Descrizione del progetto
Interruttori ottici più veloci per reti migliori
Alcuni nuovi interruttori ottici possono velocizzare la colonna portante delle nostre reti di dati. Il progetto PUNCH, finanziato dall’UE, svilupperà una nuova soluzione per la commutazione ottica che soddisfi diversi requisiti industriali, tra cui comunicazioni affidabili e a bassa latenza con qualità del servizio garantita, minore congestione della rete (e perdita o ritardo di dati), minore consumo energetico e costi ridotti delle interfacce di trasmissione. A tal fine, PUNCH svilupperà nuovi componenti fotonici e l’elettronica di interfaccia corrispondente, istituirà processi di integrazione scalabile e di packaging fotonico e produrrà diversi prototipi che saranno dimostrati e convalidati in banchi di prova per 5G industriale e centri di elaborazione dati.
Obiettivo
PUNCH offers a solution for time-deterministic and time-sensitive networks by developing a new optical switching paradigm which (I) breaks the trade-off between flexibility (ultra-dynamic reconfigurability) and determinism (guaranteed latency and jitter) by offering an all-to-all reconfigurable interconnect; (II) reduces congestion by activating bandwidth steering so that additional capacity can be allocated between hot nodes in the network; (III) provides unparalleled dynamics and bandwidth efficiency by further enabling multiplexing in the time domain with fast reconfigurable capability. A 2×2×8Lambda wavelength selective switching element will be scaled to a fully non-blocking 8x8x8Lambda and 16x16x8Lambda reconfigurable optical switch fabric. The development of a III-V foundry process for micro-transfer-printing-compatible semiconductor optical amplifiers enables loss-less optical switching on a silicon photonics platform. Custom configuration electronic ICs to actuate, control, and power-monitor a scaled switch fabric will be densely integrated with the photonic ICs into a heterogeneous fanout wafer-level package, processed on a 200mm reconstructed wafer platform. In addition, the optical interfacing to the photonic ICs will be accomplished using an optical redistribution layer, providing an optical fanout on high-density organic substrates, and allowing for a scalable optical fiber packaging solution. The novel integration and packaging processes will be applied for manufacturing 1.6 Tbit/s optical transceivers providing the interface between optical switches and electronic resources (compute, memory, and storage). The optical switch and transceiver prototypes will be demonstrated in a 5G RAN Transport Network, for TSN Fronthaul applications and for memory disaggregation in data centers.
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Invito a presentare proposte
HORIZON-CL4-2021-DIGITAL-EMERGING-01
Vedi altri progetti per questo bandoMeccanismo di finanziamento
HORIZON-IA - HORIZON Innovation ActionsCoordinatore
3001 Leuven
Belgio