Reliable Powerdown for Industrial Drives

Información del proyecto

R-PODID

Identificador del acuerdo de subvención: 101112338

DOI

10.3030/101112338

Fecha de la firma de la CE 12 Mayo 2023

Fecha de inicio 1 Septiembre 2023

Fecha de finalización 30 Abril 2027

Financiado con arreglo a

• Digital, Industry and Space

Coste total

€ 23 526 372,59

Aportación de la UE

€ 7 165 011,55

Coordinado por

ALMA MATER STUDIORUM - UNIVERSITA DI BOLOGNA
Italy

CORDIS proporciona enlaces a los documentos públicos y las publicaciones de los proyectos de los programas marco HORIZONTE.

Los enlaces a los documentos y las publicaciones de los proyectos del Séptimo Programa Marco, así como los enlaces a algunos tipos de resultados específicos, como conjuntos de datos y «software», se obtienen dinámicamente de OpenAIRE .

Resultado final

Websites, patent fillings, videos etc. (3)

D5.1: Communication channels and project website - Project website, and communication channels (LinkedIn, Twitter, YouTube)

Deliverable 5.1 - DEC – PU – M3 (Owner: TGL) Communication channels and project website - Project website, and communication channels (LinkedIn, Twitter, YouTube) (linked to T5.1, T5.2)

D5.4: Project newsletter No. 2 - Report on recent news and activities from the project, the second year

Deliverable 5.4 - DEC – PU – M22 (Owner: TGL) Project newsletter No. 2 - Report on recent news and activities from the project, the second year (linked to T5.1, T5.2)

D5.3: Project newsletter No 1 - Report on recent news and activities from the project, the first year

Deliverable 5.3 - DEC – PU – M12 (Owner: TGL) Project newsletter No. 1 - Report on recent news and activities from the project, the first year (linked to T5.1, T5.2)

Publicaciones

Conference proceedings (10)

Physics-Informed Intelligent Motor Fault Detection

Autores: Sinian Li, Raj Thilak Rajan, Edmund Marth, Patrick Zorn, Wolfgang Gruber, Justin Dauwels
Publicado en: 2025 33rd European Signal Processing Conference (EUSIPCO), 2025
Editor: IEEE
DOI: 10.23919/EUSIPCO63237.2025.11226351

Thermal Modeling of SiC Power Module: A CFD-Based Approach for Junction-to-Fluid Resistance Estimate

Autores: Jacopo Ferretti; Lorenzo Colombini; Mariano Nerone; Igor Valic; Filippo Ferrarese; Giacomo Piero Schiapparelli
Publicado en: 2025
Editor: VDE
DOI: 10.30420/566541305

Integrated Hall-Effect Broadband Current Sensor for SiC Traction Inverter

Autores: M. Mengozzi; G. P. Gibiino ;J. Ferretti ;M. Nerone ;I. Valic;F. Ferrarese;S. F. Syeda;M. Crescentini;P. A. Traverso
Publicado en: 2025
Editor: IEEE

Thermal Modeling of SiC Power Module: A CFD-Based Approach for Junction-to-Fluid Resistance Estimate

Autores: Jonathan Abdilla, Mario Fraubaum, Martin Kainz, Zlatko Hajdarevic, Debbie Claire Sanchez, Chris Scanlan
Publicado en: 2025
Editor: PCIM
DOI: 10.30420/566541156

Machine Learning Based Lifetime Prediction on p-GaN Gate HEMTs

Autores: Shuoyan Zhao, Raj Thilak Rajan, Andrea Natale Tallarico, Maurizio Millesimo, Vladislav Volosov, Antonio Imbruglia, and Justin Dauwels
Publicado en: 2025
Editor: SITB 2025

A Parameterizable Convolution Accelerator for Embedded Deep Learning Applications

Autores: Panagiotis Mousouliotis and Georgios Keramidas
Publicado en: 2025
Editor: IEEE Xplore
DOI: 10.48550/ARXIV.2602.04044

Intelligent Electrical Assessment of Silicon and Silicon Carbide Wafers for Power Applications in Automotive Field

Autores: F. Rundo et al
Publicado en: 2024
Editor: IEEE

Investigation into an NFC-Based Monitoring Sensor Node for Electric Motor: Compression Algorithms for Baud-Rate Constraints

Autores: Matteo Zauli, Igor Valič, Mariano Nerone, Jacopo Ferretti, Filippo Ferrarese, Luca De Marchi
Publicado en: 2025 IEEE International Workshop on Metrology for Automotive (MetroAutomotive), 2025, ISSN 2768-0366
Editor: IEEE
DOI: 10.1109/METROAUTOMOTIVE64646.2025.11119277

Common Mode Impedance Measurement of Three Phase Motors Using Pulse Frequency Response Analysis

Autores: Hassan Khanbabaei Gardeshi, A. Roch
Publicado en: 2025
Editor: EMC Europe conference

Influence of Transfer Molding Process on the Reliability of High Mass Epoxy Mold Compound Molded Package

Autores: Dong Hu, Niek van Haare, Albert van Driel, Shatavisha Biswas, Sten Vollebregt, Sebastiaan Kersjes
Publicado en: PCIM 2025, 2025
Editor: VDE VERLAG GMBH
DOI: 10.30420/566541156

Thesis and dissertations (1)

New Frontiers of Wide-Bandgap Semiconductors-Based Power Electronics: Novel Architectures and Reliability

Autores: Zainab Dahrouch
Publicado en: 2024
Editor: UNIME

Peer reviewed articles (3)

HTRB effects on threshold instability of 4H-SiC PowerMOSFET with carrots defects

Autores: L. Anoldo, G. Tosto, Z. Dahrouch, S. Bevilacqua, E. Schroer, S. Patanè, A. Russo
Publicado en: Microelectronics Reliability, Edición 170, 2025, ISSN 0026-2714
Editor: Elsevier BV
DOI: 10.1016/J.MICROREL.2025.115781

Measurement-based analysis of packaged X-Hall current sensors for automotive applications

Autores: Mattia Mengozzi, Sana Fatima Syeda, Jacopo Ferretti, Gian Piero Gibiino, Marco Crescentini, Pier Andrea Traverso
Publicado en: Measurement, 2025, ISSN 0263-2241
Editor: Elsevier BV
DOI: 10.1016/J.MEASUREMENT.2025.119559

ACM Computing Surveys

Autores: T. Anthimopoulos, G. Keramidas, V. Kelefouras, I. Stamoulis
Publicado en: Transaction of Embedded Computing Systems Journal, 2025, ISSN 0360-0300
Editor: Association for Computing Machinary, Inc.
DOI: 10.1145/3747183