How to minimize the ecological footprint for functional electronics?

Informazioni relative al progetto

ECOTRON

ID dell’accordo di sovvenzione: 101070167

DOI

10.3030/101070167

Data della firma CE 15 Giugno 2022

Data di avvio 1 Settembre 2022

Data di completamento 31 Agosto 2026

Finanziato da

• Digital, Industry and Space

Costo totale

€ 4 999 000,25

Contributo UE

€ 4 999 000,25

Coordinato da

NEDERLANDSE ORGANISATIE VOOR TOEGEPAST NATUURWETENSCHAPPELIJK ONDERZOEK TNO
Netherlands

CORDIS fornisce collegamenti ai risultati finali pubblici e alle pubblicazioni dei progetti ORIZZONTE.

I link ai risultati e alle pubblicazioni dei progetti del 7° PQ, così come i link ad alcuni tipi di risultati specifici come dataset e software, sono recuperati dinamicamente da .OpenAIRE .

Risultati finali

Websites, patent fillings, videos etc. (1)

Initial communication kit (website, factsheet, leaflet, etc.)

Webpage description of ECOTRON webpage prepared in the first months of the project Media kit including project promotional materials

Documents, reports (2)

Eco-design protocol for newly developed technologies to give sustainability direction to the novel technologies

This report will provides an eco-design protocol to create a standardized process for the evaluation of the circularity of printed electronics (Task 6.2-6.3). In total three iterations will be done for each technological advancement and for each iteration the protocol is executed

Sustainability evaluation procedure for compostable electronics

The circularity evaluation protocol is transferred into a standardisation process to evaluate compostability of printed electronics. A procedure to quantitatively measure the compostability of these products is designed using existing ISO, & OECD standards. All these tests will be conducted both on substrate level and product level

Pubblicazioni

Peer reviewed articles (6)

Silk Sericin-Based Electrospun Nanofibers Forming Films for Cosmetic Applications: Preparation, Characterization, and Efficacy Evaluation

Autori: Ivana Dragojlov, Rony Aad, Diletta Ami, Marco Mangiagalli, Antonino Natalello, Simone Vesentini
Pubblicato in: Molecules, Numero 30, 2025, ISSN 1420-3049
Editore: MDPI AG
DOI: 10.3390/MOLECULES30030715

Electroconductive Bionanocomposites from Black Soldier Fly Proteins for Green Flexible Electronics

Autori: Edoardo Testa, Vincenzina Barbera, Elisa Fasoli, Ulrich Giese, Maria Rosaria Belviso, Pasqua Rossini, Daniele Bruno, Gianluca Tettamanti, Marco Orlando, Gianluca Molla, Morena Casartelli, Maurizio Galimberti
Pubblicato in: ACS Sustainable Chemistry & Engineering, Numero 13, 2025, ISSN 2168-0485
Editore: American Chemical Society (ACS)
DOI: 10.1021/ACSSUSCHEMENG.4C08242

Miniaturized Micrometer-Level Copper Wiring and Electrodes Based on Reverse-Offset Printing for Flexible Circuits

Autori: Kim Eiroma, Asko Sneck, Olli Halonen, Tuomas Happonen, Henrik Sandberg, Jaakko Leppäniemi
Pubblicato in: ACS Applied Electronic Materials, 2025, ISSN 2637-6113
Editore: American Chemical Society (ACS)
DOI: 10.1021/ACSAELM.5C00230

Advanced Manufacturing of Flexible Electronic Circuits by Transfer Foil Method

Autori: Tuomas Happonen, Mikko Hietala, Arttu Huttunen, Terho Kololuoma, Markus Tuomikoski,
Pubblicato in: LEPS 2023 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings, 2023, ISSN 2832-8256
Editore: IEEE
DOI: 10.1109/FLEPS57599.2023.10220368

Sericin Protein: Structure, Properties, and Applications

Autori: Rony Aad; Ivana Dragojlov; Simone Vesentini
Pubblicato in: Journal of Functional Biomaterials, 2024, ISSN 2079-4983
Editore: MDPI
DOI: 10.3390/JFB15110322

Investigating resource productivity: the ecological potential of printed electronics as alternative to PCB

Autori: Marieke van Diemen, Jan Brusselaers, Corné Rentrop
Pubblicato in: Environmental Research Communications, Numero 7, 2025, ISSN 2515-7620
Editore: IOP Publishing
DOI: 10.1088/2515-7620/AD9F0F