Deliverables
Fabrication of elementary VNWFET devices (JL and PC) - First version
Elementary VNWFET devices (JL and PC) - V2Fabrication of elementary VNWFET devices (JL and PC) - improved version
First report on the thermal impedance and trap extraction of VNWFETs devices fabricated in WP1
Plan for dissemination of the results - Y1Annual plan for dissemination of the results
Workshops and summer school's reportReport on workshops and summer school's
Plan for dissemination of the results - Y2Annual plan for dissemination of the results, year 2
Technology impact and exploitation innovation - Y1Technology impact and exploitation innovation First assessment
Pre-trained speech ASR/MT model and use-cases - V2Second version of pre-trained speech ASR/MT model and use-cases
Open source release: parameterizable simulator with application examples - V1First open source release: parameterizable simulator with application examples
Plan for dissemination of the results - Y3Annual plan for dissemination of the results - year 3
Scaled-down N2C2 designReport on scaled-down N2C2 design
Library of optimized VNWFET-based logic cellsPre-trained speech ASR/MT model and use-cases - V1
First version of pretrained speech ASRMT model and usecases
Architecture library, multi-objective trade-offs and calibrated thermal models - V1First version of architecture library, multi-objective trade-offs and calibrated thermal models
Technology impact and exploitation innovation - Y2Technology impact and exploitation innovation - Second assessment
Virtual scalable N2C2 design and Pareto-front data - V1Report on virtual scalable N2C2 design and Paretofront data V1
Co-optimized hardware/NN architecture for ASR/MT - V1First report on the co-optimized hardware/NN architecture for ASR/MT
Versatile and scalable 3D architectural interconnect frameworkReport on the versatile and scalable 3D architectural interconnect framework
Project handbookHandbook summarizing decisionmaking process and planned meetings quality process for deliverables deliverable template progress reports template
Parasitic element extraction - V1Report on parasitic element extraction
Project Website and social networks accounts for FVLLMONTI are visible online
Publications
Author(s):
C. Maneux, C. Mukherjee, M. Deng, G. Larrieu, Y. Wang, Houssem Rezgui and B. Neckel Wesling
Published in:
243rd ECS Meeting, Boston, US, May 28th -June 2nd, 2023, Issue mai-23, 2023
Publisher:
ECS
DOI:
10.1149/11101.0209ecst
Author(s):
L. Réveil, C. Mukherjee, C. Maneux, M. Deng, F. Marc, A. Kumar, A. Lecestre, G. Larrieu, A. Poittevin, I. O'Connor, O. Baumgartner and D. Pirker
Published in:
VLSI-SOC, 2022
Publisher:
VLSI-SOC
Author(s):
Thesberg, M., Schanovsky, F., Stanojevic, Z., Baumgartner, O. and Karner, M.
Published in:
International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Issue 2023, 2023, ISBN 978-4-86348-803-8
Publisher:
IEEE
DOI:
10.23919/sispad57422.2023.10319645
Author(s):
Rios, M., Ponzina, F., Ansaloni, G., Levisse, A. and Atienza, D.
Published in:
In Proceedings of the Great Lakes Symposium on VLSI 2022, Issue 2022, 2022, ISBN 9781450393225
Publisher:
Association for Computing Machinery
DOI:
10.1145/3526241.3530351
Author(s):
Guilhem Larrieu, Jonas Müller, Sylvain Pelloquin, Abhishek Kumar, Konstantinos Moustakas, Pawel Michalowski, Aurelie Lecestre
Published in:
21st International Workshop on Junction Technology (IWJT), Issue 23 juin, 2023, ISBN 978-4-86348-807-6
Publisher:
IEEE
DOI:
10.23919/iwjt59028.2023.10175172
Author(s):
Ian O’Connor, Arnaud Poittevin, Sébastien Le Beux, Alberto Bosio, Zlatan Stanojevic, Oskar Baumgartner, C Mukherjee, C Maneux, J Trommer, T Mikolajick, G Larrieu
Published in:
Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EuroSOI-ULIS), 2021, Page(s) 1-4
Publisher:
NA
Author(s):
Ferretti, Lorenzo, Giovanni Ansaloni, Renaud Marquis, Tomas Teijeiro, Philippe Ryvlin, David Atienza, and Laura Pozzi
Published in:
Design, Automation & Test in Europe Conference & Exhibition (DATE), 2022, Page(s) 1449-1454
Publisher:
IEEE
Author(s):
B. Neckel Wesling, M. Deng, C. Mukherjee, A. Kumar, G. Larrieu, et al.
Published in:
8th Joint International EuroSOI Workshop and International Conference on Ultimate Integration on Silicon (EuroSOI−ULIS) 2022, May, Issue mai 22, 2022
Publisher:
Elsevier
DOI:
10.1016/j.sse.2022.108359
Author(s):
Medina Morillas, Rafael, Joshua Alexander Harrison Klein, Yasir Mahmood Qureshi, Marina Zapater Sancho, Giovanni Ansaloni, and David Atienza Alonso
Published in:
IEEE 13th Latin America Symposium on Circuits and System (LASCAS), 2022
Publisher:
IEEE
Author(s):
C. Maneux, C. Mukherjee, M. Deng, M. Dubourg, L. Reveil, G. Bordea, A. Lecestre, G. Larrieu, J. Trommer, E.T. Breyer, S. Slesazeck, T. Mikolajick, O. Baumgartner, M. Karner, D. Pirker, Z. Stanojevic, David Atienza, A. Levisse, G. Ansaloni, A. Poittevin, A. Bosio, D. Deleruyelle, C. Marchand, I. O'Connor
Published in:
IEEE IEDM, 2021
Publisher:
IEEE
Author(s):
Leila Ben Letaifa, Jean-Luc Rouas.
Published in:
EUSIPCO 2022, 2022
Publisher:
EUSIPCO
Author(s):
C. Maneux, C. Mukherjee, M. Deng, B. Neckel Wesling, L. Reveil, Z. Stanojevic, O. baumgartner, A. Poittevin, I. O'Connor, G. Larrieu
Published in:
IEEE LAEDC, 2022
Publisher:
NA
Author(s):
A. Poittevin, I. O‘Connor, C. Marchand, A. Bosio, C. Maneux, C. Mukherjee, G. Larrieu, A. Kumar
Published in:
20th IEEE Interregional NEWCAS Conference (NEWCAS), 2022
Publisher:
NA
DOI:
10.1109/newcas52662.2022.9842100
Author(s):
T. Mauersberger, J. Trommer, G. Galderisi, M. Knaut, D. Pohl, A. Tahn, B. Rellinghaus, T. Mikolajick, A. Heinzig
Published in:
EMRS Fall Meeting, Warsaw, 2023, Issue No proceedings, talk only, 2023
Publisher:
EMRS
Author(s):
K. Moustakas, B. Neckel-Wesling, A. Lecestre, F. Mathieu, T. Mikolajick, J. Trommer, G. Larrieu, L. Cancellara, J.-D. Grillet
Published in:
EMRS Fall Meeting, Warsaw, 2023, Issue 23-oct., 2023
Publisher:
EMRS
Author(s):
B. Neckel Wesling, M. Deng, C. Mukherjee, T. Mikolajick, J. Trommer and C. Maneux
Published in:
IEEE International Conference on Microelectronic Test Structures (ICMTS), April 2024, Edinburgh, Scotland, Issue Avr 24, 2024
Publisher:
IEEE
Author(s):
Guilhem Larrieu, Houssem Rezgui, Abhishek Kumar, Jonas Müller, Sylvain Pelloquin, Yifan Wang, Marina Deng, Aurelie Lecestre, Cristell Maneux, Chhandak Mukherjee
Published in:
2023 Silicon Nanoelectronics Workshop (SNW), Kyoto, Japan, Issue juin-23, 2023, ISBN 978-4-86348-808-3
Publisher:
IEEE
DOI:
10.23919/snw57900.2023.10183951
Author(s):
Lorenzo Ferretti; Giovanni Ansaloni; Renaud Marquis; Tomas Teijeiro; Philippe Ryvlin; David Atienza; Laura Pozzi
Published in:
2022 Design, Automation & Test in Europe Conference & Exhibition (DATE), Issue 1, 2022, Page(s) 1449-1454
Publisher:
IEEE
DOI:
10.23919/date54114.2022.9774713
Author(s):
L. Ben Letaifa and J.-L. Rouas
Published in:
21st IEEE International Conference on Machine Learning and Applications (ICMLA), Dec. 2022, Issue 2022, 2022
Publisher:
IEEE
DOI:
10.1109/icmla55696.2022.00149
Author(s):
Ponzina F, Rios M, Levisse A, Ansaloni G, Atienza D.
Published in:
ACM Transactions on Embedded Computing Systems, Issue ACM Transactions on Embedded Computing SystemsVolume 22Issue 5sArticle No.: 121, 2023, Page(s) pp 1–23, ISSN 1539-9087
Publisher:
Association for Computing Machinary, Inc.
DOI:
10.1145/3609387
Author(s):
Tom Mauersberger; Jens Trommer; Saurabh Sharma; Martin Knaut; Darius Pohl; Bernd Rellinghaus; Thomas Mikolajick; Andre Heinzig
Published in:
Semiconductor Science and Technology, Issue 1, 2021, ISSN 0268-1242
Publisher:
Institute of Physics Publishing
DOI:
10.1088/1361-6641/ac1827
Author(s):
Ponzina, Flavio, Simone Machetti, Marco Antonio Rios, Benoît Walter Denkinger, Alexandre Sébastien Julien Levisse, Giovanni Ansaloni, Miguel Peon Quiros, and David Atienza Alonso
Published in:
IEEE Micro - Special Issue on Artificial Intelligence at the Edge, 2022, ISSN 0272-1732
Publisher:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/mm.2022.3195617
Author(s):
Mukherjee, C., Poittevin, A., O'Connor, I., Larrieu, G., Maneux, C.
Published in:
Solid-State Electronics, 2021, ISSN 0038-1101
Publisher:
Pergamon Press Ltd.
DOI:
10.1016/j.sse.2021.108125
Author(s):
C. Mukherjee, H. Rezgui, Y. Wang, M. Deng, A. Kumar, J. Muller, G. Larrieu and C. Maneux
Published in:
IEEE TED Vol 70 n°12, Issue 11 oct, 2023, ISSN 0018-9383
Publisher:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/ted.2023.3321277
Author(s):
H. Rezgui, C. Mukherjee, Y. Wang, M. Deng, A. Kumar, J. Muller, G. Larrieu and C. Maneux
Published in:
IEEE TED Vol 70 n°12, Issue oct.-23, 2023, ISSN 0018-9383
Publisher:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/ted.2023.3321280
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