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CORDIS provides links to public deliverables and publications of HORIZON projects.

Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .

Deliverables

Elementary VNWFET devices (JL and PC) - V1

Fabrication of elementary VNWFET devices (JL and PC) - First version

Elementary VNWFET devices (JL and PC) - V2

Fabrication of elementary VNWFET devices (JL and PC) - improved version

Technology impact and exploitation innovation - Y3

Technology impact and exploitation innovation - Third assessment

Thermal impedance and trap extraction - V1

First report on the thermal impedance and trap extraction of VNWFETs devices fabricated in WP1

Plan for dissemination of the results - Y1

Annual plan for dissemination of the results

Workshops and summer school's report

Report on workshops and summer school's

Plan for dissemination of the results - Y2

Annual plan for dissemination of the results, year 2

Technology impact and exploitation innovation - Y1

Technology impact and exploitation innovation First assessment

Pre-trained speech ASR/MT model and use-cases - V2

Second version of pre-trained speech ASR/MT model and use-cases

Open source release: parameterizable simulator with application examples - V1

First open source release: parameterizable simulator with application examples

Plan for dissemination of the results - Y3

Annual plan for dissemination of the results - year 3

Scaled-down N2C2 design

Report on scaled-down N2C2 design

Library of optimized VNWFET-based logic cells
Pre-trained speech ASR/MT model and use-cases - V1

First version of pretrained speech ASRMT model and usecases

Architecture library, multi-objective trade-offs and calibrated thermal models - V1

First version of architecture library, multi-objective trade-offs and calibrated thermal models

Technology impact and exploitation innovation - Y2

Technology impact and exploitation innovation - Second assessment

Virtual scalable N2C2 design and Pareto-front data - V1

Report on virtual scalable N2C2 design and Paretofront data V1

Co-optimized hardware/NN architecture for ASR/MT - V1

First report on the co-optimized hardware/NN architecture for ASR/MT

Versatile and scalable 3D architectural interconnect framework

Report on the versatile and scalable 3D architectural interconnect framework

Project handbook

Handbook summarizing decisionmaking process and planned meetings quality process for deliverables deliverable template progress reports template

Parasitic element extraction - V1

Report on parasitic element extraction

Project Website and social network account

Project Website and social networks accounts for FVLLMONTI are visible online

Data Management Plan

Publications

A 16-bit floating-point near-sram architecture for low-power sparse matrix-vector multiplication

Author(s): Eggermann, G., Rios, M., Ansaloni, G., Nassif, S. and Atienza, D.
Published in: In 2023 IFIP/IEEE 31st International Conference on Very Large-Scale Integration (VLSI-SoC) In 2023 IFIP/IEEE 31st International Conference on Very Large-Scale Integration (VLSI-SoC), 2023, ISBN 979-8-3503-2599-7
Publisher: IEEE
DOI: 10.1109/vlsi-soc57769.2023.10321838

Strategies for Characterization and Parameter Extraction of Vertical Junction-less Nanowire FETs dedicated to Design Technology Co-Optimization

Author(s): C. Maneux, C. Mukherjee, M. Deng, G. Larrieu, Y. Wang, Houssem Rezgui and B. Neckel Wesling
Published in: 243rd ECS Meeting, Boston, US, May 28th -June 2nd, 2023, Issue mai-23, 2023
Publisher: ECS
DOI: 10.1149/11101.0209ecst

The 3D Neural Network Compute Cube (N2C2) Concept enabling Efficient Hardware Transformer Architectures towards Speech-to-Speech Translation

Author(s): I. O'Connor, S. Mannaa, A. Bosio, B. Deveautour, D. Deleruyelle, T. Obukhova, C. Marchand, J. Trommer, C. Cakirlar, B. Neckel Wesling, T. Mikolajick, O. Baumgartner, M. Thesberg, D. Pirker, C. Lenz, Z. Stanojevic, M. Karner, G. Larrieu, S. Pelloquin, K. Moustakas, J. Muller, G. Ansaloni, A. Amirshahi, D. Atienza, J-L. Rouas, L. Ben Letaifa, G. Bordea, C. Brazier, Y. Wang, C. Mukherjee, M. Deng, M.
Published in: In 27th Design, Automation and Test in Europe Conference (DATE 24), Multi-partner projects (MPP) papers, 2024
Publisher: CESI

Analysis of an Inverter Logic Cell based on 3D Vertical NanoWire Junction-Less Transistors

Author(s): L. Réveil, C. Mukherjee, C. Maneux, M. Deng, F. Marc, A. Kumar, A. Lecestre, G. Larrieu, A. Poittevin, I. O'Connor, O. Baumgartner and D. Pirker
Published in: VLSI-SOC, 2022
Publisher: VLSI-SOC

Reconfigurable field effect transistors: A technology enablers perspective

Author(s): T. Mikolajick, G. Galderisi, S. Rai, M. Simon, R. Böckle, M. Sistani, C. Cakirlar, N. Bhattacharjee, T. Mauersberger, A. Heinzig, A. Kumar, W.M. Weber, J. Trommer.
Published in: Solid-State Electronics, 2022
Publisher: Elsevier
DOI: 10.1016/j.sse.2022.108381

Challenges in Electron Beam Lithography of Silicon Nanostructures

Author(s): C Cakirlar, G Galderisi, C Beyer, M Simon, T Mikolajick, J Trommer
Published in: IEEE 22nd International Conference on Nanotechnology (IEEE NANO), 2022, ISBN 978-1-6654-5225-0
Publisher: IEEE
DOI: 10.1109/nano54668.2022.9928629

Electrothermal modeling of junctionless vertical Si nanowire transistors for 3D logic circuit design

Author(s): Y. Wang, C. Mukherjee. H. Rezgui, M. Deng, C. Maneux, S. Mannaa, I. O’Connor, J. Müller, S. Pelloquin, G. Larrieu
Published in: European Solid-State Device Research Conference (ESSDERC), 2023
Publisher: IEEE
DOI: 10.1109/essderc59256.2023.10268560

Compact Metal-Ferroelectric-Insulator-Semiconductor (MFIS) Approaches Versus TCAD For the Modeling Of Ferroelectric Transistors (FeFETs): Percolation, Steep-Subthreshold and Depolarization

Author(s): Thesberg, M., Schanovsky, F., Stanojevic, Z., Baumgartner, O. and Karner, M.
Published in: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Issue 2023, 2023, ISBN 978-4-86348-803-8
Publisher: IEEE
DOI: 10.23919/sispad57422.2023.10319645

Error Resilient In-Memory Computing Architecture for CNN Inference on the Edge

Author(s): Rios, M., Ponzina, F., Ansaloni, G., Levisse, A. and Atienza, D.
Published in: In Proceedings of the Great Lakes Symposium on VLSI 2022, Issue 2022, 2022, ISBN 9781450393225
Publisher: Association for Computing Machinery
DOI: 10.1145/3526241.3530351

Using Algorithmic Transformations and Sensitivity Analysis to Unleash Approximations in CNNs at the Edge

Author(s): Ponzina, F., Ansaloni, G., Peón-Quirós, M. and Atienza, D.
Published in: Micromachines, 2023
Publisher: MDPI
DOI: 10.3390/mi13071143

Advanced contacts on 3D nanostructured channels for vertical transport gate-all-around transistors

Author(s): Guilhem Larrieu, Jonas Müller, Sylvain Pelloquin, Abhishek Kumar, Konstantinos Moustakas, Pawel Michalowski, Aurelie Lecestre
Published in: 21st International Workshop on Junction Technology (IWJT), Issue 23 juin, 2023, ISBN 978-4-86348-807-6
Publisher: IEEE
DOI: 10.23919/iwjt59028.2023.10175172

Layer-Wise Learning Framework for Efficient DNN Deployment in Biomedical Wearable Systems

Author(s): Baghersalimi, S., Amirshahi, A., Teijeiro, T., Aminifar, A. and Atienza, D.
Published in: 2023 IEEE 19th International Conference on Body Sensor Networks (BSN), 2023, ISBN 979-8-3503-3841-6
Publisher: IEEE
DOI: 10.1109/bsn58485.2023.10331334

Analysis of Energy-Delay-Product of a 3D Vertical Nanowire FET Technology

Author(s): Ian O’Connor, Arnaud Poittevin, Sébastien Le Beux, Alberto Bosio, Zlatan Stanojevic, Oskar Baumgartner, C Mukherjee, C Maneux, J Trommer, T Mikolajick, G Larrieu
Published in: Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EuroSOI-ULIS), 2021, Page(s) 1-4
Publisher: NA

Variable Scale Pruning for Transformer Model Compression in End-to-End Speech Recognition

Author(s): L. Ben Letaifa and J.-L. Rouas
Published in: Algorithms Vol 16 n°9, 2023
Publisher: MDPI
DOI: 10.3390/a16090398

INCLASS: incremental classification strategy for self-aware epileptic seizure detection

Author(s): Ferretti, Lorenzo, Giovanni Ansaloni, Renaud Marquis, Tomas Teijeiro, Philippe Ryvlin, David Atienza, and Laura Pozzi
Published in: Design, Automation & Test in Europe Conference & Exhibition (DATE), 2022, Page(s) 1449-1454
Publisher: IEEE

VNWFET-based technology: from device modelling to standard cell library

Author(s): S. Mannaa, C. Marchand, D. Deleruyelle, B. Deveautour, I. O'Connor, A. Bosio
Published in: Int. Conf. Nanotechnology (NANO), 2023
Publisher: IEEE
DOI: 10.1109/nano58406.2023.10231288

Extraction of small signal equivalent circuit for de−embedding of 3D vertical nanowire transistor

Author(s): B. Neckel Wesling, M. Deng, C. Mukherjee, A. Kumar, G. Larrieu, et al.
Published in: 8th Joint International EuroSOI Workshop and International Conference on Ultimate Integration on Silicon (EuroSOI−ULIS) 2022, May, Issue mai 22, 2022
Publisher: Elsevier
DOI: 10.1016/j.sse.2022.108359

Full System Exploration of On-Chip Wireless Communication on Many-Core Architectures

Author(s): Medina Morillas, Rafael, Joshua Alexander Harrison Klein, Yasir Mahmood Qureshi, Marina Zapater Sancho, Giovanni Ansaloni, and David Atienza Alonso
Published in: IEEE 13th Latin America Symposium on Circuits and System (LASCAS), 2022
Publisher: IEEE

Modelling of vertical and ferroelectric junctionless technology for efficient 3D neural network compute cube dedicated to embedded artificial intelligence

Author(s): C. Maneux, C. Mukherjee, M. Deng, M. Dubourg, L. Reveil, G. Bordea, A. Lecestre, G. Larrieu, J. Trommer, E.T. Breyer, S. Slesazeck, T. Mikolajick, O. Baumgartner, M. Karner, D. Pirker, Z. Stanojevic, David Atienza, A. Levisse, G. Ansaloni, A. Poittevin, A. Bosio, D. Deleruyelle, C. Marchand, I. O'Connor
Published in: IEEE IEDM, 2021
Publisher: IEEE

REMOTE: Re-thinking Task Mapping on Wireless 2.5D Systems-on-Package for Hotspot Removal

Author(s): Medina, R., Huang, D., Ansaloni, G., Zapater, M. and Atienza, D.
Published in: 2023 IFIP/IEEE 31st International Conference on Very Large Scale Integration (VLSI-SoC), 2023, ISBN 979-8-3503-2599-7
Publisher: IEEE
DOI: 10.1109/vlsi-soc57769.2023.10321912

Transformer model compression for end-to-end speech recognition on mobile devices

Author(s): Leila Ben Letaifa, Jean-Luc Rouas.
Published in: EUSIPCO 2022, 2022
Publisher: EUSIPCO

Circuit Design Flow dedicated to 3D vertical nanowire FET

Author(s): C. Maneux, C. Mukherjee, M. Deng, B. Neckel Wesling, L. Reveil, Z. Stanojevic, O. baumgartner, A. Poittevin, I. O'Connor, G. Larrieu
Published in: IEEE LAEDC, 2022
Publisher: NA

A Logic Cell Design and routing Methodology Specific to VNWFET

Author(s): A. Poittevin, I. O‘Connor, C. Marchand, A. Bosio, C. Maneux, C. Mukherjee, G. Larrieu, A. Kumar
Published in: 20th IEEE Interregional NEWCAS Conference (NEWCAS), 2022
Publisher: NA
DOI: 10.1109/newcas52662.2022.9842100

Demonstration of a p-type Junctionless Silicon Nanowire Transistor with Ferroelectric Hafnium-Zirkonium-Oxide Gate

Author(s): T. Mauersberger, J. Trommer, G. Galderisi, M. Knaut, D. Pohl, A. Tahn, B. Rellinghaus, T. Mikolajick, A. Heinzig
Published in: EMRS Fall Meeting, Warsaw, 2023, Issue No proceedings, talk only, 2023
Publisher: EMRS

Advancements in HZO Layer Engineering for Ultimate 3D Vertical Transistors : Towards a Logic-In-Memory Application

Author(s): K. Moustakas, B. Neckel-Wesling, A. Lecestre, F. Mathieu, T. Mikolajick, J. Trommer, G. Larrieu, L. Cancellara, J.-D. Grillet
Published in: EMRS Fall Meeting, Warsaw, 2023, Issue 23-oct., 2023
Publisher: EMRS

Energy-Efficient Computation-In-Memory Architecture Using Emerging Technologies

Author(s): R. Bishnoi, S. Diware, A. Gebregiorgis, S. Thomann, S. Mannaa, B. Deveautour, C. Marchand, A. Bosio, D. Deleruyelle, I. O'Connor, H. Amrouch, S. Hamdioui
Published in: International Conference on Microelectronics (ICM), 2023
Publisher: IEEE
DOI: 10.1109/icm60448.2023.10378889

TiC-SAT: Tightly-coupled Systolic Accelerator for Transformers

Author(s): Amirshahi A, Klein JA, Ansaloni G, Atienza D.
Published in: InProceedings of the 28th Asia and South Pacific Design Automation Conference 2023, 2023, ISBN 978-1-4503-9783-4
Publisher: IEEE

System-Level Exploration of In-Package Wireless Communication for Multi-Chiplet Platforms

Author(s): Medina R, Kein J, Ansaloni G, Zapater M, Abadal S, Alarcón E, Atienza D.
Published in: In Proceedings of the 28th Asia and South Pacific Design Automation Conference 2023 Jan 16, 2023, ISBN 978-1-4503-9783-4
Publisher: IEEE

Understanding the substrate effect on de-embedding structures fabricated on SOI wafers using electromagnetic simulation

Author(s): B. Neckel Wesling, M. Deng, C. Mukherjee, T. Mikolajick, J. Trommer and C. Maneux
Published in: IEEE International Conference on Microelectronic Test Structures (ICMTS), April 2024, Edinburgh, Scotland, Issue Avr 24, 2024
Publisher: IEEE

Thermal consideration in nanoscale gate-all-around vertical transistors

Author(s): Guilhem Larrieu, Houssem Rezgui, Abhishek Kumar, Jonas Müller, Sylvain Pelloquin, Yifan Wang, Marina Deng, Aurelie Lecestre, Cristell Maneux, Chhandak Mukherjee
Published in: 2023 Silicon Nanoelectronics Workshop (SNW), Kyoto, Japan, Issue juin-23, 2023, ISBN 978-4-86348-808-3
Publisher: IEEE
DOI: 10.23919/snw57900.2023.10183951

A Study of the Variability and Design Considerations of Ferroelectric VNAND Memories With Polycrystalline Films Using An Experimentally Validated TCAD Model

Author(s): Thesberg M, Schanovsky F, Stanojević Z, Baumgartner O, Karner M.
Published in: ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC), 2023, ISBN 979-8-3503-0423-7
Publisher: IEEE
DOI: 10.1109/essderc59256.2023.10268518

INCLASS: Incremental Classification Strategy for Self-Aware Epileptic Seizure Detection

Author(s): Lorenzo Ferretti; Giovanni Ansaloni; Renaud Marquis; Tomas Teijeiro; Philippe Ryvlin; David Atienza; Laura Pozzi
Published in: 2022 Design, Automation & Test in Europe Conference & Exhibition (DATE), Issue 1, 2022, Page(s) 1449-1454
Publisher: IEEE
DOI: 10.23919/date54114.2022.9774713

Fine-grained analysis of the transformer model for efficient pruning

Author(s): L. Ben Letaifa and J.-L. Rouas
Published in: 21st IEEE International Conference on Machine Learning and Applications (ICMLA), Dec. 2022, Issue 2022, 2022
Publisher: IEEE
DOI: 10.1109/icmla55696.2022.00149

Overflow-free compute memories for edge AI acceleration

Author(s): Ponzina F, Rios M, Levisse A, Ansaloni G, Atienza D.
Published in: ACM Transactions on Embedded Computing Systems, Issue ACM Transactions on Embedded Computing SystemsVolume 22Issue 5sArticle No.: 121, 2023, Page(s) pp 1–23, ISSN 1539-9087
Publisher: Association for Computing Machinary, Inc.
DOI: 10.1145/3609387

On the Modeling of Polycrystalline Ferroelectric Thin Films: Landau-Based Models Versus Monte Carlo-Based Models Versus Experiment

Author(s): M. Thesberg, M. N. K. Alam, B. Truijen, B. Kaczer, P. J. Roussel, Z. Stanojević, O. Baumgartner, F. Schanovsky, M. Karner, H. Kosina
Published in: IEEE TED Vol 69, n°6, 2022, 2022, ISSN 0018-9383
Publisher: Institute of Electrical and Electronics Engineers
DOI: 10.1109/ted.2022.3167942

Single-step reactive ion etching process for device integration of hafnium-zirconium-oxide (HZO)/titanium nitride (TiN) stacks

Author(s): Tom Mauersberger; Jens Trommer; Saurabh Sharma; Martin Knaut; Darius Pohl; Bernd Rellinghaus; Thomas Mikolajick; Andre Heinzig
Published in: Semiconductor Science and Technology, Issue 1, 2021, ISSN 0268-1242
Publisher: Institute of Physics Publishing
DOI: 10.1088/1361-6641/ac1827

A hardware/software co-design vision for deep learning at the edge

Author(s): Ponzina, Flavio, Simone Machetti, Marco Antonio Rios, Benoît Walter Denkinger, Alexandre Sébastien Julien Levisse, Giovanni Ansaloni, Miguel Peon Quiros, and David Atienza Alonso
Published in: IEEE Micro - Special Issue on Artificial Intelligence at the Edge, 2022, ISSN 0272-1732
Publisher: Institute of Electrical and Electronics Engineers
DOI: 10.1109/mm.2022.3195617

Compact modeling of 3D vertical junctionless gate-all-around silicon nanowire transistors towards 3D logic design

Author(s): Mukherjee, C., Poittevin, A., O'Connor, I., Larrieu, G., Maneux, C.
Published in: Solid-State Electronics, 2021, ISSN 0038-1101
Publisher: Pergamon Press Ltd.
DOI: 10.1016/j.sse.2021.108125

Cross-Shape Reconfigurable Field Effect Transistor for Flexible Signal Routing

Author(s): C. Cakirlar, M. Simon, G. Galderisi, I. O’Connor, T. Mikolajick, J. Trommer
Published in: Materials Today Electronics, 2023, ISSN 2772-9494
Publisher: Elsevier
DOI: 10.1016/j.mtelec.2023.100040

Nanoscale Thermal Transport in Vertical Gate-all-around Junction-less Nanowire Transistors - Part I: Experimental Methods

Author(s): C. Mukherjee, H. Rezgui, Y. Wang, M. Deng, A. Kumar, J. Muller, G. Larrieu and C. Maneux
Published in: IEEE TED Vol 70 n°12, Issue 11 oct, 2023, ISSN 0018-9383
Publisher: Institute of Electrical and Electronics Engineers
DOI: 10.1109/ted.2023.3321277

Bit-Line Computing for CNN Accelerators Co-Design in Edge AI Inference

Author(s): Rios, M., Ponzina, F., Levisse, A.S.J., Ansaloni, G., Alonso, D.A., Amirshahi, A., Klein, J.A.H., Orlandi, M., Zanghieri, M., Schiavone, D. and Donati, E.,
Published in: IEEE Transactions on Emerging Topics in Computing ( Volume: 11, Issue: 2, 01 April-June 2023), 2023, ISSN 2168-6750
Publisher: IEEE Computer Society
DOI: 10.1109/tetc.2023.3237914

3D Logic circuit design oriented electrothermal modeling of vertical junctionless nanowire FETs

Author(s): R. Bishnoi, S. Diware, A. Gebregiorgis, S. Thomann, S. Mannaa, B. Deveautour, C. Marchand, A. Bosio, D. Deleruyelle, I. O'Connor, H. Amrouch, S. Hamdioui
Published in: J. Exploratory Solid-State Computational Devices and Circuits, 2023, ISSN 2329-9231
Publisher: IEEE
DOI: 10.1109/jxcdc.2023.3309502

Nanoscale Thermal Transport in Vertical Gate-all-around Junction-less Nanowire Transistors- Part II: Multiphysics Simulation

Author(s): H. Rezgui, C. Mukherjee, Y. Wang, M. Deng, A. Kumar, J. Muller, G. Larrieu and C. Maneux
Published in: IEEE TED Vol 70 n°12, Issue oct.-23, 2023, ISSN 0018-9383
Publisher: Institute of Electrical and Electronics Engineers
DOI: 10.1109/ted.2023.3321280

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