How to minimize the ecological footprint for functional electronics?

Projektinformationen

ECOTRON

ID Finanzhilfevereinbarung: 101070167

DOI

10.3030/101070167

EK-Unterschriftsdatum 15 Juni 2022

Startdatum 1 September 2022

Enddatum 31 August 2026

Finanziert unter

• Digital, Industry and Space

Gesamtkosten

€ 4 999 000,25

EU-Beitrag

€ 4 999 000,25

Koordiniert durch

NEDERLANDSE ORGANISATIE VOOR TOEGEPAST NATUURWETENSCHAPPELIJK ONDERZOEK TNO
Netherlands

CORDIS bietet Links zu öffentlichen Ergebnissen und Veröffentlichungen von HORIZONT-Projekten.

Links zu Ergebnissen und Veröffentlichungen von RP7-Projekten sowie Links zu einigen Typen spezifischer Ergebnisse wie Datensätzen und Software werden dynamisch von OpenAIRE abgerufen.

Leistungen

Websites, patent fillings, videos etc. (1)

Initial communication kit (website, factsheet, leaflet, etc.)

Webpage description of ECOTRON webpage prepared in the first months of the project Media kit including project promotional materials

Documents, reports (2)

Eco-design protocol for newly developed technologies to give sustainability direction to the novel technologies

This report will provides an eco-design protocol to create a standardized process for the evaluation of the circularity of printed electronics (Task 6.2-6.3). In total three iterations will be done for each technological advancement and for each iteration the protocol is executed

Sustainability evaluation procedure for compostable electronics

The circularity evaluation protocol is transferred into a standardisation process to evaluate compostability of printed electronics. A procedure to quantitatively measure the compostability of these products is designed using existing ISO, & OECD standards. All these tests will be conducted both on substrate level and product level

Veröffentlichungen

Peer reviewed articles (6)

Silk Sericin-Based Electrospun Nanofibers Forming Films for Cosmetic Applications: Preparation, Characterization, and Efficacy Evaluation

Autoren: Ivana Dragojlov, Rony Aad, Diletta Ami, Marco Mangiagalli, Antonino Natalello, Simone Vesentini
Veröffentlicht in: Molecules, Ausgabe 30, 2025, ISSN 1420-3049
Herausgeber: MDPI AG
DOI: 10.3390/MOLECULES30030715

Electroconductive Bionanocomposites from Black Soldier Fly Proteins for Green Flexible Electronics

Autoren: Edoardo Testa, Vincenzina Barbera, Elisa Fasoli, Ulrich Giese, Maria Rosaria Belviso, Pasqua Rossini, Daniele Bruno, Gianluca Tettamanti, Marco Orlando, Gianluca Molla, Morena Casartelli, Maurizio Galimberti
Veröffentlicht in: ACS Sustainable Chemistry & Engineering, Ausgabe 13, 2025, ISSN 2168-0485
Herausgeber: American Chemical Society (ACS)
DOI: 10.1021/ACSSUSCHEMENG.4C08242

Miniaturized Micrometer-Level Copper Wiring and Electrodes Based on Reverse-Offset Printing for Flexible Circuits

Autoren: Kim Eiroma, Asko Sneck, Olli Halonen, Tuomas Happonen, Henrik Sandberg, Jaakko Leppäniemi
Veröffentlicht in: ACS Applied Electronic Materials, 2025, ISSN 2637-6113
Herausgeber: American Chemical Society (ACS)
DOI: 10.1021/ACSAELM.5C00230

Advanced Manufacturing of Flexible Electronic Circuits by Transfer Foil Method

Autoren: Tuomas Happonen, Mikko Hietala, Arttu Huttunen, Terho Kololuoma, Markus Tuomikoski,
Veröffentlicht in: LEPS 2023 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings, 2023, ISSN 2832-8256
Herausgeber: IEEE
DOI: 10.1109/FLEPS57599.2023.10220368

Sericin Protein: Structure, Properties, and Applications

Autoren: Rony Aad; Ivana Dragojlov; Simone Vesentini
Veröffentlicht in: Journal of Functional Biomaterials, 2024, ISSN 2079-4983
Herausgeber: MDPI
DOI: 10.3390/JFB15110322

Investigating resource productivity: the ecological potential of printed electronics as alternative to PCB

Autoren: Marieke van Diemen, Jan Brusselaers, Corné Rentrop
Veröffentlicht in: Environmental Research Communications, Ausgabe 7, 2025, ISSN 2515-7620
Herausgeber: IOP Publishing
DOI: 10.1088/2515-7620/AD9F0F