How to minimize the ecological footprint for functional electronics?

Project Information

ECOTRON

Grant agreement ID: 101070167

DOI

10.3030/101070167

EC signature date 15 June 2022

Start date 1 September 2022

End date 31 August 2026

Funded under

• Digital, Industry and Space

Total cost

€ 4 999 000,25

EU contribution

€ 4 999 000,25

Coordinated by

NEDERLANDSE ORGANISATIE VOOR TOEGEPAST NATUURWETENSCHAPPELIJK ONDERZOEK TNO
Netherlands

CORDIS provides links to public deliverables and publications of HORIZON projects.

Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .

Deliverables

Websites, patent fillings, videos etc. (1)

Initial communication kit (website, factsheet, leaflet, etc.)

Webpage description of ECOTRON webpage prepared in the first months of the project Media kit including project promotional materials

Documents, reports (2)

Eco-design protocol for newly developed technologies to give sustainability direction to the novel technologies

This report will provides an eco-design protocol to create a standardized process for the evaluation of the circularity of printed electronics (Task 6.2-6.3). In total three iterations will be done for each technological advancement and for each iteration the protocol is executed

Sustainability evaluation procedure for compostable electronics

The circularity evaluation protocol is transferred into a standardisation process to evaluate compostability of printed electronics. A procedure to quantitatively measure the compostability of these products is designed using existing ISO, & OECD standards. All these tests will be conducted both on substrate level and product level

Publications

Peer reviewed articles (6)

Silk Sericin-Based Electrospun Nanofibers Forming Films for Cosmetic Applications: Preparation, Characterization, and Efficacy Evaluation

Author(s): Ivana Dragojlov, Rony Aad, Diletta Ami, Marco Mangiagalli, Antonino Natalello, Simone Vesentini
Published in: Molecules, Issue 30, 2025, ISSN 1420-3049
Publisher: MDPI AG
DOI: 10.3390/MOLECULES30030715

Electroconductive Bionanocomposites from Black Soldier Fly Proteins for Green Flexible Electronics

Author(s): Edoardo Testa, Vincenzina Barbera, Elisa Fasoli, Ulrich Giese, Maria Rosaria Belviso, Pasqua Rossini, Daniele Bruno, Gianluca Tettamanti, Marco Orlando, Gianluca Molla, Morena Casartelli, Maurizio Galimberti
Published in: ACS Sustainable Chemistry & Engineering, Issue 13, 2025, ISSN 2168-0485
Publisher: American Chemical Society (ACS)
DOI: 10.1021/ACSSUSCHEMENG.4C08242

Miniaturized Micrometer-Level Copper Wiring and Electrodes Based on Reverse-Offset Printing for Flexible Circuits

Author(s): Kim Eiroma, Asko Sneck, Olli Halonen, Tuomas Happonen, Henrik Sandberg, Jaakko Leppäniemi
Published in: ACS Applied Electronic Materials, 2025, ISSN 2637-6113
Publisher: American Chemical Society (ACS)
DOI: 10.1021/ACSAELM.5C00230

Advanced Manufacturing of Flexible Electronic Circuits by Transfer Foil Method

Author(s): Tuomas Happonen, Mikko Hietala, Arttu Huttunen, Terho Kololuoma, Markus Tuomikoski,
Published in: LEPS 2023 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings, 2023, ISSN 2832-8256
Publisher: IEEE
DOI: 10.1109/FLEPS57599.2023.10220368

Sericin Protein: Structure, Properties, and Applications

Author(s): Rony Aad; Ivana Dragojlov; Simone Vesentini
Published in: Journal of Functional Biomaterials, 2024, ISSN 2079-4983
Publisher: MDPI
DOI: 10.3390/JFB15110322

Investigating resource productivity: the ecological potential of printed electronics as alternative to PCB

Author(s): Marieke van Diemen, Jan Brusselaers, Corné Rentrop
Published in: Environmental Research Communications, Issue 7, 2025, ISSN 2515-7620
Publisher: IOP Publishing
DOI: 10.1088/2515-7620/AD9F0F