How to minimize the ecological footprint for functional electronics?

Información del proyecto

ECOTRON

Identificador del acuerdo de subvención: 101070167

DOI

10.3030/101070167

Fecha de la firma de la CE 15 Junio 2022

Fecha de inicio 1 Septiembre 2022

Fecha de finalización 31 Agosto 2026

Financiado con arreglo a

• Digital, Industry and Space

Coste total

€ 4 999 000,25

Aportación de la UE

€ 4 999 000,25

Coordinado por

NEDERLANDSE ORGANISATIE VOOR TOEGEPAST NATUURWETENSCHAPPELIJK ONDERZOEK TNO
Netherlands

CORDIS proporciona enlaces a los documentos públicos y las publicaciones de los proyectos de los programas marco HORIZONTE.

Los enlaces a los documentos y las publicaciones de los proyectos del Séptimo Programa Marco, así como los enlaces a algunos tipos de resultados específicos, como conjuntos de datos y «software», se obtienen dinámicamente de OpenAIRE .

Resultado final

Websites, patent fillings, videos etc. (1)

Initial communication kit (website, factsheet, leaflet, etc.)

Webpage description of ECOTRON webpage prepared in the first months of the project Media kit including project promotional materials

Documents, reports (2)

Eco-design protocol for newly developed technologies to give sustainability direction to the novel technologies

This report will provides an eco-design protocol to create a standardized process for the evaluation of the circularity of printed electronics (Task 6.2-6.3). In total three iterations will be done for each technological advancement and for each iteration the protocol is executed

Sustainability evaluation procedure for compostable electronics

The circularity evaluation protocol is transferred into a standardisation process to evaluate compostability of printed electronics. A procedure to quantitatively measure the compostability of these products is designed using existing ISO, & OECD standards. All these tests will be conducted both on substrate level and product level

Publicaciones

Peer reviewed articles (6)

Silk Sericin-Based Electrospun Nanofibers Forming Films for Cosmetic Applications: Preparation, Characterization, and Efficacy Evaluation

Autores: Ivana Dragojlov, Rony Aad, Diletta Ami, Marco Mangiagalli, Antonino Natalello, Simone Vesentini
Publicado en: Molecules, Edición 30, 2025, ISSN 1420-3049
Editor: MDPI AG
DOI: 10.3390/MOLECULES30030715

Electroconductive Bionanocomposites from Black Soldier Fly Proteins for Green Flexible Electronics

Autores: Edoardo Testa, Vincenzina Barbera, Elisa Fasoli, Ulrich Giese, Maria Rosaria Belviso, Pasqua Rossini, Daniele Bruno, Gianluca Tettamanti, Marco Orlando, Gianluca Molla, Morena Casartelli, Maurizio Galimberti
Publicado en: ACS Sustainable Chemistry & Engineering, Edición 13, 2025, ISSN 2168-0485
Editor: American Chemical Society (ACS)
DOI: 10.1021/ACSSUSCHEMENG.4C08242

Miniaturized Micrometer-Level Copper Wiring and Electrodes Based on Reverse-Offset Printing for Flexible Circuits

Autores: Kim Eiroma, Asko Sneck, Olli Halonen, Tuomas Happonen, Henrik Sandberg, Jaakko Leppäniemi
Publicado en: ACS Applied Electronic Materials, 2025, ISSN 2637-6113
Editor: American Chemical Society (ACS)
DOI: 10.1021/ACSAELM.5C00230

Advanced Manufacturing of Flexible Electronic Circuits by Transfer Foil Method

Autores: Tuomas Happonen, Mikko Hietala, Arttu Huttunen, Terho Kololuoma, Markus Tuomikoski,
Publicado en: LEPS 2023 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings, 2023, ISSN 2832-8256
Editor: IEEE
DOI: 10.1109/FLEPS57599.2023.10220368

Sericin Protein: Structure, Properties, and Applications

Autores: Rony Aad; Ivana Dragojlov; Simone Vesentini
Publicado en: Journal of Functional Biomaterials, 2024, ISSN 2079-4983
Editor: MDPI
DOI: 10.3390/JFB15110322

Investigating resource productivity: the ecological potential of printed electronics as alternative to PCB

Autores: Marieke van Diemen, Jan Brusselaers, Corné Rentrop
Publicado en: Environmental Research Communications, Edición 7, 2025, ISSN 2515-7620
Editor: IOP Publishing
DOI: 10.1088/2515-7620/AD9F0F