CORDIS proporciona enlaces a los documentos públicos y las publicaciones de los proyectos de los programas marco HORIZONTE.
Los enlaces a los documentos y las publicaciones de los proyectos del Séptimo Programa Marco, así como los enlaces a algunos tipos de resultados específicos, como conjuntos de datos y «software», se obtienen dinámicamente de OpenAIRE .
Resultado final
Fabrication of elementary VNWFET devices (JL and PC) - First version
Elementary VNWFET devices (JL and PC) - V2 (se abrirá en una nueva ventana)Fabrication of elementary VNWFET devices (JL and PC) - improved version
Technology impact and exploitation innovation - Third assessment
Thermal impedance and trap extraction - V1 (se abrirá en una nueva ventana)First report on the thermal impedance and trap extraction of VNWFETs devices fabricated in WP1
Plan for dissemination of the results - Y1 (se abrirá en una nueva ventana)Annual plan for dissemination of the results
Workshops and summer school's report (se abrirá en una nueva ventana)Report on workshops and summer school's
Plan for dissemination of the results - Y2 (se abrirá en una nueva ventana)Annual plan for dissemination of the results, year 2
Technology impact and exploitation innovation - Y1 (se abrirá en una nueva ventana)Technology impact and exploitation innovation First assessment
Pre-trained speech ASR/MT model and use-cases - V2 (se abrirá en una nueva ventana)Second version of pre-trained speech ASR/MT model and use-cases
Open source release: parameterizable simulator with application examples - V1 (se abrirá en una nueva ventana)First open source release: parameterizable simulator with application examples
Plan for dissemination of the results - Y3 (se abrirá en una nueva ventana)Annual plan for dissemination of the results - year 3
Scaled-down N2C2 design (se abrirá en una nueva ventana)Report on scaled-down N2C2 design
Library of optimized VNWFET-based logic cells (se abrirá en una nueva ventana)Pre-trained speech ASR/MT model and use-cases - V1 (se abrirá en una nueva ventana)
First version of pretrained speech ASRMT model and usecases
Architecture library, multi-objective trade-offs and calibrated thermal models - V1 (se abrirá en una nueva ventana)First version of architecture library, multi-objective trade-offs and calibrated thermal models
Technology impact and exploitation innovation - Y2 (se abrirá en una nueva ventana)Technology impact and exploitation innovation - Second assessment
Virtual scalable N2C2 design and Pareto-front data - V1 (se abrirá en una nueva ventana)Report on virtual scalable N2C2 design and Paretofront data V1
Co-optimized hardware/NN architecture for ASR/MT - V1 (se abrirá en una nueva ventana)First report on the co-optimized hardware/NN architecture for ASR/MT
Versatile and scalable 3D architectural interconnect framework (se abrirá en una nueva ventana)Report on the versatile and scalable 3D architectural interconnect framework
Project handbook (se abrirá en una nueva ventana)Handbook summarizing decisionmaking process and planned meetings quality process for deliverables deliverable template progress reports template
Parasitic element extraction - V1 (se abrirá en una nueva ventana)Report on parasitic element extraction
Project Website and social networks accounts for FVLLMONTI are visible online
Publicaciones
Autores:
Eggermann, G., Rios, M., Ansaloni, G., Nassif, S. and Atienza, D.
Publicado en:
In 2023 IFIP/IEEE 31st International Conference on Very Large-Scale Integration (VLSI-SoC) In 2023 IFIP/IEEE 31st International Conference on Very Large-Scale Integration (VLSI-SoC), 2023, ISBN 979-8-3503-2599-7
Editor:
IEEE
DOI:
10.1109/vlsi-soc57769.2023.10321838
Autores:
C. Maneux, C. Mukherjee, M. Deng, G. Larrieu, Y. Wang, Houssem Rezgui and B. Neckel Wesling
Publicado en:
243rd ECS Meeting, Boston, US, May 28th -June 2nd, 2023, Edición mai-23, 2023
Editor:
ECS
DOI:
10.1149/11101.0209ecst
Autores:
I. O'Connor, S. Mannaa, A. Bosio, B. Deveautour, D. Deleruyelle, T. Obukhova, C. Marchand, J. Trommer, C. Cakirlar, B. Neckel Wesling, T. Mikolajick, O. Baumgartner, M. Thesberg, D. Pirker, C. Lenz, Z. Stanojevic, M. Karner, G. Larrieu, S. Pelloquin, K. Moustakas, J. Muller, G. Ansaloni, A. Amirshahi, D. Atienza, J-L. Rouas, L. Ben Letaifa, G. Bordea, C. Brazier, Y. Wang, C. Mukherjee, M. Deng, M.
Publicado en:
In 27th Design, Automation and Test in Europe Conference (DATE 24), Multi-partner projects (MPP) papers, 2024
Editor:
CESI
Autores:
L. Réveil, C. Mukherjee, C. Maneux, M. Deng, F. Marc, A. Kumar, A. Lecestre, G. Larrieu, A. Poittevin, I. O'Connor, O. Baumgartner and D. Pirker
Publicado en:
VLSI-SOC, Edición 2022, 2022
Editor:
VLSI-SOC
Autores:
T. Mikolajick, G. Galderisi, S. Rai, M. Simon, R. Böckle, M. Sistani, C. Cakirlar, N. Bhattacharjee, T. Mauersberger, A. Heinzig, A. Kumar, W.M. Weber, J. Trommer.
Publicado en:
Solid-State Electronics, 2022
Editor:
Elsevier
DOI:
10.1016/j.sse.2022.108381
Autores:
C Cakirlar, G Galderisi, C Beyer, M Simon, T Mikolajick, J Trommer
Publicado en:
IEEE 22nd International Conference on Nanotechnology (IEEE NANO), 2022, ISBN 978-1-6654-5225-0
Editor:
IEEE
DOI:
10.1109/nano54668.2022.9928629
Autores:
Y. Wang, C. Mukherjee. H. Rezgui, M. Deng, C. Maneux, S. Mannaa, I. O’Connor, J. Müller, S. Pelloquin, G. Larrieu
Publicado en:
European Solid-State Device Research Conference (ESSDERC), Edición 2023, 2023
Editor:
IEEE
DOI:
10.1109/essderc59256.2023.10268560
Autores:
Thesberg, M., Schanovsky, F., Stanojevic, Z., Baumgartner, O. and Karner, M.
Publicado en:
International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Edición 2023, 2023, ISBN 978-4-86348-803-8
Editor:
IEEE
DOI:
10.23919/sispad57422.2023.10319645
Autores:
Rios, M., Ponzina, F., Ansaloni, G., Levisse, A. and Atienza, D.
Publicado en:
In Proceedings of the Great Lakes Symposium on VLSI 2022, Edición 2022, 2022, ISBN 9781450393225
Editor:
Association for Computing Machinery
DOI:
10.1145/3526241.3530351
Autores:
Ponzina, F., Ansaloni, G., Peón-Quirós, M. and Atienza, D.
Publicado en:
Micromachines, 2023
Editor:
MDPI
DOI:
10.3390/mi13071143
Autores:
Guilhem Larrieu, Jonas Müller, Sylvain Pelloquin, Abhishek Kumar, Konstantinos Moustakas, Pawel Michalowski, Aurelie Lecestre
Publicado en:
21st International Workshop on Junction Technology (IWJT), Edición 23 juin, 2023, ISBN 978-4-86348-807-6
Editor:
IEEE
DOI:
10.23919/iwjt59028.2023.10175172
Autores:
Baghersalimi, S., Amirshahi, A., Teijeiro, T., Aminifar, A. and Atienza, D.
Publicado en:
2023 IEEE 19th International Conference on Body Sensor Networks (BSN), 2023, ISBN 979-8-3503-3841-6
Editor:
IEEE
DOI:
10.1109/bsn58485.2023.10331334
Autores:
Ian O’Connor, Arnaud Poittevin, Sébastien Le Beux, Alberto Bosio, Zlatan Stanojevic, Oskar Baumgartner, C Mukherjee, C Maneux, J Trommer, T Mikolajick, G Larrieu
Publicado en:
Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EuroSOI-ULIS), 2021, Página(s) 1-4
Editor:
NA
Autores:
L. Ben Letaifa and J.-L. Rouas
Publicado en:
Algorithms Vol 16 n°9, 2023
Editor:
MDPI
DOI:
10.3390/a16090398
Autores:
Ferretti, Lorenzo, Giovanni Ansaloni, Renaud Marquis, Tomas Teijeiro, Philippe Ryvlin, David Atienza, and Laura Pozzi
Publicado en:
Design, Automation & Test in Europe Conference & Exhibition (DATE), 2022, Página(s) 1449-1454
Editor:
IEEE
Autores:
S. Mannaa, C. Marchand, D. Deleruyelle, B. Deveautour, I. O'Connor, A. Bosio
Publicado en:
Int. Conf. Nanotechnology (NANO), 2023
Editor:
IEEE
DOI:
10.1109/nano58406.2023.10231288
Autores:
B. Neckel Wesling, M. Deng, C. Mukherjee, A. Kumar, G. Larrieu, et al.
Publicado en:
8th Joint International EuroSOI Workshop and International Conference on Ultimate Integration on Silicon (EuroSOI−ULIS) 2022, May, Edición mai 22, 2022
Editor:
Elsevier
DOI:
10.1016/j.sse.2022.108359
Autores:
Medina Morillas, Rafael, Joshua Alexander Harrison Klein, Yasir Mahmood Qureshi, Marina Zapater Sancho, Giovanni Ansaloni, and David Atienza Alonso
Publicado en:
IEEE 13th Latin America Symposium on Circuits and System (LASCAS), 2022
Editor:
IEEE
Autores:
C. Maneux, C. Mukherjee, M. Deng, M. Dubourg, L. Reveil, G. Bordea, A. Lecestre, G. Larrieu, J. Trommer, E.T. Breyer, S. Slesazeck, T. Mikolajick, O. Baumgartner, M. Karner, D. Pirker, Z. Stanojevic, David Atienza, A. Levisse, G. Ansaloni, A. Poittevin, A. Bosio, D. Deleruyelle, C. Marchand, I. O'Connor
Publicado en:
IEEE IEDM, 2021
Editor:
IEEE
Autores:
Medina, R., Huang, D., Ansaloni, G., Zapater, M. and Atienza, D.
Publicado en:
2023 IFIP/IEEE 31st International Conference on Very Large Scale Integration (VLSI-SoC), 2023, ISBN 979-8-3503-2599-7
Editor:
IEEE
DOI:
10.1109/vlsi-soc57769.2023.10321912
Autores:
Leila Ben Letaifa, Jean-Luc Rouas.
Publicado en:
EUSIPCO 2022, 2022
Editor:
EUSIPCO
Autores:
C. Maneux, C. Mukherjee, M. Deng, B. Neckel Wesling, L. Reveil, Z. Stanojevic, O. baumgartner, A. Poittevin, I. O'Connor, G. Larrieu
Publicado en:
IEEE LAEDC, 2022
Editor:
NA
Autores:
A. Poittevin, I. O‘Connor, C. Marchand, A. Bosio, C. Maneux, C. Mukherjee, G. Larrieu, A. Kumar
Publicado en:
20th IEEE Interregional NEWCAS Conference (NEWCAS), 2022
Editor:
NA
DOI:
10.1109/newcas52662.2022.9842100
Autores:
T. Mauersberger, J. Trommer, G. Galderisi, M. Knaut, D. Pohl, A. Tahn, B. Rellinghaus, T. Mikolajick, A. Heinzig
Publicado en:
EMRS Fall Meeting, Warsaw, 2023, Edición No proceedings, talk only, 2023
Editor:
EMRS
Autores:
K. Moustakas, B. Neckel-Wesling, A. Lecestre, F. Mathieu, T. Mikolajick, J. Trommer, G. Larrieu, L. Cancellara, J.-D. Grillet
Publicado en:
EMRS Fall Meeting, Warsaw, 2023, Edición 23-oct., 2023
Editor:
EMRS
Autores:
R. Bishnoi, S. Diware, A. Gebregiorgis, S. Thomann, S. Mannaa, B. Deveautour, C. Marchand, A. Bosio, D. Deleruyelle, I. O'Connor, H. Amrouch, S. Hamdioui
Publicado en:
International Conference on Microelectronics (ICM), 2023
Editor:
IEEE
DOI:
10.1109/icm60448.2023.10378889
Autores:
Amirshahi A, Klein JA, Ansaloni G, Atienza D.
Publicado en:
InProceedings of the 28th Asia and South Pacific Design Automation Conference 2023, 2023, ISBN 978-1-4503-9783-4
Editor:
IEEE
Autores:
Medina R, Kein J, Ansaloni G, Zapater M, Abadal S, Alarcón E, Atienza D.
Publicado en:
In Proceedings of the 28th Asia and South Pacific Design Automation Conference 2023 Jan 16, 2023, ISBN 978-1-4503-9783-4
Editor:
IEEE
Autores:
B. Neckel Wesling, M. Deng, C. Mukherjee, T. Mikolajick, J. Trommer and C. Maneux
Publicado en:
IEEE International Conference on Microelectronic Test Structures (ICMTS), April 2024, Edinburgh, Scotland, Edición Avr 24, 2024
Editor:
IEEE
Autores:
Guilhem Larrieu, Houssem Rezgui, Abhishek Kumar, Jonas Müller, Sylvain Pelloquin, Yifan Wang, Marina Deng, Aurelie Lecestre, Cristell Maneux, Chhandak Mukherjee
Publicado en:
2023 Silicon Nanoelectronics Workshop (SNW), Kyoto, Japan, Edición juin-23, 2023, ISBN 978-4-86348-808-3
Editor:
IEEE
DOI:
10.23919/snw57900.2023.10183951
Autores:
Thesberg M, Schanovsky F, Stanojević Z, Baumgartner O, Karner M.
Publicado en:
ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC), 2023, ISBN 979-8-3503-0423-7
Editor:
IEEE
DOI:
10.1109/essderc59256.2023.10268518
Autores:
Lorenzo Ferretti; Giovanni Ansaloni; Renaud Marquis; Tomas Teijeiro; Philippe Ryvlin; David Atienza; Laura Pozzi
Publicado en:
2022 Design, Automation & Test in Europe Conference & Exhibition (DATE), Edición 1, 2022, Página(s) 1449-1454
Editor:
IEEE
DOI:
10.23919/date54114.2022.9774713
Autores:
L. Ben Letaifa and J.-L. Rouas
Publicado en:
21st IEEE International Conference on Machine Learning and Applications (ICMLA), Dec. 2022, Edición 2022, 2022
Editor:
IEEE
DOI:
10.1109/icmla55696.2022.00149
Autores:
Ponzina F, Rios M, Levisse A, Ansaloni G, Atienza D.
Publicado en:
ACM Transactions on Embedded Computing Systems, Edición ACM Transactions on Embedded Computing SystemsVolume 22Edición 5sArticle No.: 121, 2023, Página(s) pp 1–23, ISSN 1539-9087
Editor:
Association for Computing Machinary, Inc.
DOI:
10.1145/3609387
Autores:
M. Thesberg, M. N. K. Alam, B. Truijen, B. Kaczer, P. J. Roussel, Z. Stanojević, O. Baumgartner, F. Schanovsky, M. Karner, H. Kosina
Publicado en:
IEEE TED Vol 69, n°6, 2022, 2022, ISSN 0018-9383
Editor:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/ted.2022.3167942
Autores:
Tom Mauersberger; Jens Trommer; Saurabh Sharma; Martin Knaut; Darius Pohl; Bernd Rellinghaus; Thomas Mikolajick; Andre Heinzig
Publicado en:
Semiconductor Science and Technology, Edición 1, 2021, ISSN 0268-1242
Editor:
Institute of Physics Publishing
DOI:
10.1088/1361-6641/ac1827
Autores:
Ponzina, Flavio, Simone Machetti, Marco Antonio Rios, Benoît Walter Denkinger, Alexandre Sébastien Julien Levisse, Giovanni Ansaloni, Miguel Peon Quiros, and David Atienza Alonso
Publicado en:
IEEE Micro - Special Edición on Artificial Intelligence at the Edge, 2022, ISSN 0272-1732
Editor:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/mm.2022.3195617
Autores:
Mukherjee, C., Poittevin, A., O'Connor, I., Larrieu, G., Maneux, C.
Publicado en:
Solid-State Electronics, 2021, ISSN 0038-1101
Editor:
Pergamon Press Ltd.
DOI:
10.1016/j.sse.2021.108125
Autores:
Mischa Thesberg, Tetiana Obukhova, Damien Deleruyelle, Jens Trommer, Thomas Mikolajick, Oskar Baumgartner, Franz Schanovsky, Zlatan Stanojević, Markus Karner
Publicado en:
IEEE Transactions on Electron Devices, Edición 71, 2024, Página(s) 6686-6690, ISSN 0018-9383
Editor:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/ted.2024.3459878
Autores:
C. Cakirlar, M. Simon, G. Galderisi, I. O’Connor, T. Mikolajick, J. Trommer
Publicado en:
Materials Today Electronics, Edición Volume 4, June 2023, 100040, 2023, ISSN 2772-9494
Editor:
Elsevier
DOI:
10.1016/j.mtelec.2023.100040
Autores:
C. Mukherjee, H. Rezgui, Y. Wang, M. Deng, A. Kumar, J. Muller, G. Larrieu and C. Maneux
Publicado en:
IEEE TED Vol 70 n°12, Edición 11 oct, 2023, ISSN 0018-9383
Editor:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/ted.2023.3321277
Autores:
Rios, M., Ponzina, F., Levisse, A.S.J., Ansaloni, G., Alonso, D.A., Amirshahi, A., Klein, J.A.H., Orlandi, M., Zanghieri, M., Schiavone, D. and Donati, E.,
Publicado en:
IEEE Transactions on Emerging Topics in Computing ( Volume: 11, Edición: 2, 01 April-June 2023), 2023, ISSN 2168-6750
Editor:
IEEE Computer Society
DOI:
10.1109/tetc.2023.3237914
Autores:
R. Bishnoi, S. Diware, A. Gebregiorgis, S. Thomann, S. Mannaa, B. Deveautour, C. Marchand, A. Bosio, D. Deleruyelle, I. O'Connor, H. Amrouch, S. Hamdioui
Publicado en:
J. Exploratory Solid-State Computational Devices and Circuits, 2023, ISSN 2329-9231
Editor:
IEEE
DOI:
10.1109/jxcdc.2023.3309502
Autores:
H. Rezgui, C. Mukherjee, Y. Wang, M. Deng, A. Kumar, J. Muller, G. Larrieu and C. Maneux
Publicado en:
IEEE TED Vol 70 n°12, Edición oct.-23, 2023, ISSN 0018-9383
Editor:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/ted.2023.3321280
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