Descripción del proyecto
Materiales de interconexión electrónica nuevos y mejorados
La transición de los combustibles fósiles a la electricidad como fuente de energía es fundamental para descarbonizar la economía. Con todo, la electrificación rápida de múltiples sectores requiere una mayor fiabilidad en la electrónica y un método para lograrlo consiste en el uso de nuevos materiales de interconexión electrónica. En el proyecto SuperSolders, financiado con fondos europeos, se diseñarán materiales avanzados de interconexión electrónica. Estos materiales ayudarán a superar los cuellos de botella actuales al ofrecer una soldadura de alta fiabilidad y baja temperatura de proceso, que aumentan la eficacia energética. Además, se pueden integrar de forma tridimensional en la electrónica de consumo. Otras características esenciales incluyen la capacidad de soportar entornos más hostiles y nuevos materiales de fijación de la oblea que permiten el uso de semiconductores de potencia de banda prohibida ancha.
Objetivo
The accelerated electrification in different sectors raises higher requirements on the reliability of electronics, which stimulates the demand for novel electronic interconnection materials. This proposed training-through-research aims to design new electronic interconnection materials to tackle three emerging bottlenecks in electronics manufacturing, which are i) low process-temperature solders to reduce energy consumption and facilitate 3D integration in consumer electronics, ii) high-reliability solders for harsh environments in the automotive and aerospace sectors, and iii) novel die-attach materials to enable the use of wide-bandgap power semiconductors. Advanced experiments and simulation techniques will be used to design novel solder alloys, study solidification microstructures, and evaluate the reliability and understand the deformation/failure mechanisms of solder joints. Comprehensive understandings on composition-processing-microstructure-property relationships will be built-up to drive the development of the three novel electronic interconnection materials in this project: i) novel multi-compositional low-temperature solders with refined microstructure and excellent ductility and strength superior to conventional Sn-Bi solders, ii) advanced high-reliability solders strengthened by mechanisms from microstructures of different scales including not only solid solutions and secondary phases but also grain structures and orientations that have not been incorporated by current solders, and iii) novel transient liquid phase bonding (TLPB) materials that can significantly reduce the processing time and produce refined high entropy intermetallic bonds with mechanical properties overmatching current TLPBs. This inter-/multi-disciplinary project promises a tremendous positive impact on the European consumer electronics, power electronics, and automotive and aerospace sectors, contributing to the European excellence, competitiveness, and quality of manufacturing.
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MSCA-IF - Marie Skłodowska-Curie Individual Fellowships (IF)Coordinador
SW7 2AZ LONDON
Reino Unido