Photonic Wafer-Level Integration Packaging and Test

Informazioni relative al progetto

PhotonicLEAP

ID dell’accordo di sovvenzione: 101016738

DOI 10.3030/101016738

Data della firma CE 30 Novembre 2020

Data di avvio 1 Gennaio 2021

Data di completamento 31 Dicembre 2024

Finanziato da

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)

Costo totale € 5 945 017,50

Contributo UE € 5 945 017,50

Coordinato da

UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK
Ireland

Risultati finali

Documents, reports (2)

Project website, twitter account & social media

Project website twitter account social media profile TNI

First press release about PhotonicLEAP project

First press release about PhotonicLEAP project TNI

Pubblicazioni

Conference proceedings (4)

Reference Thermal Chips for 2D and 3D Co-packaging Process Development

Autori: P. Gupta et al.
Pubblicato in: 2023, ISBN 979-8-3503-3499-9
Editore: IEEE
DOI: 10.1109/ectc51909.2023.00372

Design and Optimizing Backside Grating Couplers in Si-Photonics Circuits

Autori: M. Ghomashi, R. Baets and Y. Li
Pubblicato in: 2023, ISBN 979-8-3503-1429-8
Editore: IEEE
DOI: 10.1109/nusod59562.2023.10273523

Impact of Through Glass Vias Filling on the Performance of Passive Thermal Cooling in Photonic Packages

Autori: P. Gupta et al.
Pubblicato in: 2022
Editore: IEEE
DOI: 10.1109/estc55720.2022.9939531

High Aspect Ratio Through-Glass Vias as Heat Conductive Element

Autori: K. Kröhnert et al.
Pubblicato in: 2022, ISBN 978-91-89711-39-6
Editore: IEEE

Peer reviewed articles (3)

Demonstration of a Single-Mode Expanded-Beam Connectorized Module for Photonic Integrated Circuits

Autori: Kamil Gradkowski; David Stegall; David Mackey; Alan Naughton; Terry Smith; Peter O'Brien
Pubblicato in: Journal of Lightwave Technology, 2023, Pagina/e 3470-3478, ISSN 0733-8724
Editore: Optical Society of America
DOI: 10.1109/jlt.2023.3239138

Integrated Photonics Packaging: Challenges and Opportunities

Autori: Luigi Ranno, Parnika Gupta, Kamil Gradkowski, Robert Bernson, Drew Weninger, Samuel Serna, Anuradha Murthy Agarwal*, Lionel C. Kimerling, Juejun Hu*, and Peter OBrien*
Pubblicato in: ACS Photonics, 2022, ISSN 2330-4022
Editore: American Chemical Society
DOI: 10.1021/acsphotonics.2c00891

Substrate integrated micro-thermoelectric coolers in glass substrate for next-generation photonic packages

Autori: Parnika Gupta, Amit Tanwar, Xiuyun He, Kamil Gradkowski, Kafil M. Razeeb, Padraic E. Morrissey, Peter O’Brien
Pubblicato in: JOURNAL OF OPTICAL MICROSYSTEMS, 2024, ISSN 1932-5150
Editore: S P I E - International Society for Optical Engineering