Photonic Wafer-Level Integration Packaging and Test

Información del proyecto

PhotonicLEAP

Identificador del acuerdo de subvención: 101016738

DOI 10.3030/101016738

Fecha de la firma de la CE 30 Noviembre 2020

Fecha de inicio 1 Enero 2021

Fecha de finalización 31 Diciembre 2024

Financiado con arreglo a

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)

Coste total € 5 945 017,50

Aportación de la UE € 5 945 017,50

Coordinado por

UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK
Ireland

Resultado final

Documents, reports (2)

Project website, twitter account & social media

Project website twitter account social media profile TNI

First press release about PhotonicLEAP project

First press release about PhotonicLEAP project TNI

Publicaciones

Conference proceedings (4)

Reference Thermal Chips for 2D and 3D Co-packaging Process Development

Autores: P. Gupta et al.
Publicado en: 2023, ISBN 979-8-3503-3499-9
Editor: IEEE
DOI: 10.1109/ectc51909.2023.00372

Design and Optimizing Backside Grating Couplers in Si-Photonics Circuits

Autores: M. Ghomashi, R. Baets and Y. Li
Publicado en: 2023, ISBN 979-8-3503-1429-8
Editor: IEEE
DOI: 10.1109/nusod59562.2023.10273523

Impact of Through Glass Vias Filling on the Performance of Passive Thermal Cooling in Photonic Packages

Autores: P. Gupta et al.
Publicado en: 2022
Editor: IEEE
DOI: 10.1109/estc55720.2022.9939531

High Aspect Ratio Through-Glass Vias as Heat Conductive Element

Autores: K. Kröhnert et al.
Publicado en: 2022, ISBN 978-91-89711-39-6
Editor: IEEE

Peer reviewed articles (3)

Demonstration of a Single-Mode Expanded-Beam Connectorized Module for Photonic Integrated Circuits

Autores: Kamil Gradkowski; David Stegall; David Mackey; Alan Naughton; Terry Smith; Peter O'Brien
Publicado en: Journal of Lightwave Technology, 2023, Página(s) 3470-3478, ISSN 0733-8724
Editor: Optical Society of America
DOI: 10.1109/jlt.2023.3239138

Integrated Photonics Packaging: Challenges and Opportunities

Autores: Luigi Ranno, Parnika Gupta, Kamil Gradkowski, Robert Bernson, Drew Weninger, Samuel Serna, Anuradha Murthy Agarwal*, Lionel C. Kimerling, Juejun Hu*, and Peter OBrien*
Publicado en: ACS Photonics, 2022, ISSN 2330-4022
Editor: American Chemical Society
DOI: 10.1021/acsphotonics.2c00891

Substrate integrated micro-thermoelectric coolers in glass substrate for next-generation photonic packages

Autores: Parnika Gupta, Amit Tanwar, Xiuyun He, Kamil Gradkowski, Kafil M. Razeeb, Padraic E. Morrissey, Peter O’Brien
Publicado en: JOURNAL OF OPTICAL MICROSYSTEMS, 2024, ISSN 1932-5150
Editor: S P I E - International Society for Optical Engineering