MIcroelectronics RELiability driven by Artificial Intelligence

Informazioni relative al progetto

MIRELAI

ID dell’accordo di sovvenzione: 101072491

DOI

10.3030/101072491

Data della firma CE 14 Luglio 2022

Data di avvio 1 Ottobre 2022

Data di completamento 28 Febbraio 2027

Finanziato da

• Marie Skłodowska-Curie Actions (MSCA)

Costo totale

Nessun dato

Contributo UE

€ 3 075 944,40

Coordinato da

POLYMER COMPETENCE CENTER LEOBEN GMBH
Austria

CORDIS fornisce collegamenti ai risultati finali pubblici e alle pubblicazioni dei progetti ORIZZONTE.

I link ai risultati e alle pubblicazioni dei progetti del 7° PQ, così come i link ad alcuni tipi di risultati specifici come dataset e software, sono recuperati dinamicamente da .OpenAIRE .

Risultati finali

Other (2)

Second annual network meeting

Second annual network meeting hosted by PCCL

First annual network meeting

First annual network meeting hosted by TU DELFT

Documents, reports (3)

Computationally efficient submodels
Definition of critical weak links and PoF literature review
Implementation strategy for weak link physics of degradation

Websites, patent fillings, videos etc. (1)

MIRELAI project website

Pubblicazioni

Conference proceedings (4)

Literature Review: Global Criticality Assessment Based on Feature Surrogates at the PCBA Levels

Autori: Qiulin Yu, Vikram G. Kamble, Dieter P. Gruber, Peter F. Fuchs, Karl Fendt, Thomas Krivec
Pubblicato in: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Numero 209, 2024, ISSN 2833-8596
Editore: IEEE
DOI: 10.1109/EuroSimE60745.2024.10491544

Warpage Optimization of Package Substrates Using Metamodels - A Review

Autori: Fredy John Porathur, Vikram G Kamble, Eduard Stadler, Fabian Huber, Dieter P. Gruber, Peter Filipp Fuchs
Pubblicato in: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024, ISSN 2833-8596
Editore: IEEE
DOI: 10.1109/EuroSimE60745.2024.10491528

A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies

Autori: Vikram G Kamble, Dhaval Rasheshkumar Patel, Christian Schipfer, Andreas Thalhamer, Julia Zuendel, Thomas Krivec, Thomas Antretter, Peter Filipp Fuchs
Pubblicato in: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024, ISSN 2833-8596
Editore: IEEE
DOI: 10.1109/EuroSimE60745.2024.10491487

Enhancing Defect Detection Using Lock In Thermography

Autori: Doaa Mohamed, Daniel May, Kaushal Arun Pareek, Mohamad Abo Ras, Bernhard Wunderle
Pubblicato in: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024
Editore: IEEE
DOI: 10.1109/EuroSimE60745.2024.10491470