Reliable Powerdown for Industrial Drives

Project Information

R-PODID

Grant agreement ID: 101112338

DOI

10.3030/101112338

EC signature date 12 May 2023

Start date 1 September 2023

End date 31 August 2026

Funded under

• Digital, Industry and Space

Total cost

€ 23 440 004,16

EU contribution

€ 7 183 297,85

Coordinated by

ALMA MATER STUDIORUM - UNIVERSITA DI BOLOGNA
Italy

CORDIS provides links to public deliverables and publications of HORIZON projects.

Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .

Deliverables

Websites, patent fillings, videos etc. (2)

D5.1: Communication channels and project website - Project website, and communication channels (LinkedIn, Twitter, YouTube)

Deliverable 5.1 - DEC – PU – M3 (Owner: TGL) Communication channels and project website - Project website, and communication channels (LinkedIn, Twitter, YouTube) (linked to T5.1, T5.2)

D5.3: Project newsletter No 1 - Report on recent news and activities from the project, the first year

Deliverable 5.3 - DEC – PU – M12 (Owner: TGL) Project newsletter No. 1 - Report on recent news and activities from the project, the first year (linked to T5.1, T5.2)

Publications

Conference proceedings (4)

Thermal Modeling of SiC Power Module: A CFD-Based Approach for Junction-to-Fluid Resistance Estimate

Author(s): Jacopo Ferretti; Lorenzo Colombini; Mariano Nerone; Igor Valic; Filippo Ferrarese; Giacomo Piero Schiapparelli
Published in: 2025
Publisher: VDE
DOI: 10.30420/566541305

Integrated Hall-Effect Broadband Current Sensor for SiC Traction Inverter

Author(s): M. Mengozzi; G. P. Gibiino ;J. Ferretti ;M. Nerone ;I. Valic;F. Ferrarese;S. F. Syeda;M. Crescentini;P. A. Traverso
Published in: 2025
Publisher: IEEE

Intelligent Electrical Assessment of Silicon and Silicon Carbide Wafers for Power Applications in Automotive Field

Author(s): F. Rundo et al
Published in: 2024
Publisher: IEEE

Influence of Transfer Molding Process on the Reliability of High Mass Epoxy Mold Compound Molded Package

Author(s): Dong Hu, Niek van Haare, Albert van Driel, Shatavisha Biswas, Sten Vollebregt, Sebastiaan Kersjes
Published in: PCIM 2025, 2025
Publisher: VDE VERLAG GMBH
DOI: 10.30420/566541156

Peer reviewed articles (2)

HTRB effects on threshold instability of 4H-SiC PowerMOSFET with carrots defects

Author(s): L. Anoldo, G. Tosto, Z. Dahrouch, S. Bevilacqua, E. Schroer, S. Patanè, A. Russo
Published in: Microelectronics Reliability, Issue 170, 2025, ISSN 0026-2714
Publisher: Elsevier BV
DOI: 10.1016/J.MICROREL.2025.115781

Measurement-based analysis of packaged X-Hall current sensors for automotive applications

Author(s): Mattia Mengozzi, Sana Fatima Syeda, Jacopo Ferretti, Gian Piero Gibiino, Marco Crescentini, Pier Andrea Traverso
Published in: Measurement, 2025, ISSN 0263-2241
Publisher: Elsevier BV
DOI: 10.1016/J.MEASUREMENT.2025.119559