Trusted European SiC Value Chain for a greener Economy

Risultati finali

Initial dissemination & communication plan

This initial report will describe the plan and actions for the dissemination of the project results and describe the internal communication within the consortium

Project webpage and press release

This will describe the structure and layout of the project official public webpage including a press release describing the project partners and goals

Pubblicazioni

SmartSiCTM : Boosting SiC performance for high-voltage power applications

Autori: Walter Schwarzenbach, Severin Rouchier, G. Berre, R. Boulet, E. Cela, A. Drouin, A. Chapelle, S. Monnoye, H. Mank, C. Moisson, H. Biard, M. Lagrange, A. Quintero Colmenares, L. Kabelaan, L. Viravaux, N. Ben Mohamed, D. Radisson, E. Guiot, G. Lavaitte, A. Bouville-Lallart, J. Roi, J. Widiez, E. Rolland, G. Gélineau, K. Vladimirova, N. Troutot, A. Moulin, V. Prudkovski, S. Barbet, D. Delprat, N. Da
Pubblicato in: Industrial Session / ICSCRM 2022, 2022
Editore: ICSCRM 2022

Evaluation of crystal quality and dopant activation ofSmart Cut™ transferred 4H SiC thin film

Autori: G. Gelineau, J. Widiez, E.Rolland, K.Vladimirova, A. Moulin, V. Prudkovskiy, N.Troutot, P. Gergaud, D. Mariolle, S. Barbet, V.Amalbert, G. Lapertot, K. Mony, S. Rouchier, R. Boulet, G. Berre, W. Schwarzenbach, Y. Bogumilowicz
Pubblicato in: Scientific Poster / ICSCRM22, 2022
Editore: ICSCRM22

Advancements in Non-contact High-resolution Resistivity Imaging of Wide Bandgap Materials

Autori: M. Klein, S.Vinodh, B.Chen
Pubblicato in: Industry session / ICSCRM22, 2022
Editore: ICSCRM22

New Die Attach Materials: Silver and Silver/ Copper sintering pastes

Autori: B. Rábay, A. Stelzer
Pubblicato in: 2022
Editore: PCIM Europe Conference 2022

Smart CutTM SiC: enabling a larger adoption of SiC substrate for power devices

Autori: E. Guiot et al
Pubblicato in: APEC 2022, 2022
Editore: IEEE

Benchmarking experiment of substrate quality including SmartSiCTM wafers by epitaxy in a batch reactor

Autori: B. Kallinger, P. Hens, P. Berwian, C. Kranert, K.M. Albrecht, J. Erlekampf
Pubblicato in: Solid State Phenomena,, Numero Volume 342, 2022, Pagina/e 91-98, ISSN 1662-9779
Editore: Trans Tech Publications Ltd
DOI: 10.4028/v-868lqn

Evaluation of Crystal Quality and Dopant Activation of Smart CutTM - Transferred 4H-SiC Thin Film

Autori: G. Gelineau, J. Widiez, E.Rolland, K.Vladimirova, A. Moulin, V. Prudkovskiy, N.Troutot, P. Gergaud, D. Mariolle, S. Barbet, V.Amalbert, G. Lapertot, K. Mony, S. Rouchier, R. Boulet, G. Berre, W. Schwarzenbach, Y. Bogumilowicz
Pubblicato in: Materials Science Forum, Numero 1089(2), 2022, Pagina/e 71-79, ISSN 1662-9752
Editore: Trans Tech Publications Ltd
DOI: 10.4028/p-026sj4

Tailored Polycrystalline Substrate for SmartSiCTM Substrates Enabling High Performance Power Devices

Autori: H. Biard, W. Schwarzenbach, S. Odoul, I. Radu,A. Potier, M. Ferrato, E. Guajioty
Pubblicato in: Diffusion and Defect Data Pt.B: Solid State Phenomena, Numero 344(12), 2022, Pagina/e 47-52, ISSN 1662-9779
Editore: Trans Tech Publications Ltd
DOI: 10.4028/p-65127n

Engineered SiC materials for power technologies

Autori: W. Schwarzenbach, S. Rouchier, G. Berre, R. Boulet, O. Ledoux, E. Cela, A. Drouin, A. Chapelle, S. Monnoye, H. Biard, K. Alassaad, L. Viravaux, N. Ben Mohamed, D. Radisson, G. Picun, G. Lavaitte, A. Bouville-Lallart, J. Roi, J. Widiez, K. Abadie,E. Rolland, F. Fournel, G. Gélineau, F. Mazen, A. Moulin, C. Moulin, D. Delprat , N. Daval, S. Odoul, P. Sandri and C. Maleville
Pubblicato in: 2022 International Conference on IC Design and Technology (ICICDT), Numero INSPEC Accession Number: 22214351, 2022, Pagina/e 55 - 56
Editore: IEEE
DOI: 10.1109/icicdt56182.2022

High sensitivity surface defect inspection of SiC and SmartSiCTM substrates using a DUV laser-based system

Autori: Enrica Cela, Sam Shahidi , Prasant Parangi , Ramesh Shrestha, Gavin Simpson, Julie Widiez, Nicolas Daval, Audrey Chapelle, Séverin Rouchier, Walter Schwarzenbach
Pubblicato in: International Conference on Silicon Carbide and Related Materials 2022, Numero Defect and Diffusion Forum Vol. 425, 2022, Pagina/e 320-324, ISBN 978-3-0364-0167-6
Editore: Trans Tech Publications Ltd
DOI: 10.4028/p-4918s1

Proven Power Cycling Reliability of Ohmic Annealing Free SiC Power Device through the Use of SmartSiCTM Substrate

Autori: Eric Guiot, Frédéric Allibert, Jürgen Leib, Tom Becker, Walter Schwarzenbach, Tobias Erlbacher, Carsten Hellinger, Séverin Rouchier
Pubblicato in: Materials Science Forum, Numero 1092, 2022, Pagina/e 201-207, ISSN 1662-9752
Editore: Trans Tech Publications Ltd
DOI: 10.4028/p-777hqg

Proven Power Cycling Reliability of SmartSiC(TM) Substrate for Power Devices

Autori: Eric Guiot, Gonzalo Picun, Frédéric Allibert, Jürgen Leib, Tom Becker, Walter Schwarzenbach, Alexis Drouin, Jean-Marc Béthoux, Julie Widiez, Séverin Rouchier, Tobias Erlbacher
Pubblicato in: PCIM Europe 2022; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 2022
Editore: VDE
DOI: 10.30420/565822081

Supporting Collaborative Innovation Processes in Smart Product Value

Autori: Damun Mollahassani, Jonas Gries, Sven Forte, Jens C. Göbel
Pubblicato in: Procedia CIRP, Numero Volume 109, 2022, Pagina/e 349-355
Editore: Elsevier
DOI: 10.1016/j.procir.2022.05.261

150 mm SiC engineered substrates for high-voltage power devices

Autori: Séverin Rouchier, et al
Pubblicato in: ICSCRM 2021, 2021
Editore: Material Science Forum published by Trans Tech Publications Ltd, Switzerland for ECSCRM 2021
DOI: 10.4028/p-mxxdef

Investigation of Stability and Oscillations at Power Modules with Low Stray Inductance

Autori: S. Buetow, M. Spang
Pubblicato in: 2022
Editore: ISPSD (International Symposium on Power Semiconductor Devices and ICs)

Supporting Collaborative Innovation Processes in Smart Product ValueCreation Networks

Autori: Damun Mollahassani, Jonas Gries, Sven Forte, Jens C. Göbel
Pubblicato in: Supporting Collaborative Innovation Processes in Smart Product Value Creation Networks, 2022, Pagina/e 5
Editore: CIRP DESIGN 2022

SmartSiCTM for Manufacturing of SiC Power Devices

Autori: Nicolas Daval et al
Pubblicato in: EDTM 2022, 2022
Editore: EDTM 2022

The mobility scenario vs Green Deal Objectives

Autori: A.Imbruglia, F.Gennaro, P.Di Grazia
Pubblicato in: Smart System Integration 2022, 2022, Pagina/e 5
Editore: SSI2022

A greener SiC wafer with Smart Cut technology

Autori: OLIVIER BONNIN, ERIC GUIOT, WALTER SCHWARZENBACHM AND GONZALO PICUN
Pubblicato in: Compound Semiconductor, 2021
Editore: Compound Semiconductor

Focus Topic: Wide Bandgap Semiconductors

Autori: Filippo Di Giovanni
Pubblicato in: Oral presentation / Electronica 2022, 2022
Editore: Electronica 2022

Impact of aluminum casing on high-frequency transformer leakage inductance and AC resistance

Autori: R. Bakri, X. Margueron, W. da Cunha Alves, X. Cimetiere, F. Gillon, A. Bruyere, L. Vatamanu
Pubblicato in: 2022
Editore: 24th European Conference on Power Electronics and Applications (EPE'22 ECCE Europe)

Wissensbasis zur Förderung von Innovationen Smarter PSS innerhalb eines Wertschöpfungsnetzwerkes

Autori: Damun Mollahassani, Thomas Eickhoff, Andreas Eiden, Jens C. Göbel
Pubblicato in: Tag des Systems Engineering 2022 - Tagungsband Paderborn, Numero Band 20, 2022, ISBN 9783981880533
Editore: Gesellschaft für Systems Engineering e.V.

Proven Power Cycling Reliability of SmartSiCTM Substrate for power device

Autori: E. Guiot,Frédéric Allibert, Jürgen Leib, Tom Becker, Walter Schwarzenbach, Carsten Hellinger, Tobias Erlbacher, Séverin Rouchier
Pubblicato in: PCIM 2022, 2022
Editore: Mesago for PCIM 2022

Optimization-Based Capacitor Balancing Method with Customizable Switching Reduction for CHB Converters

Autori: Luis Galván, Pablo Jesús Gómez, Eduardo Galván, Juan Manuel Carrasco
Pubblicato in: Special Numero Advances in Multilevel Converter/Inverter Topologies and Applications. Energies (MDPI), 2022, ISSN 1996-1073
Editore: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/en15061976

Optimization-Based Capacitor Balancing Method with Selective DC Current Ripple Reduction for CHB Converters

Autori: Luis Galván, Pablo Jesús Gómez, Eduardo Galván, Juan Manuel Carrasco
Pubblicato in: Special Numero Advances in Multilevel Converter/Inverter Topologies and Applications. Energies (MDPI), 2021, ISSN 1996-1073
Editore: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/en15010243

Advanced Local Grid Control System for Offshore Wind Turbines with the Diode-Based Rectifier HVDC Link Implemented in a True Scalable Test Bench

Autori: Danilo Herrera,Thiago Tricarico,Diego Oliveira,Mauricio Aredes,Eduardo Galván-Díez and Juan M. Carrasco
Pubblicato in: Energies 2022, Numero Volume 15 (Numero 16), 5826, 2022, ISSN 1996-1073
Editore: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/en15165826

Risultati finali

Pubblicazioni

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