Ltd
DOI: 10.4028/v-868lqn

Evaluation of Crystal Quality and Dopant Activation of Smart CutTM - Transferred 4H-SiC Thin Film

Autorzy: G. Gelineau, J. Widiez, E.Rolland, K.Vladimirova, A. Moulin, V. Prudkovskiy, N.Troutot, P. Gergaud, D. Mariolle, S. Barbet, V.Amalbert, G. Lapertot, K. Mony, S. Rouchier, R. Boulet, G. Berre, W. Schwarzenbach, Y. Bogumilowicz
Opublikowane w: Materials Science Forum, Numer 1089(2), 2022, Strona(/y) 71-79, ISSN 1662-9752
Wydawca: Trans Tech Publications Ltd
DOI: 10.4028/p-026sj4

Tailored Polycrystalline Substrate for SmartSiCTM Substrates Enabling High Performance Power Devices

Autorzy: H. Biard, W. Schwarzenbach, S. Odoul, I. Radu,A. Potier, M. Ferrato, E. Guajioty
Opublikowane w: Diffusion and Defect Data Pt.B: Solid State Phenomena, Numer 344(12), 2022, Strona(/y) 47-52, ISSN 1662-9779
Wydawca: Trans Tech Publications Ltd
DOI: 10.4028/p-65127n

Engineered SiC materials for power technologies

Autorzy: W. Schwarzenbach, S. Rouchier, G. Berre, R. Boulet, O. Ledoux, E. Cela, A. Drouin, A. Chapelle, S. Monnoye, H. Biard, K. Alassaad, L. Viravaux, N. Ben Mohamed, D. Radisson, G. Picun, G. Lavaitte, A. Bouville-Lallart, J. Roi, J. Widiez, K. Abadie,E. Rolland, F. Fournel, G. Gélineau, F. Mazen, A. Moulin, C. Moulin, D. Delprat , N. Daval, S. Odoul, P. Sandri and C. Maleville
Opublikowane w: 2022 International Conference on IC Design and Technology (ICICDT), Numer INSPEC Accession Number: 22214351, 2022, Strona(/y) 55 - 56
Wydawca: IEEE
DOI: 10.1109/icicdt56182.2022

High sensitivity surface defect inspection of SiC and SmartSiCTM substrates using a DUV laser-based system

Autorzy: Enrica Cela, Sam Shahidi , Prasant Parangi , Ramesh Shrestha, Gavin Simpson, Julie Widiez, Nicolas Daval, Audrey Chapelle, Séverin Rouchier, Walter Schwarzenbach
Opublikowane w: International Conference on Silicon Carbide and Related Materials 2022, Numer Defect and Diffusion Forum Vol. 425, 2022, Strona(/y) 320-324, ISBN 978-3-0364-0167-6
Wydawca: Trans Tech Publications Ltd
DOI: 10.4028/p-4918s1

Proven Power Cycling Reliability of Ohmic Annealing Free SiC Power Device through the Use of SmartSiCTM Substrate

Autorzy: Eric Guiot, Frédéric Allibert, Jürgen Leib, Tom Becker, Walter Schwarzenbach, Tobias Erlbacher, Carsten Hellinger, Séverin Rouchier
Opublikowane w: Materials Science Forum, Numer 1092, 2022, Strona(/y) 201-207, ISSN 1662-9752
Wydawca: Trans Tech Publications Ltd
DOI: 10.4028/p-777hqg

Proven Power Cycling Reliability of SmartSiC(TM) Substrate for Power Devices

Autorzy: Eric Guiot, Gonzalo Picun, Frédéric Allibert, Jürgen Leib, Tom Becker, Walter Schwarzenbach, Alexis Drouin, Jean-Marc Béthoux, Julie Widiez, Séverin Rouchier, Tobias Erlbacher
Opublikowane w: PCIM Europe 2022; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 2022
Wydawca: VDE
DOI: 10.30420/565822081

Supporting Collaborative Innovation Processes in Smart Product Value

Autorzy: Damun Mollahassani, Jonas Gries, Sven Forte, Jens C. Göbel
Opublikowane w: Procedia CIRP, Numer Volume 109, 2022, Strona(/y) 349-355
Wydawca: Elsevier
DOI: 10.1016/j.procir.2022.05.261

150 mm SiC engineered substrates for high-voltage power devices

Autorzy: Séverin Rouchier, et al
Opublikowane w: ICSCRM 2021, 2021
Wydawca: Material Science Forum published by Trans Tech Publications Ltd, Switzerland for ECSCRM 2021
DOI: 10.4028/p-mxxdef

Investigation of Stability and Oscillations at Power Modules with Low Stray Inductance

Autorzy: S. Buetow, M. Spang
Opublikowane w: 2022
Wydawca: ISPSD (International Symposium on Power Semiconductor Devices and ICs)

Supporting Collaborative Innovation Processes in Smart Product ValueCreation Networks

Autorzy: Damun Mollahassani, Jonas Gries, Sven Forte, Jens C. Göbel
Opublikowane w: Supporting Collaborative Innovation Processes in Smart Product Value Creation Networks, 2022, Strona(/y) 5
Wydawca: CIRP DESIGN 2022

SmartSiCTM for Manufacturing of SiC Power Devices

Autorzy: Nicolas Daval et al
Opublikowane w: EDTM 2022, 2022
Wydawca: EDTM 2022

The mobility scenario vs Green Deal Objectives

Autorzy: A.Imbruglia, F.Gennaro, P.Di Grazia
Opublikowane w: Smart System Integration 2022, 2022, Strona(/y) 5
Wydawca: SSI2022

A greener SiC wafer with Smart Cut technology

Autorzy: OLIVIER BONNIN, ERIC GUIOT, WALTER SCHWARZENBACHM AND GONZALO PICUN
Opublikowane w: Compound Semiconductor, 2021
Wydawca: Compound Semiconductor

Focus Topic: Wide Bandgap Semiconductors

Autorzy: Filippo Di Giovanni
Opublikowane w: Oral presentation / Electronica 2022, 2022
Wydawca: Electronica 2022

Impact of aluminum casing on high-frequency transformer leakage inductance and AC resistance

Autorzy: R. Bakri, X. Margueron, W. da Cunha Alves, X. Cimetiere, F. Gillon, A. Bruyere, L. Vatamanu
Opublikowane w: 2022
Wydawca: 24th European Conference on Power Electronics and Applications (EPE'22 ECCE Europe)

Wissensbasis zur Förderung von Innovationen Smarter PSS innerhalb eines Wertschöpfungsnetzwerkes

Autorzy: Damun Mollahassani, Thomas Eickhoff, Andreas Eiden, Jens C. Göbel
Opublikowane w: Tag des Systems Engineering 2022 - Tagungsband Paderborn, Numer Band 20, 2022, ISBN 9783981880533
Wydawca: Gesellschaft für Systems Engineering e.V.

Proven Power Cycling Reliability of SmartSiCTM Substrate for power device

Autorzy: E. Guiot,Frédéric Allibert, Jürgen Leib, Tom Becker, Walter Schwarzenbach, Carsten Hellinger, Tobias Erlbacher, Séverin Rouchier
Opublikowane w: PCIM 2022, 2022
Wydawca: Mesago for PCIM 2022

Optimization-Based Capacitor Balancing Method with Customizable Switching Reduction for CHB Converters

Autorzy: Luis Galván, Pablo Jesús Gómez, Eduardo Galván, Juan Manuel Carrasco
Opublikowane w: Special Numer Advances in Multilevel Converter/Inverter Topologies and Applications. Energies (MDPI), 2022, ISSN 1996-1073
Wydawca: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/en15061976

Optimization-Based Capacitor Balancing Method with Selective DC Current Ripple Reduction for CHB Converters

Autorzy: Luis Galván, Pablo Jesús Gómez, Eduardo Galván, Juan Manuel Carrasco
Opublikowane w: Special Numer Advances in Multilevel Converter/Inverter Topologies and Applications. Energies (MDPI), 2021, ISSN 1996-1073
Wydawca: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/en15010243

Advanced Local Grid Control System for Offshore Wind Turbines with the Diode-Based Rectifier HVDC Link Implemented in a True Scalable Test Bench

Autorzy: Danilo Herrera,Thiago Tricarico,Diego Oliveira,Mauricio Aredes,Eduardo Galván-Díez and Juan M. Carrasco
Opublikowane w: Energies 2022, Numer Volume 15 (Numer 16), 5826, 2022, ISSN 1996-1073
Wydawca: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/en15165826

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