MIcroelectronics RELiability driven by Artificial Intelligence

Project Information

MIRELAI

Grant agreement ID: 101072491

DOI

10.3030/101072491

EC signature date 14 July 2022

Start date 1 October 2022

End date 28 February 2027

Funded under

• Marie Skłodowska-Curie Actions (MSCA)

Total cost

No data

EU contribution

€ 3 075 944,40

Coordinated by

POLYMER COMPETENCE CENTER LEOBEN GMBH
Austria

CORDIS provides links to public deliverables and publications of HORIZON projects.

Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .

Deliverables

Other (2)

Second annual network meeting

Second annual network meeting hosted by PCCL

First annual network meeting

First annual network meeting hosted by TU DELFT

Documents, reports (3)

Computationally efficient submodels
Definition of critical weak links and PoF literature review
Implementation strategy for weak link physics of degradation

Websites, patent fillings, videos etc. (1)

MIRELAI project website

Publications

Conference proceedings (4)

Literature Review: Global Criticality Assessment Based on Feature Surrogates at the PCBA Levels

Author(s): Qiulin Yu, Vikram G. Kamble, Dieter P. Gruber, Peter F. Fuchs, Karl Fendt, Thomas Krivec
Published in: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Issue 209, 2024, ISSN 2833-8596
Publisher: IEEE
DOI: 10.1109/EuroSimE60745.2024.10491544

Warpage Optimization of Package Substrates Using Metamodels - A Review

Author(s): Fredy John Porathur, Vikram G Kamble, Eduard Stadler, Fabian Huber, Dieter P. Gruber, Peter Filipp Fuchs
Published in: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024, ISSN 2833-8596
Publisher: IEEE
DOI: 10.1109/EuroSimE60745.2024.10491528

A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies

Author(s): Vikram G Kamble, Dhaval Rasheshkumar Patel, Christian Schipfer, Andreas Thalhamer, Julia Zuendel, Thomas Krivec, Thomas Antretter, Peter Filipp Fuchs
Published in: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024, ISSN 2833-8596
Publisher: IEEE
DOI: 10.1109/EuroSimE60745.2024.10491487

Enhancing Defect Detection Using Lock In Thermography

Author(s): Doaa Mohamed, Daniel May, Kaushal Arun Pareek, Mohamad Abo Ras, Bernhard Wunderle
Published in: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024
Publisher: IEEE
DOI: 10.1109/EuroSimE60745.2024.10491470